Claims
- 1. A method of controlled temperature bonding comprising dispersing magnetic particles, selected from a group of ferromagnetic particles consisting of SrFe.sub.12 O.sub.19 and CO.sub.2 Ba.sub.2 Fe.sub.12 O.sub.22 particles, in a first thermoplastic material, applying an alternating induction field to the first thermoplastic material, heating the magnetic particles and thermoplastic material with hysteresis losses from the magnetic particles, flowing the thermoplastic material and bonding the first thermoplastic material with a second material, continuing the applying of the alternating field and ceasing heating of magnetic particles when the magnetic particles reach Curie temperature.
- 2. The method of claim 1, further comprising initially juxtaposing the first thermoplastic material with the second material.
- 3. The method of claim 1, further comprising initially placing the first thermoplastic material in an uncured state on an uncured thermoset material and cocuring the first thermoplastic material and the thermoset material.
- 4. The method of claim 3, further comprising initially juxtaposing the first thermoplastic material on the cocured thermoset material with the second material.
- 5. The method of claim 4, wherein the second material is a cocured second thermoset material with a cocured second thermoplastic material and wherein the bonding comprises flowing and bonding the first and second thermoplastic materials.
- 6. The method of claim 5, wherein the second thermoplastic material has magnetic particles embedded therein.
- 7. The method of claim 6, wherein the particles are embedded in adjacent surfaces of the first and second thermoplastic materials.
- 8. The method of claim 6, wherein the particles are embedded in a surface of the first or second thermoplastic material.
- 9. The method of claim 1, wherein the particles are from about 1 micron to about 840 microns.
- 10. The method of claim 1, wherein the applying comprises applying an alternating induction field at about 6-10 MHz.
Parent Case Info
This application claims the benefit of U.S. Provisional Application Ser. No. 60/048,919, filed Jun. 6, 1997.
US Referenced Citations (17)