Patent Application
20250167731
This disclosure relates to the field of temperature control structures, and in particular, to a temperature control apparatus and a related device.
Micro-electro-mechanical system (MEMS) components are a type of micro-component that is manufactured based on a semiconductor micro-processing technology and that has a movable mechanical structure and can implement mutual conversion between mechanical motion and an electrical signal, and have advantages of a small size, easy integration, low power consumption, high sensitivity, a low price, and the like. The MEMS components are widely used in fields of sensors, wireless communication, intelligent systems, and the like, such as MEMS gyroscopes, MEMS accelerometers, MEMS micro-mirrors, and MEMS oscillators. As a new type of clock component, the MEMS oscillators are gradually replacing crystal oscillators in fields of mobile phones, automobiles, wireless communication, and the like.
Oven-controlled MEMS oscillators (OCMOs) are a type of MEMS oscillator used in scenarios requiring high output frequency precision. The OCMO includes a MEMS resonator, a temperature sensor, a heater, and a feedback circuit. The MEMS resonator generates a periodic clock signal through mechanical oscillation. The temperature sensor captures a temperature of the MEMS resonator in real time. Then, the feedback circuit controls power of the heater, to stabilize the temperature of the resonator at a constant value, so as to suppress frequency drift of the resonator resulting from temperature drift.
Currently, a mainstream temperature measurement solution of the OCMO is to measure a temperature based on a modal frequency of the resonator or by using a resistance value as a temperature measurement indicator. However, in the existing solution, these temperature measurement indicators are susceptible to interference caused by ambient temperature fluctuation, and it is difficult to truly reflect the temperature of the MEMS resonator, resulting in low temperature measurement precision.
Embodiments of this disclosure provide a temperature control apparatus and a related device, so that impact of ambient temperature fluctuation on an internal component can be effectively suppressed, and temperature measurement precision can be improved.
According to a first aspect, embodiments of this disclosure provide a temperature control apparatus. The temperature control apparatus includes a first fastening structure, a second fastening structure, two first support beams, two second support beams, a fastening frame, and a target component. The first fastening structure and the target component are located on an inner side of the fastening frame. The second fastening structure is located on an outer side of the fastening frame. The first fastening structure is connected to the fastening frame through the two first support beams. The second fastening structure is connected to the fastening frame through the two second support beams. The target component is fastened to the first fastening structure. A temperature difference between a first connection position and a second connection position that are on the fastening frame and that are respectively for connection to the two first support beams is less than a first preset value.
In this implementation, a double-layer structure design is provided to isolate the target component from an external environment, so as to achieve better thermal isolation effect. The fastening frame located at an outer layer is directly in contact with the external environment, and temperature gradient distribution introduced by the external environment mainly exists on the fastening frame. The fastening structure located at an inner layer is connected to the fastening frame through the two support beams. The temperature difference between the two positions that are on the fastening frame and that are respectively for connection to the two support beams is less than the first preset value. In an implementation, temperatures of the two positions are completely equal. In other words, the fastening structure is connected to the two isothermal positions on the fastening frame. Therefore, the fastening structure is heated more uniformly. In this way, the fastening structure and the target component connected to the fastening structure can maintain relatively balanced temperatures, and impact of external ambient temperature fluctuation on the target component is reduced, so that temperature measurement precision is improved.
In some possible implementations, a third connection position and a fourth connection position on the fastening frame are respectively for connection to the two second support beams. The fastening frame includes a first sub-area, a second sub-area, a third sub-area, and a fourth sub-area. The first sub-area is located between the first connection position and the third connection position. The second sub-area is located between the second connection position and the third connection position. The third sub-area is located between the first connection position and the fourth connection position. The fourth sub-area is located between the second connection position and the fourth connection position. A ratio of a thermal resistance of the first sub-area to a thermal resistance of the third sub-area is a first ratio. A ratio of a thermal resistance of the second sub-area to a thermal resistance of the fourth sub-area is a second ratio. A difference between the first ratio and the second ratio is less than a second preset value. If this condition is met, it can be ensured that the temperature difference between the first connection position and the second connection position is less than the first preset value. In an implementation, the first ratio is equal to the second ratio, to ensure that the temperatures of the first connection position and the second connection position are completely equal. In this implementation, a specific implementation of determining the isothermal positions on the fastening frame is provided, which further ensures that the target component is not affected by external ambient temperature fluctuation.
In some possible implementations, the temperature control apparatus further includes a temperature adjustment element. The temperature adjustment element is configured to adjust temperatures of the fastening frame, the first fastening structure, and the target component. In this implementation, the temperature adjustment element actively adjusts the temperature, so that the target component can work in a specified temperature environment, to facilitate implementation of a specific function. For example, the target component is a resonator. Through temperature control, the resonator may output a clock signal at a stable frequency.
In some possible implementations, the temperature adjustment element is located on the second support beam, and a thermally conductive insulation layer is disposed between the temperature adjustment element and the second support beam; and/or the temperature adjustment element is located on the first support beam, and a thermally conductive insulation layer is disposed between the temperature adjustment element and the first support beam. In this implementation, a plurality of design positions of the temperature adjustment element is provided, which improves flexibility of this solution. In addition, the thermally conductive insulation layer is added, and a downward heat dissipation channel is provided, which increases an effective thermal conductivity coefficient, and improves the heating temperature resolution. In addition, using an example in which the temperature adjustment element is a heating resistor, a multi-layer structure design allows the heating resistor to be excessively thin and a resistance value to be excessively large when it is ensured that structural rigidity remains unchanged. In this solution, power consumption can be reduced under a same temperature rise.
In some possible implementations, a first voltage is loaded on the temperature adjustment element to perform heating, a second voltage loaded on the first support beam and/or the second support beam is conducted to the target component, and the first voltage is electrically isolated from the second voltage. In this implementation, the thermally conductive insulation layer may implement heat conduction but is electrically isolated. Therefore, on the basis of ensuring that a temperature adjustment function is normal, a heating voltage loaded on the temperature adjustment element is separated from the voltage loaded on the target component, so that heating voltage resolution can be improved, to implement higher heating temperature resolution without affecting a function of the target component.
In some possible implementations, the temperature control apparatus further includes a temperature measurement element. The temperature measurement element is located on the inner side of the fastening frame and is fastened to the first fastening structure. The temperature measurement element is configured to detect a temperature of the target component. In this implementation, the temperature of the target component may be detected by using the temperature measurement element, to monitor a temperature change of the target component in real time.
In some possible implementations, the target component is a first resonator, and the first resonator includes a clock working mode and a temperature measurement working mode. When the first resonator is in the clock working mode and a temperature of the first resonator is within a target range, the first resonator outputs a clock signal at a stable frequency. When the first resonator is in the temperature measurement working mode, a temperature measurement signal output by the first resonator indicates a temperature of the first resonator. In this implementation, the first resonator may work in both the clock working mode and the temperature measurement working mode, and feed back the temperature by using the signal output in the temperature measurement working mode, so that the temperature of the first resonator is within the target range through temperature control, to output the clock signal at a stable frequency in the clock working mode. Temperature feedback and clock signal output are implemented by using characteristics of the resonator, and the temperature measurement element does not need to be disposed, which shows better practical effect.
In some possible implementations, the temperature control apparatus further includes a second resonator, and the second resonator is located on the inner side of the fastening frame and is fastened to the first fastening structure. The first resonator is in the clock working mode, and the second resonator is in the temperature measurement working mode; or the first resonator is in the temperature measurement working mode, and the second resonator is in the clock working mode. In this implementation, the two resonators may alternatively be disposed. The two resonators are in different working modes, to implement temperature feedback and clock signal output through cooperation, which enhances expansibility of this solution.
In some possible implementations, types of the first resonator include a MEMS resonator, a crystal resonator, and a crystal MEMS resonator, which expands application scenarios of this solution.
In some possible implementations, the second support beam includes a connection beam and a connection frame. The fastening frame is located on an inner side of the connection frame and is connected to the connection frame. One end of the connection beam is connected to the second fastening structure. The other end of the connection beam is connected to the connection frame. A temperature difference between two connection positions that are on the connection frame and that are for connection to the fastening frame is less than the first preset value. In this implementation, the connection frame may be considered as an outer layer structure, the fastening frame may be considered as an intermediate layer structure, and the fastening structure may be considered as an inner layer structure, to form a three-layer thermal isolation structure, which has better thermal isolation effect.
In some possible implementations, the first fastening structure is a frame structure, so that stability of the structure is better.
In some possible implementations, the temperature control apparatus further includes a substrate layer. The second fastening structure is fastened to the substrate layer, and the fastening frame, the first fastening structure, and the target component are suspended on the substrate layer. In this implementation, a specific implementation of processing and fastening the temperature control apparatus is provided, which improves practicability of this solution.
In some possible implementations, the temperature control apparatus further includes a substrate layer and a base. A partial structure of each of the first fastening structure, the second fastening structure, and the fastening frame is located at the substrate layer, the second fastening structure is fastened to the base, and the fastening frame, the first fastening structure, and the target component are suspended on the base. In this implementation, another specific implementation of processing and fastening the temperature control apparatus is provided, which extends application scenarios of this solution.
According to a second aspect, an embodiment of this disclosure provides a temperature-compensated oscillator. The temperature-compensated oscillator includes a temperature compensation module and the temperature control apparatus described in any one of the implementations of the first aspect. A target component in the temperature control apparatus is a resonator. Specifically, the resonator is configured to output an original clock signal to the temperature compensation module. The temperature compensation module is configured to obtain a temperature of the resonator, and adjust the original clock signal based on the temperature to obtain a target clock signal at a stable frequency.
In some possible implementations, the resonator is further configured to output a temperature measurement signal to the temperature compensation module. The temperature compensation module is further configured to obtain the temperature of the resonator based on the temperature measurement signal.
In some possible implementations, the temperature control apparatus includes a temperature measurement element. The temperature measurement element is configured to detect the temperature of the resonator. The temperature compensation module is further configured to obtain the temperature of the resonator by using the temperature measurement element.
According to a third aspect, an embodiment of this disclosure provides an oven-controlled oscillator. The oven-controlled oscillator includes a controller and the temperature control apparatus described in any one of the implementations of the first aspect. A target component in the temperature control apparatus is a resonator, and the temperature control apparatus includes a temperature adjustment element. Specifically, the controller is configured to obtain an original temperature of the resonator, and control the temperature adjustment element based on the original temperature to adjust the original temperature to a target temperature. When the first resonator is in a clock working mode and the first resonator is at the target temperature, the first resonator outputs a clock signal at a stable frequency.
In some possible implementations, the resonator is configured to output a temperature measurement signal to the controller. The controller is further configured to obtain the original temperature of the resonator based on the temperature measurement signal.
In some possible implementations, the temperature control apparatus includes a temperature measurement element, and the temperature measurement element is configured to detect the original temperature of the resonator. The controller is further configured to obtain the original temperature of the resonator by using the temperature measurement element.
In embodiments of this disclosure, a double-layer structure design is provided to isolate a target component from an external environment, so as to achieve better thermal isolation effect. A fastening frame located at an outer layer is directly in contact with the external environment, and temperature gradient distribution introduced by the external environment mainly exists on the fastening frame. A fastening structure located at an inner layer is connected to the fastening frame through two support beams. A temperature difference between two positions that are on the fastening frame and that are respectively for connection to the two support beams is less than a first preset value. In other words, the fastening structure is connected to the two isothermal positions on the fastening frame. Therefore, the fastening structure is heated more uniformly. In this way, the fastening structure and the target component connected to the fastening structure can maintain relatively balanced temperatures, and impact of external ambient temperature fluctuation on the target component is reduced, so that temperature measurement precision is improved.
Embodiments of this application provide a temperature control apparatus and a related device, so that impact of ambient temperature fluctuation on an internal component can be effectively suppressed, and temperature measurement precision can be improved. In the specification, claims, and accompanying drawings of this application, the terms “first”, “second”, and so on (if any) are intended to distinguish between similar objects but do not necessarily indicate a specific order or sequence. It should be understood that data termed in such a way are interchangeable in proper circumstances so that embodiments of the present disclosure described herein can be implemented in orders other than the order illustrated or described herein. In addition, the terms “include”, “have”, and any other variant thereof are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or device that includes a list of steps or units is not necessarily limited to those steps or units that are expressly listed, but may include other steps or units that are not expressly listed or are inherent to the process, method, system, product, or device.
It should be noted that a specific implementation of the fastening structure 20 is not limited in this application. For example, the fastening structure 20 may be a frame structure shown in
It should be further noted that a specific quantity of support beams 50 and a specific quantity of support beams 60 are not limited in this application. In some possible implementations, two support beams form a group, and a plurality of groups of support beams 50 and a plurality of groups of support beams 60 may be further disposed. In addition, specific implementations of the support beam 50 and the support beam 60 are also not limited in this application. For example, the support beam 50 and the support beam 60 may be straight beams or folded beams.
It should be further noted that a specific type of the target component 10 is not limited in this application. For example, the target component 10 may be a resonator, a gyroscope, an accelerometer, a micro-mirror, or the like. For ease of description, the following mainly uses an example in which the target component 10 is a resonator for description. Types of the resonator include but are not limited to a MEMS resonator, a crystal resonator, a crystal MEMS resonator, and the like.
In this application, to avoid impact of external ambient temperature fluctuation on the target component 10 to a greatest extent, a double-layer structure is designed to encircle the target component 10, so as to achieve thermal isolation effect. The fastening frame 30 may be considered as an outer layer structure, or may be briefly referred to as an “outer frame”. The fastening structure 20 may be considered as an inner layer structure. If the fastening structure 20 is also designed as a frame, the fastening structure 20 may be briefly referred to as an “inner frame”. It should be understood that the fastening frame 30 is directly in contact with an external environment, and is affected by external ambient temperature fluctuation. Heat is transferred between the fastening frame 30 and the fastening structure 20 through the support beam 50. If a temperature difference between the two support beams 50 is large, heating uniformity on the fastening structure 20 and the target component 10 connected to the fastening structure 20 is also affected. Therefore, based on a double-layer structure design, in this application, two isothermal positions on the fastening frame 30 are selected to be connected to the support beams 50, so that the fastening structure 20 and the target component 10 are heated more uniformly, and impact of external ambient temperature fluctuation on the target component 10 is further reduced.
It should be noted that, in actual application, the fastening structure 40 is usually used as an anchor to fasten the entire temperature control apparatus.
It should be understood that there is not only one group of isothermal positions on the fastening frame 30.
It should be further understood that each of the foregoing isothermal positions has a specific length. The connection position B in
It should be noted that, in actual application, temperatures of the foregoing two isothermal positions are not necessarily required to be completely equal. The two connection positions may be considered as isothermal positions provided that a temperature difference between the two connection positions is less than a first preset value. Each of the two connection positions has specific temperature distribution. Therefore, the temperature difference between the two connection positions may be a temperature difference between respective average temperatures of the two connection positions. In a possible implementation, the first preset value may be set with reference to temperature distribution ranges of the connection position B and the connection position D. For example, the temperature distribution ranges of the connection position B and the connection position D are both 1 mK, but temperatures of the two connection positions are not equal. If the temperature difference between the two connection positions is less than 1 mK, the two connection positions may be considered as isothermal positions. In an implementation, the temperatures of the two isothermal positions are completely equal.
The following describes a specific implementation of determining the isothermal positions.
In a possible implementation, four connection positions on the fastening frame 30 are for connection to the support beams 50 and the support beams 60, and the fastening frame 30 may be divided into four sub-areas by using the four connection positions as boundary points. If thermal resistances of the four areas meet a specified condition, two positions that are on the fastening frame 30 and that are for connection to the support beams 50 may be considered as isothermal positions, which is equivalent to providing a specific implementation of determining the isothermal positions. Specifically,
In an implementation, the support beam 60, the temperature adjustment element 70, and the thermally conductive insulation layer 80 form a three-layer structure. Specifically, the support beam 60 is made of monocrystalline silicon, the thermally conductive insulation layer 80 is made of aluminum nitride (AlN), and the temperature adjustment element 70 is made of a semiconductor material. The semiconductor material includes but is not limited to amorphous silicon, polycrystalline silicon, germanium silicon, and the like. Theoretically, for a heating resistor made of a material whose resistivity is ρe and whose thermal conductivity coefficient is 2, heating temperature resolution of the heating resistor is irrelevant to a structural design, and only complies with a formula
U is a heating voltage, and dU is heating voltage resolution. In this application, the thermally conductive insulation layer is added, and a downward heat dissipation channel is provided, which increases an effective thermal conductivity coefficient λeff, and improves the heating temperature resolution. In addition, a multi-layer structure design allows the heating resistor to be excessively thin and a resistance value to be excessively large when it is ensured that structural rigidity remains unchanged. Therefore, based on a power consumption formula
it can be learned that in this solution, power consumption can be reduced under a same temperature rise.
In conclusion, an advantage of a three-layer structure material provided in this implementation is that the downward heat dissipation channel is added for the heating resistor, which improves an effective heat dissipation coefficient. In addition, a resistance value of the heating resistor made of the semiconductor material is larger, which can effectively reduce power consumption. Compared with a solution in which the three-layer structure is entirely made of monocrystalline silicon and a solution in which the heating resistor is made of a metal material, this implementation has significant beneficial effect. The following further describes this implementation with reference to a simulation comparison diagram.
It can be learned that a heating temperature resolution in the solution 1 provided in this application is approximately 27 times higher than that in the solution 2, and is approximately 7 times higher than that in the solution 3. Power consumption of the solution 1 provided in this application is approximately 800 times better than that of the solution 2, and is approximately 68 times better than that of the solution 3.
It should be understood that, in actual application, the three-layer structure may alternatively be made of another material. This is not specifically limited herein. For example, the temperature adjustment element 70 may alternatively be made of a conductor material.
It should be noted that, in a scenario in which the target component 10 is a resonator, temperature measurement may alternatively be implemented by using a temperature measurement working mode of the resonator, and the temperature measurement element does not need to be separately configured. In addition to the temperature measurement working mode, the resonator further has a clock working mode. For example, the temperature measurement working mode includes but is not limited to a square extensional (SE) working mode, and the clock working mode includes but is not limited to a Lamé mode. It should be understood that the resonator outputs signals at different frequencies in different working modes. In actual application, the resonator may work in any one of the working modes according to a requirement, or the resonator may work in the two working modes at the same time. The following describes in detail the two working modes of the resonator.
In actual application, the resonator may output a clock signal at a stable frequency based on the two working modes of the resonator and in cooperation with a temperature adjustment element. Specifically, a temperature may be first calibrated based on a frequency of a signal output in the temperature measurement working mode, and then the temperature adjustment element is controlled to adjust a temperature of the resonator based on the detected temperature, so as to control the temperature of the resonator within a target range. In this way, it can be ensured that the resonator outputs the clock signal at a stable frequency. The target range is a temperature range near an inflection point in the clock working mode. The target range is subject to actual application, and is not limited herein.
In some possible implementations, the temperature control apparatus may alternatively include two resonators, and the two resonators work in different working modes. Same effect may also be achieved through cooperation of the two resonators, which extends application scenarios of this solution. The following provides several specific implementations in which the two resonators are used.
In some possible implementations, on the basis of the foregoing double-layer structure, the foregoing temperature control apparatus may be further extended to a structure of more layers. After isolation of a multi-layer structure, temperature uniformity on the target component 10 can be better maintained. The following uses an example in which the foregoing temperature control apparatus is extended to a three-layer structure for description.
In a scenario in which the target component 10 is a resonator, both a MEMS resonator and a crystal MEMS resonator may be directly used in any one of the foregoing embodiments. The MEMS resonator and the crystal MEMS resonator may usually be connected to the fastening structure 20 through a connection rod. For a crystal resonator, due to different manufacturing technologies, the crystal resonator is usually bonded to the fastening structure 20. Except that, other features are similar to those in the foregoing embodiments, and details are not described herein again. The following provides some accompanying drawings to show implementations of using the crystal resonator in the foregoing temperature control apparatus.
In some possible implementations, the temperature control apparatus may be formed through processing of silicon-on-insulator (SOI). The temperature control apparatus includes a component layer, an insulation layer, and a substrate layer, and the insulation layer is located between the component layer and the substrate layer. It should be understood that materials of the component layer and the substrate layer include but are not limited to silicon, polycrystalline silicon, and silicon carbide, and materials of the insulation layer include but are not limited to silicon dioxide and silicon nitride. For different types of resonators, specific processing manners may also be different, which are separately described below.
In an example, a MEMS resonator, the fastening structure 20, the fastening frame 30, and the fastening structure 40 are all located at the component layer, and the fastening structure 40 is fastened to the substrate layer. A hollow area may be designed on the substrate layer, and the MEMS resonator, the fastening structure 20, and the fastening frame 30 may all be suspended on the hollow area. It should be understood that this example is mainly applicable to a scenario of the MEMS resonator.
In another example, if a crystal resonator is used, a part of each of the fastening structure 20, the fastening frame 30, and the fastening structure 40 is located at the substrate layer. That is, this example is different from the foregoing example in which the MEMS resonator is used in that the substrate layer is further used to manufacture the fastening structure 20, the fastening frame 30, and the fastening structure 40. Further, the fastening structure 40 is configured to be fastened to a base, so that the crystal resonator, the fastening structure 20, and the fastening frame 30 are in a suspended state. It should be understood that, in some possible scenarios, the fastening structure 40 may be fastened to a package tube shell. It should be understood that a specific design manner of the component layer is not limited in this example, and this example may be applicable to scenarios of the MEMS resonator and the crystal resonator.
Based on the foregoing description of the temperature control apparatus, it can be learned that this application provides a double-layer structure design to isolate a target component from an external environment, so as to achieve better thermal isolation effect. A fastening frame located at an outer layer is directly in contact with the external environment, and temperature gradient distribution introduced by the external environment mainly exists on the fastening frame. A fastening structure located at an inner layer is connected to the fastening frame through two support beams. A temperature difference between two positions that are on the fastening frame and that are respectively for connection to the two support beams is less than a first preset value. In other words, the fastening structure is connected to the two isothermal positions on the fastening frame. Therefore, the fastening structure is heated more uniformly. In this way, the fastening structure and the target component connected to the fastening structure can maintain relatively balanced temperatures, and impact of external ambient temperature fluctuation on the target component is reduced, so that temperature measurement precision is improved.
The foregoing describes the temperature control apparatus provided in this application. If the target component is a resonator, the temperature control apparatus may be further used in a scenario of an oscillator. The oscillator includes an oven-controlled oscillator and a temperature-compensated oscillator. Specifically, the oven-controlled oscillator may be an OCMO using a MEMS resonator, or may be an oven-controlled crystal oscillator (OCXO) using a crystal resonator. The temperature-compensated oscillator may be a temperature-compensated MEMS oscillator (TCMO) using a MEMS resonator, or may be a temperature-compensated crystal oscillator (TCXO) using a crystal resonator. It should be understood that the oven-controlled oscillator provides a clock signal at a stable frequency through active temperature adjustment. The temperature-compensated oscillator algorithmically compensates for, by using a temperature compensation module, frequency drift resulting from temperature drift, to implement a clock signal at a stable frequency.
The following separately describes specific implementations of the oven-controlled oscillator and the temperature-compensated oscillator.
In a possible implementation, as shown in
In another possible implementation, the temperature control apparatus may further include a temperature measurement element (not shown in the accompanying drawing herein), and the temperature measurement element detects the original temperature of the resonator and feeds back the original temperature to the controller.
In a possible implementation, as shown in
In another possible implementation, the temperature control apparatus may further include a temperature measurement element (not shown in the accompanying drawing herein), and the temperature measurement element detects the temperature of the resonator and feeds back the temperature to the temperature compensation module.
It should be understood that, the temperature control apparatus of a double-layer design provided in this application ensures that the resonator is in a state of high temperature uniformity. Therefore, a temperature difference sensed between the temperature measurement working mode and the clock working mode of the resonator is small. Therefore, in the temperature measurement working mode, a temperature of the clock working mode may be measured with high precision, which helps the resonator output a clock signal at a more stable frequency.
It should be noted that the foregoing embodiments are only used to describe the technical solutions of this application, but not to limit the technical solutions. Although this application is described in detail with reference to the foregoing embodiments, persons of ordinary skill in the art should understand that they may still make modifications to the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features thereof, without departing from the spirit and the scope of the technical solutions of the embodiments of this application.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202210912613.7 | Jul 2022 | CN | national |
This is a continuation of Int'l Patent App. No. PCT/CN2023/098306, filed on Jun. 5, 2023, which claims priority to Chinese Patent App. No. 202210912613.7, filed on Jul. 30, 2022, which are incorporated by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2023/098306 | Jun 2023 | WO |
| Child | 19027767 | US |
