Temperature controlled compartment apparatus and method of controlling temperature

Information

  • Patent Grant
  • 6679065
  • Patent Number
    6,679,065
  • Date Filed
    Monday, August 5, 2002
    21 years ago
  • Date Issued
    Tuesday, January 20, 2004
    20 years ago
Abstract
A temperature controlled apparatus comprises a reversible solid state device having a first section and a second section; portions of the first and the second sections are disposed in intimate contact. The first section is disposed adjacent to a portion of an external wall surface of a compartment and the second section is disposed adjacent to a portion of an internal wall surface of the compartment. A compartment fan is disposed within the compartment. The reversible solid state device and the compartment fan are coupled to a controller. The controller is configured to modify a compartment air temperature inside the compartment by controlling the reversible solid state device and the compartment fan to flow a compartment air across the second section. The controller is configured to control the reversible solid state device and the compartment fan in at least one temperature operational mode.
Description




BACKGROUND




This invention relates generally to refrigerators, and more particularly, to a temperature controlled compartment disposed in the refrigerators.




Temperature controlled compartments are typically cooled by, but are not limited to, a simple vapor compression cycle. The simple vapor compression cycle typically includes a compressor, a condenser, an expansion device, and an evaporator connected in series and charged with a refrigerant. The evaporator is a specific type of heat exchanger that transfers heat from air passing over the evaporator to refrigerant flowing through the evaporator, thereby causing the refrigerant to vaporize. The cooled air is then used to refrigerate one or more freezer or fresh food compartments.




Household refrigerators typically operate on a simple vapor compression cycle. Such a cycle typically includes a compressor, a condenser, an expansion device, and an evaporator connected in series and charged with a refrigerant. The evaporator is a specific type of heat exchanger that transfers heat from air passing over the evaporator to refrigerant flowing through the evaporator, thereby causing the refrigerant to vaporize. The cooled air is then used to refrigerate one or more freezer or fresh food compartments.




Household refrigerators are expected to operate over a range of ambient temperatures, typically from about 55° F. to about 90° F. System users are typically supplied control knobs to adjust Fresh Food and Freezer compartment temperatures. At each combined setting of the control knobs, there is a target set of Fresh Food and Freezer temperatures that an ideal refrigerator should achieve, independent of ambient conditions. Different hardware and control strategies attempt to approximate this ideal performance matrix.




Typically, a control device is used to regulate airflow to the fresh food compartment to account for the changing load split between freezer and fresh food sections. During high ambient temperature and frequent fresh food access, more airflow to the fresh food section is required to maintain target temperatures. Manual damper air control cannot automatically compensate for changing loads and is prone to customer misadjustment. Motorized damper airflow modulation, powered by a system controller, is prone to malfunction (i.e. freeze up) and may cause adverse temperature gradients during low ambient operation.




Accordingly, there is a need in the art for an improved refrigeration system for achieving ideal performance temperatures of temperature controlled compartments.




BRIEF SUMMARY




A temperature controlled apparatus comprises a reversible solid state device having a first section and a second section; portions of the first and the second sections are disposed in intimate contact. The first section is disposed adjacent to a portion of an external wall surface of a compartment and the second section is disposed adjacent to a portion of an internal wall surface of the compartment. A compartment fan is disposed within the compartment. The reversible solid state device and the compartment fan are coupled to a controller. The controller is configured to modify a compartment air temperature inside the compartment by controlling the reversible solid state device and the compartment fan to flow a compartment air across the second section. The controller is configured to control the reversible solid state device and the compartment fan in at least one temperature operational mode.











DRAWINGS




These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:





FIG. 1

is a cross sectional view of the temperature controlled compartment in accordance with one embodiment of the present invention;





FIG. 2

is a cross sectional view of the temperature controlled compartment with a first section cover in accordance with another embodiment of the present invention;





FIG. 3

is a cross sectional view of the temperature controlled compartment with a first section cover and a first section cover fan in accordance with another embodiment of the present invention;





FIG. 4

is a cross sectional view of the temperature controlled compartment with an internal compartment and an external compartment in accordance with another embodiment of the present invention;





FIG. 5

is a cross sectional view of the temperature controlled compartment with an internal compartment, an external compartment, and an external airflow path in accordance with another embodiment of the present invention;





FIG. 6

is a cross sectional view of the temperature controlled compartment with an internal compartment, an external compartment, an external airflow path, and an external compartment fan in accordance with another embodiment of the present invention;





FIG. 7

is a cross sectional view of the temperature controlled compartment with an internal compartment, an external compartment, a combined external wall duct, an external airflow path, and an internal compartment fan in accordance with another embodiment of the present invention;





FIG. 8

is a partial three dimensional cross sectional view of the temperature controlled compartment with an internal compartment, an external compartment, an external wall ventilation duct, an external airflow path, and an internal compartment fan in accordance with another embodiment of the present invention;





FIG. 9

is a cross sectional view of the temperature controlled compartment with an internal compartment, an external compartment, a combined external wall duct, an external airflow path, an external compartment fan, and an internal compartment fan in accordance with another embodiment of the present invention;





FIG. 10

is a partial three dimensional cross sectional view of the temperature controlled compartment with an internal compartment, an external compartment, an external wall ventilation duct, an external airflow path, an external compartment fan, and an internal compartment fan in accordance with another embodiment of the present invention;





FIG. 11

is a block diagram of the inputs and outputs to a controller in accordance with another embodiment of the present invention; and





FIG. 12

is a block diagram of the inputs and outputs to a controller in accordance with another embodiment of the present invention.











DESCRIPTION





FIG. 1

provides a partial cut-away cross sectional view of a temperature controlled apparatus


1000


comprising a compartment


10


, a reversible solid state device


20


, a compartment fan


30


, and a controller


40


. The reversible solid state device


20


has a first section


50


and a second section


60


, and a portion of the first section


50


and a portion of the second section


60


are disposed in intimate contact. The first section


50


is disposed adjacent to a portion of an external wall surface


65


of the compartment


10


and the second section


60


is disposed adjacent to a portion of an internal wall surface


70


of the compartment


10


. The compartment fan


30


is disposed within the compartment


10


. The reversible solid state device


20


and the compartment fan


30


are coupled to the controller


40


as shown in FIG.


11


. The controller


40


is configured to modify a compartment air temperature inside the compartment


10


of

FIG. 1

by controlling the reversible solid state device


20


and the compartment fan


30


to flow a compartment air


80


across the second section


60


. The controller


40


of

FIG. 11

is configured to control the reversible solid state device


20


of FIG.


1


and the compartment fan


30


in at least one temperature operational mode.




As used herein, the term “at least one temperature operational mode” relates to at least one of a cooling mode, a heating mode, and combinations thereof.




As used herein, the terms “disposed on”, “disposed from”, “disposed to”, “disposed over”, “disposed above” and the like are used to refer to relative locations of items illustrated in the drawings and do not imply structural or operational limitations in the assembled device.




In one embodiment of the present invention, the compartment fan


30


of

FIG. 1

is selected from the group consisting of discreet speed controllable fans, continuous speed fans, variable speed fans, and combinations thereof.




In one embodiment of the present invention, the temperature controlled apparatus


1000


of

FIG. 1

is disposed in a temperature controlled device


110


. The temperature controlled device


110


is selected from the group consisting of an internal freezer compartment, a door mounted freezer compartment, an internal refrigerator compartment, a door mounted refrigerated compartment land combinations thereof.




In one embodiment of the present invention, the temperature controlled device


110


of

FIG. 1

further comprises a main temperature controlled portion


120


. The first section


50


of the reversible solid state device


20


is disposed to contact a temperature controlled air


160


that is disposed in the main temperature controlled portion


120


.




In one embodiment of the present invention, the temperature controlled apparatus


1000


of

FIG. 2

further comprises a compartment thermistor


90


disposed in the compartment


10


to contact the compartment air


80


. The compartment thermistor


90


is coupled to the controller


40


of FIG.


11


. In one embodiment of the present invention, the controller


40


is configured to control the compartment air temperature using data acquired from the compartment thermistor


90


.




In one embodiment of the present invention, the temperature controlled device


110


of

FIG. 2

further comprises a temperature control device fan


240


that is disposed in the main temperature control portion


120


. The temperature control device fan


240


is coupled to the controller


40


of FIG.


11


. The temperature control device fan


240


is disposed to draw the temperature controlled air


160


of

FIG. 2

across the first section


50


of the reversible solid state device


20


.




In a specific embodiment of the present invention, the temperature control device fan


240


of

FIG. 2

is selected from the group consisting of discreet speed controllable fans, continuous speed fans, variable speed fans, and combinations thereof.




In one embodiment of the present invention, the temperature controlled device


110


of

FIG. 2

further comprises a first section cover


130


having a first section cover inlet


140


and a first section cover outlet


150


. The first section cover


130


is disposed over the first section


50


of the reversible solid state device


20


. The first section cover inlet


140


is disposed to draw in the temperature controlled air


160


from the main temperature controlled portion


120


. The first section cover outlet


150


is disposed to exhaust the temperature controlled air


160


to the main temperature controlled portion


120


after the temperature controlled air


160


passes over the first section


50


of the reversible solid state device


20


.




In one embodiment of the present invention, the temperature control device fan


240


of

FIG. 2

is disposed to draw a portion of the temperature controlled air


160


through the first section cover inlet


140


, across the first section


50


of the reversible solid state device


20


and exhaust the temperature controlled air


160


through the first section cover exhaust


150


. The temperature control device fan


240


is also disposed to direct another portion of the temperature controlled air


160


over the temperature controlled device thermistor


250


.




In one embodiment of the present invention, the temperature controlled apparatus


1000


further comprises a compartment door


320


of

FIG. 2

that is disposed to provide a user access to the compartment


10


.




In one embodiment of the present invention, the temperature controlled apparatus


1000


of

FIG. 3

further comprises a temperature control device thermistor


250


disposed in the temperature control device


110


. The temperature control device thermistor


250


is disposed to contact a temperature controlled air


160


. The temperature control device thermistor


250


is spaced apart from the compartment


10


. The temperature control device thermistor


250


is coupled to the controller


40


of FIG.


11


. The controller


40


is configured to control the compartment air temperature using data acquired from the temperature control device thermistor


250


.




In one embodiment of the present invention, the temperature controlled apparatus


1000


of

FIG. 3

further comprises an ambient air thermistor


260


. The ambient air thermistor


260


is disposed on a portion of an external wall


280


of the temperature control device


110


. The ambient air thermistor


260


is disposed to be spaced apart from the compartment


10


. The ambient air thermistor


260


is coupled to the controller


40


of FIG.


11


. The controller


40


is configured to control the compartment air temperature using data acquired from the ambient air thermistor


260


.




In one embodiment of the present invention, the temperature controlled apparatus


1000


of

FIG. 3

further comprises a first section cover fan


170


disposed between the first section cover


130


and the external wall surface


65


of the compartment


10


. The first section cover fan


170


is coupled to the controller


40


of FIG.


11


. The first section cover fan


170


is disposed to draw the temperature controlled air


160


of FIG.


3


through the first section cover inlet


140


, across the first section


50


of the reversible solid state device


20


, and exhaust the temperature controlled air


160


through the first section cover exhaust


150


.




In one embodiment of the present invention, the first section cover fan


170


of

FIG. 3

is selected from the group consisting of discreet speed controllable fans, continuous speed fans, variable speed fans, and combinations thereof.




In another embodiment of the present invention, the compartment


10


of

FIG. 4

of the temperature controlled apparatus


1000


comprises an internal compartment


200


and an external compartment


210


. The temperature controlled apparatus


1000


further comprises the reversible solid state device


20


, an internal compartment fan


225


, and the controller


40


of FIG.


12


. The internal compartment


200


of FIG.


4


and the external compartment


210


are disposed to share a portion of a common wall


220


. The internal compartment


200


comprises an internal wall


270


that is disposed to a portion of the main temperature controlled portion


120


of the temperature controlled device


110


.




The external compartment


210


is spaced apart from the main temperature controlled portion


120


of the temperature controlled device


110


. The reversible solid state device


20


has the first section


50


and the second section


60


. A portion of the first section


50


and a portion of the second section


60


are disposed in intimate contact. The first section


50


of the reversible solid state device


20


is disposed in the external compartment


210


adjacent to a portion of a common wall external surface


224


on the common wall


220


. The second section


60


of the reversible solid state device


20


is disposed in the internal compartment


200


adjacent to a portion of a common wall internal surface


222


on the common wall


220


.




The internal compartment fan


225


is disposed in the internal compartment


200


. An internal compartment airflow direction


86


is depicted in FIG.


4


. The reversible solid state device


20


and the internal compartment fan


225


are coupled to the controller


40


of FIG.


12


. The controller


40


is configured to modify an internal compartment air temperature inside the internal compartment


200


of

FIG. 4

by controlling the reversible solid state device


20


and the internal compartment fan


225


to flow an internal compartment air


85


across the second section


60


. The controller


40


is configured to control the reversible solid state device


20


and the internal compartment fan


225


in at least one temperature operational mode.




In one specific embodiment of the present invention, the heat given off by the first section


50


to the external compartment


210


is then transmitted to the external wall


280


by conduction as shown in FIG.


4


. In another specific embodiment of the present invention not shown in

FIG. 4

, the first section


50


is disposed in direct contact to the external wall


280


.




In another embodiment of the present invention, the temperature controlled apparatus


1000


of

FIG. 4

further comprises the temperature control device thermistor


250


disposed in the main temperature controlled portion


120


of the temperature control device


110


to contact the temperature controlled air


160


. The temperature control device thermistor


250


is spaced apart from the internal compartment


200


and the external compartment


210


and the temperature control device thermistor


250


is coupled to the controller


40


of FIG.


12


. The controller


40


is configured to control the internal compartment air temperature using data acquired from the temperature control device thermistor


250


.




In another embodiment of the present invention, the temperature controlled apparatus


1000


further comprises an internal compartment thermistor


340


of

FIG. 4

disposed in the internal compartment


200


to contact the internal compartment air


85


. The internal compartment thermistor


340


is coupled to the controller


40


of FIG.


12


. The controller


40


is configured to control the internal compartment air temperature using data acquired from the internal compartment thermistor


340


.




In another embodiment of the present invention, the temperature controlled apparatus


1000


further comprises an internal compartment door


330


of

FIG. 4

that is disposed to provide a user access to the internal compartment


200


.




In another embodiment of the present invention, the external compartment


210


of

FIG. 5

of the temperature controlled apparatus


1000


comprises the external wall


280


. The external wall


280


comprises an external wall inlet


290


and an external wall outlet


300


. The external wall inlet


290


is disposed to draw in an external air


310


from outside the external compartment


210


. The external wall outlet


300


is disposed to exhaust the external air


310


to outside of the external compartment


210


after passing the external air


310


over the first section


50


of the reversible solid state device


20


. The external airflow direction


315


in one embodiment of the present invention is depicted in FIG.


5


.




In one specific embodiment of the present invention, the internal compartment fan


225


of

FIG. 5

is selected from the group consisting of discreet speed controllable fans, continuous speed fans, variable speed fans, and combinations thereof.




In a specific embodiment of the present invention, the external compartment


210


of

FIG. 6

of the temperature controlled apparatus


1000


further comprises an external compartment fan


230


. The external compartment fan


230


is coupled to the controller


40


of FIG.


12


. The external compartment fan


230


is disposed to draw the external air


310


through the external wall inlet


290


, across the first section


50


of the reversible solid state device


20


and exhaust the external air


310


through the external wall outlet


300


. The external airflow direction is depicted as


315


.




In another embodiment of the present invention, the external compartment fan


230


of

FIG. 6

is selected from the group consisting of discreet speed controllable fans, continuous speed fans, variable speed fans, and combinations thereof.




In another embodiment of the present invention, the temperature controlled apparatus


1000


of

FIG. 6

further comprises the temperature control device fan


240


coupled to the controller


40


of FIG.


12


. The temperature control device fan


240


is disposed on the common wall internal surface


222


and is spaced apart from the internal compartment


200


. The temperature control device fan


240


is configured to blow the temperature controlled air


160


over a surface of the internal compartment


200


.




In another embodiment of the present invention, the temperature controlled apparatus


1000


of

FIG. 6

further comprises the ambient air thermistor


260


coupled to the controller


40


of FIG.


12


. The ambient air thermistor


260


is disposed on the common wall internal wall surface


222


of FIG.


6


. The ambient air thermistor


260


operates as discussed above with respect to FIG.


3


.




In another embodiment of the present invention, the temperature controlled apparatus


1000


as shown in

FIGS. 7 and 8

comprises an external airflow divider


350


and an external wall ventilation duct


360


. The external Wall inlet


290


and the external wall outlet


300


are disposed in the external wall ventilation duct


360


. The external airflow divider


350


is disposed between the first section


50


and the external wall


280


. The external wall ventilation duct


360


and the external airflow divider


350


are disposed so as to draw the external air


310


down past a portion of the first section


50


, around one end of the external airflow divider


350


, and up past another portion of the second section


60


. The external airflow direction is depicted as


315


.




In another embodiment of the present invention, the temperature controlled apparatus


1000


as shown in

FIGS. 9 and 10

comprises an embodiment of the present invention as discussed above in

FIGS. 7 and 8

with the addition of the external compartment fan


230


. The external wall inlet


290


and the external wall outlet


300


are disposed in the external wall ventilation duct


360


as discussed above with respect to

FIGS. 7 and 8

. The external airflow divider


350


is disposed between the first section


50


and the external wall


280


. The external wall ventilation duct


360


, the external airflow divider


350


, and the external compartment fan


230


are disposed so as to draw the external air


310


down past a portion of the first section


50


, around one end of the external airflow divider


350


, and up past another portion of the first section


50


.




In one embodiment of the present invention, the controller


40


of

FIG. 11

is configured to change an electrical polarity of an electrical power supply


180


to the reversible solid state device


20


to switch from the cooling,mode to the heating mode. In another embodiment of the present invention, the controller


40


is configured to change an electrical polarity of the electrical power supply


180


to the reversible solid state device


20


to switch from the heating mode to the cooling mode.




In one embodiment of the present invention, the controller


40


of

FIGS. 11 and 12

is configured to vary the voltage supplied to the reversible solid state device


20


.




In a specific embodiment of the present invention, the controller


40


of

FIG. 11

is configured to maintain a constant voltage to the reversible solid state device


20


and modulate a speed of the compartment fan


30


.




In one embodiment of the present invention, the controller


40


of

FIG. 11

is configured to hold the compartment air temperature in a range from about 40 degrees F. to about 50 degrees F. when operating in the heating mode. In another embodiment of the present invention, the controller


40


is configured to hold the compartment air temperature in a range from about 20 degrees F. to about 30 degrees F. when operating in the cooling mode.




In one embodiment of the present invention, the temperature controlled apparatus


1000


further comprises a user interface


100


of

FIGS. 11 and 12

coupled to the controller


40


of

FIGS. 11 and 12

, respectively . The user interface


100


is configured to allow a user to select at least one operational mode. The operational modes are the same as discussed above with regards to FIG.


1


.




In a specific embodiment of the present invention, the controller


40


of

FIG. 12

is configured to maintain a constant voltage to the reversible solid state device


20


and modulate a speed of the internal compartment fan


225


.




A method for temperature control is provided in one embodiment of the present invention that comprises 1) modifying a compartment air temperature inside a compartment


10


by controlling a reversible solid state device


20


and a compartment fan


30


, 2) flowing a compartment air


80


across a second section


60


of reversible solid state device


20


where the second section


60


is disposed within the compartment


10


, 3) flowing a temperature controlled air


160


across a first section


50


of the reversible solid state device


20


, where a portion of first section


50


is disposed outside the compartment


10


, and 4) controlling the compartment air temperature in at least one temperature operational mode.




In one embodiment of the present invention, the method further comprises changing an electrical polarity of an electrical power supply


180


to the reversible solid state device


20


to switch from the cooling mode to the heating mode. In another embodiment of the present invention, the method further comprises changing the electrical polarity of the electrical power supply


180


to the reversible solid state device


20


to switch from the heating mode to the cooling mode.




In one embodiment of the present invention, the method further comprises holding the compartment air temperature in a range from about 40 degrees F. to about 50 degrees F. when operating in the heating mode.




In one embodiment of the present invention, the method further comprises holding the compartment air temperature in a range from about 20 degrees F. to about 30 degrees F. when operating in the cooling mode.




Another method for temperature control is provided in another embodiment of the present invention that comprises 1) modifying the interior compartment air temperature inside the interior compartment


200


by controlling the reversible solid state device


20


and the internal compartment fan


225


, 2) flowing the interior compartment air


85


across the second section


60


of the reversible solid state device


20


, where the second section


60


is disposed within the interior compartment


200


,


3)


flowing the external air


310


across the first section


50


of the reversible solid state device


20


, where the first section


50


is disposed in the exterior compartment


210


, and 4) controlling the interior compartment air temperature in at least one temperature operational mode.




The foregoing description of several embodiments of the present invention has been presented for purposes of illustration. Although the invention has been described and illustrated in detail, it is to be clearly understood that the same is intended by way of illustration and example only and is not to be taken by way of limitation. Obviously many modifications and variations of the present invention are possible in light of the above teaching. Accordingly, the spirit and scope of the present invention are to be limited only by the terms of the appended claims.



Claims
  • 1. A temperature controlled apparatus comprising:a compartment; a reversible solid state device; a compartment fan; and a controller; said reversible solid state device having a first section and a second section, a portion of said first section and a portion of said second section being disposed in intimate contact, said first section being disposed adjacent to a portion of an external wall surface of said compartment and said second section being disposed adjacent to a portion of an internal wall surface of said compartment, said compartment fan being disposed within said compartment, said reversible solid state device and said compartment fan being coupled to said controller, said controller being configured to modify a compartment air temperature inside said compartment by controlling said reversible solid state device and said compartment fan so as to flow a compartment air across said second section, said controller being configured to control said reversible solid state device and said compartment fan in at least one temperature operational mode, wherein said temperature operational mode is selected from the group consisting of a cooling mode, a heating mode and combinations thereof.
  • 2. The apparatus of claim 1, wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof;wherein said controller is configured to change an electrical polarity of an electrical power supply to said reversible solid state device to switch from said cooling mode to said heating mode.
  • 3. The apparatus of claim 1, wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof;wherein said controller is configured to change an electrical polarity of an electrical power supply to said reversible solid state device to switch from said heating mode to said cooling mode.
  • 4. The apparatus of claim 1, wherein said controller is configured to vary the voltage supplied to said reversible solid state device.
  • 5. The apparatus of claim 1, wherein said controller is configured to maintain a constant voltage to said reversible solid state device and modulate a speed of said compartment fan.
  • 6. The apparatus of claim 1, wherein said compartment fan is selected from the group consisting of discreet speed controlable fans, continuous speed fans, variable speed fans, and combinations thereof.
  • 7. The apparatus of claim 1, further comprising a compartment thermistor disposed in said compartment so as to contact said compartment air;wherein said compartment thermistor is coupled to said controller; wherein said controller is configured to control said compartment air temperature using data acquired from said compartment thermistor.
  • 8. The apparatus of claim 1, wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof;wherein said controller is configured to hold said compartment air temperature in a range from about 40 degrees F. to about 50 degrees F. when operating in said heating mode.
  • 9. The apparatus of claim 1, wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof;wherein said controller is configured to hold said compartment air temperature in a range from about 20 degrees F. to about 30 degrees F. when operating in said cooling mode.
  • 10. The apparatus of claim 1 further comprising a user interface coupled to said controller;wherein said user interface is configured to allow a user to select at least one operational mode; wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof.
  • 11. The apparatus of claim 1, wherein said apparatus is disposed in a temperature controlled device,wherein said temperature controlled device is selected from the group consisting of an internal freezer compartment, a door mounted freezer compartment, an internal refrigerator compartment, a door mounted refrigerated compartment, and combinations thereof.
  • 12. The apparatus of claim 11, further comprising a temperature control device thermistor disposed in said temperature control device so as to contact a temperature controlled air;wherein said temperature control device thermistor is spaced apart from said compartment; wherein said temperature control device thermistor is coupled to said controller; wherein said controller is configured to control said compartment air temperature using data acquired from said temperature control device thermistor.
  • 13. The apparatus of claim 11, further comprising an ambient air thermistor;wherein said ambient air thermistor is disposed on a portion of an external wall of said temperature control device; wherein said ambient air thermistor is disposed to be spaced apart from said compartment; wherein said ambient air thermistor is coupled to said controller; wherein said controller is configured to control said compartment air temperature using data acquired from said ambient air thermistor.
  • 14. The apparatus of claim 11, wherein said temperature controlled device further comprises a main temperature controlled portion;wherein said first section of said reversible solid state device is disposed to contact a temperature controlled air that is disposed in said main temperature controlled portion.
  • 15. The apparatus of claim 14, further comprising a temperature control device fan disposed in said main temperature control portion;wherein said temperature control device fan is coupled to said controller; wherein said temperature control device fan is disposed to draw said temperature controlled air across said first section of said reversible solid state device.
  • 16. The apparatus of claim 15, wherein said temperature control device fan is selected from the group consisting of discreet speed controlable fans, continuous speed fans, variable speed fans, and combinations thereof;wherein said controller is configured to maintain a constant voltage to said reversible solid state device and modulate a speed of said temperature control device fan.
  • 17. The apparatus of claim 15 further comprises a first section cover having an first section cover inlet and a first section cover outlet;wherein said first section cover is disposed over said first section of said reversible solid state device; wherein said first section cover inlet is disposed to draw in said temperature controlled air from said main temperature controlled portion; wherein said first section cover outlet is disposed to exhaust said temperature controlled air to said main temperature controlled portion after said temperature controlled air passes over said first section of said reversible solid state device.
  • 18. The apparatus of claim 17 further comprises a first section cover fan disposed between said first section cover and said external wall surface of said compartment;wherein said first section cover fan is coupled to said controller; wherein said first section cover fan is disposed to draw said temperature controlled air through said first section cover inlet, across said first section of said reversible solid state device, and exhaust said temperature controlled air through said first section cover exhaust.
  • 19. The apparatus of claim 18, wherein said first section cover fan is selected from the group consisting of discreet speed controlable fans, continuous speed fans, variable speed fans, and combinations thereof;wherein said controller is configured to maintain a constant voltage to said reversible solid state device and modulate a speed of said first section cover fan.
  • 20. The apparatus of claim 18, wherein said temperature control device fan is disposed to draw a portion of said temperature controlled air through said first section cover inlet, across said first section of said reversible solid state device and exhaust said temperature controlled air through said first section cover exhaust;wherein said said temperature control device fan is disposed to direct another portion of said temperature controlled air over said temperature controlled device thermistor.
  • 21. The apparatus of claim 1, further comprising a compartment door being disposed to provide a user access to said compartment.
  • 22. A temperature controlled apparatus comprising:a compartment comprising an internal compartment and an external compartment; a reversible solid state device; an internal compartment fan; and a controller; said internal compartment and said external compartment being disposed to share a portion of a common wall, said internal compartment comprising an internal wall being disposed to a portion of a main temperature controlled portion of a temperature controlled device, said external compartment being spaced apart from said main temperature controlled portion of said temperature controlled device, said reversible solid state device having a first section and a second section, a portion of said first section and a portion of said second section being disposed in intimate contact, said first section of said reversible solid state device being disposed in said external compartment adjacent to a portion of a common wall external surface on said common wall, said second section of said reversible solid state device being disposed in said internal compartment adjacent to a portion of a common wall internal surface on said common wall, said internal compartment fan being disposed in said internal compartment, said reversible solid state device and said internal compartment fan being coupled to said controller, said controller being configured to modify an internal compartment air temperature inside said internal compartment by controlling said reversible solid state device and said internal compartment fan so as to flow an internal compartment air across said second section, said controller being configured to control said reversible solid state device and said internal compartment fan in at least one temperature operational mode.
  • 23. The apparatus of claim 22, wherein said external compartment comprises an external wall;wherein said external wall comprises an external wall inlet and an external wall outlet; wherein said external wall inlet is disposed to draw in an external air from outside said external compartment; wherein said external wall outlet is disposed to exhaust said external air to outside of said external compartment after passing said external air over said first section of said reversible solid state device.
  • 24. The apparatus of claim 23 further comprising an external wall ventillation duct and an external air flow divider,wherein said external wall inlet and said external wall outlet are disposed in said external wall ventillation duct; wherein said external air flow divider is disposed between said first section and said external wall; wherein said said external wall ventillation duct and said external air flow divider are disposed so as to draw said external air down past a portion of said first section, around one end of said external airflow divider, and up past another portion of said second section.
  • 25. The apparatus of claim 23 further comprising an external compartment fan;wherein said external compartment fan is coupled to said controller, wherein said external compartment fan is disposed to draw said external air through said external wall inlet across said first section of said reversible solid state device and exhaust said external air through said external wall outlet.
  • 26. The apparatus of claim 25 further comprising an external wall ventillation duct and an external airflow divider,wherein said external wall inlet and said external wall outlet are disposed in said external wall ventillation duct; wherein said external airflow divider is disposed between said first section and said external wall; wherein said said external wall ventillation duct, said external airflow divider, and said external compartment fan are disposed so as to draw said external air down past a portion of said first section, around one end of said external airflow divider, and up past another portion of said first section.
  • 27. The apparatus of claim 25, wherein said external compartment fan is selected from the group consisting of discreet speed controlable fans, continuous speed fans, variable speed fans, and combinations thereof;wherein said controller is configured to maintain a constant voltage to said reversible solid state device and modulate a speed of said external compartment fan.
  • 28. The apparatus of claim 22, further comprising a temperature control device thermistor disposed in a main temperature controlled portion of said temperature control device so as to contact a temperature controlled air;wherein said temperature control device thermistor is spaced apart from said internal compartment and said external compartment; wherein said temperature control device thermistor is coupled to said controller; wherein said controller is configured to control said internal compartment air temperature using data acquired from said temperature control device thermistor.
  • 29. The apparatus of claim 28, further comprising a temperature control device fan;wherein said temperature control device fan is disposed in said main temperature controlled portion; wherein said temperature control device fan is coupled to said controller; wherein said temperature control device fan is disposed to direct said temperature controlled air across said temperature controlled device thermistor.
  • 30. The apparatus of claim 29, wherein said temperature control device fan is selected from the group consisting of discreet speed controlable fans, continuous speed fans, variable speed fans, and combinations thereof;wherein said controller is configured to maintain a constant voltage to said reversible solid state device and modulate a speed of said temperature control device fan.
  • 31. The apparatus of claim 22, further comprising an ambient air thermistor disposed on a portion of an external wall of said temperature control device;wherein said ambient air thermistor is spaced apart from said internal compartment and said external compartment; wherein said ambient air thermistor is coupled to said controller; wherein said controller is configured to control said internal compartment air temperature using data acquired from said ambient air thermistor.
  • 32. The apparatus of claim 22, wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof;wherein said controller is configured to change an electrical polarity of an electrical power supply to said reversible solid:state device to switch from said cooling mode to said heating mode.
  • 33. The apparatus of claim 22, wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof;wherein said controller is configured to change an electrical polarity of an electrical power supply to said reversible solid state device to switch from said heating mode to said cooling mode.
  • 34. The apparatus of claim 22, wherein said controller is configured to vary the voltage supplied to said reversible solid state device.
  • 35. The apparatus of claim 22, wherein said controller is configured to maintain a constant voltage to said reversible solid state device and modulate a speed of said internal compartment fan.
  • 36. The apparatus of claim 22, wherein said internal compartment fan is selected from the group consisting of discreet speed controlable fans, continuous speed fans, variable speed fans, and combinations thereof.
  • 37. The apparatus of claim 22, further comprising an internal compartment thermistor disposed in said internal compartment so as to contact said internal compartment air;wherein said internal compartment thermistor is coupled to said controller; air temperature using data acquired from said internal compartment thermistor.
  • 38. The apparatus of claim 22, wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof;wherein said controller is configured to hold said internal compartment air temperature in a range from about 40 degrees F. to about 50 degrees F. when operating in said heating mode.
  • 39. The apparatus of claim 22, wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof;wherein said controller is configured to hold said internal compartment air temperature in a range from about 20 degrees F. to about 30 degrees F. when operating in said cooling mode.
  • 40. The apparatus of claim 22 further comprising a user interface coupled to said controller;wherein said user interface is configured to allow a user to select at least one operational mode; wherein said at least one temperature operational mode is selected from the group consisting of a cooling mode, a heating mode, and combinations thereof.
  • 41. The apparatus of claim 22, wherein said apparatus is disposed in temperature controlled device,wherein said temperature controlled device is selected from the group consisting of an internal freezer compartment, a door mounted freezer compartment, an internal refrigerator compartment, a door mounted refrigerated compartment, and combinations thereof.
  • 42. The apparatus of claim 22, further comprising a internal compartment door being disposed to provide a user access to said internal compartment.
  • 43. A method for temperature control comprising:modifing a compartment air temperature inside a compartment by controlling a reversible solid state device and a compartment fan; flowing a compartment air across a second section of said reversible solid state device, wherein said second section is disposed within said compartment; flowing a temperature controlled air across a first section of said reversible solid state device, wherein a portion of said first section is disposed outside said compartment; controlling said compartment air temperature in at least one temperature operational mode, wherein said temperature operational mode is selected from the group consisting of a cooling mode, a heating mode and combinations thereof.
  • 44. The method of claim 43 further comprises changing an electrical polarity of an electrical power supply to said reversible solid state device to switch from said cooling mode to said heating mode.
  • 45. The method of claim 43 further comprises changing an electrical polarity of an electrical power supply to said reversible solid state device to switch from said heating mode to said cooling mode.
  • 46. The method of claim 43 further comprising holding said compartment air temperature in a range from about 40 degrees F. to about 50 degrees F. when operating in said heating mode.
  • 47. The method of claim 43 further comprising holding said compartment air temperature in a range from about 20 degrees F. to about 30 degrees F. when operating in said cooling mode.
  • 48. A method for temperature control comprising:modifing an interior compartment air temperature inside an interior compartment by controlling a reversible solid state device and an internal compartment fan; flowing an interior compartment air across a second section of said reversible solid state device, wherein said second section is disposed within said interior compartment; flowing an external air across a first section of said reversible solid state device, wherein a said first section is disposed in said exterior compartment; controlling said interior compartment air temperature in at least one temperature operational mode. wherein said temperature operational mode is selected from the group consisting of a cooling mode, a heating mode and combinations thereof.
  • 49. The method of claim 48, wherein said at least one temperature operational mode is selected from the group consisting of a heating mode, a cooling mode, and combinations thereof.wherein said temperature operational mode is selected from the group consisting of a cooling mode, a heating mode and combinations thereof.
  • 50. The method of claim 48 further comprises changing an electrical polarity of an electrical power supply to said reversible solid state device to switch from said cooling mode to said heating mode.
  • 51. The method of claim 48 further comprising changing an electrical polarity of an electrical power supply to said reversible solid state device to switch from said heating mode to said cooling mode.
  • 52. The method of claim 48 further comprising holding said internal compartment air temperature in a range from about 40 degrees F. to about 50 degrees F. when operating in said heating mode.
  • 53. The method of claim 48 further comprising holding said internal compartment air temperature in a range from about 20 degrees F. to about 30 degrees F. when operating in said cooling mode.
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