Patent Application
20240369419
The present application claims priority to Chinese Patent Application No. 202110939761.3, filed on Aug. 16, 2021 and entitled “Temperature Measurement Structure, Charging Apparatus and Motor Vehicle”.
The present disclosure relates to the field of temperature detection structures, in particular relates to a temperature measurement structure, also relates to a charging apparatus, and further relates to a motor vehicle.
Temperature is one of the most basic physical quantities in science and technology. The disciplines such as physics, chemistry and thermodynamics are inseparable from temperature. The temperature is one of the most common and important parameters in industrial production.
There are many ways to measure temperature, which may be divided into two categories: contact temperature measurement and non-contact temperature measurement, if based only on whether or not the measurement body is in contact with the measured medium. Contact temperature measurement is based on the principle of thermal equilibrium, in which case the temperature measurement sensitive element must be in contact with the measured medium, and both of which are in the same thermal equilibrium state and have the same temperature. For example, the mercurial thermometer and the thermocouple thermometer measure temperature using this method. Non-contact temperature measurement is based on the principle of thermal radiation of materials. The temperature measurement element does not need to contact the measured medium, but determines the temperature by receiving the radiant heat emitted by the measured object. Examples include the radiation thermometer, the fiber-optic thermometers, etc.
Contact temperature measurement is simple and reliable, and has high measurement accuracy. However, the temperature measurement element must be in contact with the measured medium before measuring the temperature. When the measured medium is inaccessible or has serious hidden dangers after contact, contact temperature measurement cannot be chosen. For non-contact temperature measurement, since the temperature measurement element does not need to contact the measured medium, the range of temperature measurement is very broad, and in principle the upper limit of temperature measurement is unrestricted. However, non-contact temperature measurement is affected by the emissivity of the measured object, the distance between the measured object and the measurement element, and other media such as smoke dust and water vapor, so has a large temperature measurement error. Moreover, since heat is transferred by the thermal radiation, the reflection time is long and the temperature measurement speed is low, which cannot be suitable for many applications where the temperature measurement timeliness ratio and accuracy rate are required.
For example, when a high-power charging device is charging, the temperature of the measured object will increase rapidly, so it is necessary to monitor the temperature of the charging device in real time to ensure safety of the charging device and reduce the risk caused by the uncontrollability of temperature during the charging process. However, in general the measured object of the charging device carries a large current, which may cause an electric shock damage to the contact-type measurement element, but if non-contact temperature measurement is employed, real-time temperature cannot be obtained in time.
Therefore, the field of temperature measurement structures is in urgent need of a temperature measurement structure that can rapidly reflect the real-time temperature of the measured object without causing a damage to the temperature measurement element.
In order to monitor the temperature of a measured object, the present disclosure provides a temperature measurement structure, a charging apparatus and a motor vehicle. The temperature of the measured object is indirectly conducted to a temperature sensor through a heat conduction medium, so that not only the temperature of the measured object is monitored, but also a destructive influence on the temperature sensor is avoided.
The technical solutions provided in the present disclosure to solve the technical problem are as follows.
A temperature measurement structure, including a heat conduction medium, a temperature sensor and a pressure supply mechanism, and the heat conduction medium is mounted on the pressure supply mechanism, the pressure supply mechanism supplies pressure to make the heat conduction medium in contact with a measured object and the temperature sensor respectively, and the temperature sensor determines a temperature of the measured object through a temperature of the heat conduction medium.
A charging apparatus, including the measured object and the temperature measurement structure described above, and the charging apparatus is a charging plug or a charging socket.
A motor vehicle, including the temperature measurement structure described above. Advantageous effects of the present disclosure include:
The accompanying drawings constituting a part of the present disclosure are used to provide further understandings of the present disclosure. The illustrative embodiments of the present disclosure and explanations therefor are used to explain the present disclosure and do not constitute improper limitations on the present disclosure.
It should be noted that, as long as there is no conflict, the embodiments and the features in the embodiments of the present disclosure can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and the embodiments.
A temperature measurement structure, including a heat conduction medium 4, a temperature sensor 2 and a pressure supply mechanism, and the heat conduction medium 4 is mounted on the pressure supply mechanism, the pressure supply mechanism supplies pressure to make the heat conduction medium 4 in contact with a measured object 6 and the temperature sensor 2 respectively, and the temperature sensor 2 determines a temperature of the measured object 6 through a temperature of the heat conduction medium 4, as shown in
The temperature of the measured object 6 may be indirectly conducted to the temperature sensor 2 through the heat conduction medium 4. The conductive temperature measurement structure for a charging apparatus not only monitors the temperature of the measured object 6, but also avoids a destructive influence on the temperature sensor 2, and thus both the service life and the measurement accuracy of the temperature sensor 2 are improved.
In this embodiment, the pressure supply mechanism is a movable mechanism that is capable of driving the heat conduction medium 4 to contact or separate from the measured object 6.
In this embodiment, a thermal impedance value of the heat conduction medium 4 is less than 12K·cm2/W.
The thermal impedance value refers to a ratio of a temperature difference per unit area of two ends of the object to the power of a heat source when there is heat transferred on the object. It can be understood as the resistance that the heat encounters on the heat flow path, which reflects the magnitude of the heat transfer capacity of the heat conduction medium 4 and indicates the magnitude of the temperature rise caused by 1 W of heat. A simple analogy may be used to explain the meaning of thermal impedance, that is, the amount of heat exchanged is equivalent to current, the temperature difference is equivalent to voltage, and the thermal impedance is equivalent to resistance.
The smaller the thermal impedance value of the heat conduction medium 4 is, the better the heat conduction capacity of the heat conduction medium 4 is, so that heat can be well transferred and the temperature difference between the two ends of the heat conduction medium 4 can be reduced, and thus the detection accuracy rate of the temperature sensor 2 is improved.
After a plurality of times of experiments by the inventor, it is known that a temperature difference of 12° C. is generated by 1 W of heat in 1 square centimeter, when the thermal impedance value of the heat conduction medium 4 is greater than 12K·cm2/W. The greater the temperature difference is, the greater the temperature error is. For a temperature control system, it is difficult to determine the actual temperature of the measured object 6, and thus effective temperature control measures cannot be taken, which may result in a failure in the temperature control of the measured object 6, causing the temperature of the measured object 6 to be too high, thereby resulting in damage or even accidents. Therefore, the inventor sets the thermal impedance value of the heat conduction medium 4 to be less than 12K·cm2/W.
In order to verify the influence of the thermal impedance value of the heat conduction medium 4 on the temperature drift of the heat conduction medium 4, the inventor selects materials with the same size but different thermal impedance values to produce heat conduction medium 4, and uses the same pressure supply mechanism to cause the heat conduction medium 4 to contact the measured object 6. The measured objects 6 are set at the same temperature, and a temperature sensor 2 is then used to measure the temperature drifts at the other end of the heat conduction medium 4, which are recorded in Table 1.
The temperature drift value of the heat conduction medium 4 refers to a temperature difference value between the measured object 6 and the other end of the heat conduction medium 4. A temperature drift value greater than 10K is considered unqualified.
As can be seen from the above table, when the thermal impedance value of the heat conduction medium 4 is less than 12K·cm2/W, the temperature drift value is less than 10K, and the temperature of the heat conduction medium 4 measured by the temperature sensor 2 is relatively accurate. When the thermal impedance value of the heat conduction medium 4 is greater than 12K·cm2/W, the temperature drift value is more than 10K; and in this case, the temperature of the heat conduction medium 4 measured by the temperature sensor 2 has a large error, which may cause reflection distortion of the measurement system, thereby resulting in an inability to accurately control the temperature of the measured object 6.
In this embodiment, a heat conduction time of the heat conduction medium 4 is less than 20 ms. The heat conduction time refers to the time it takes for heat to be transferred from one end to the other end of the heat conduction medium 4. The smaller the heat conduction time is, the higher the heat transfer speed of the heat conduction medium 4 is, so that the temperature of the measured object 6 may be rapidly reflected on the temperature sensor 2, and therefore a smaller response time for temperature control is realized.
After a plurality of times of experiments by the inventor, it is known that if the heat conduction time of the heat conduction medium 4 is greater than 20 ms, when the temperature sensor 2 acquires the temperature of the heat conduction medium 4, in fact the temperature of the measured object 6 has already reached or exceeded the actual temperature value to be controlled. The temperature sensor 2 transmits a signal to the temperature control system, and it also takes time for the temperature control system to issue an instruction after making a judgment and adjust the temperature control device to make a temperature change. When the temperature adjustment measure of the temperature control device reaches the measured object 6, the real-time temperature of the measured object 6 is no longer the temperature obtained by the temperature sensor 2. This status will recur all the time, and it is never possible to achieve a stable thermal equilibrium, and consequently, it is not possible to reach a status of controlling the measured object 6 to maintain a stable temperature in real time. Therefore, the inventor sets the heat conduction time of the heat conduction medium 4 to be less than 20 ms.
In this embodiment, the heat conduction medium 4 includes a contact part 41, a connection part 42 and a sensor contact part 43, all of which are arranged in sequence. The connection part 42 is in a rectangle, as shown in
In this embodiment, the temperature sensor 2 is an NTC (Negative Temperature Coefficient) temperature sensor or a PTC (Positive Temperature Coefficient) temperature sensor. The temperature sensor 2 is an NTC temperature sensor or a PTC temperature sensor. The advantage of using these two kinds of temperature sensors is that they are small in volume and can measure a void that cannot be measured by other thermometers; they are easy to use, and have a resistance value that can be randomly selected from 0.1 Ω to 100 kΩ; they are easy to process into complex shapes and can be mass-produced, have high stability and strong overload capacity, and are suitable for use in products that have requirements for small volumes and stable performance. such as conversion adapter.
In this embodiment, when the contact part 41 is in contact with the measured object 6 and the sensor contact part 43 is in contact with the temperature sensor 2, the heat conduction medium 4 is in a working position, as shown in
For example, when a charging gun and a charging socket in a charging apparatus are plugged into each other, the measured object 6 is the charging terminal. The charging terminal needs a certain amount of movement to plug the male and female terminals into each other, so as to prevent the “failure contagion” problem between different charging apparatus; and at this time, the heat conduction medium 4 will be separated from the measured object 6, i.e. the charging terminal, and return to the initial position.
In this embodiment, the contact part 41 is capable of being matched and in contact with the measured object 6, as shown in
In this embodiment, the contact area between the contact part 41 and the measured object 6 accounts for 0.1% to 95% of a radial projected area of the measured object 6.
In some embodiments, the measured object 6 is a combined substance of a plurality of structures, such as a charging terminal in a charging apparatus, which includes a crimping part of crimping conductive wires, a plug-in part for mating with a plug-in terminal, a fixing part for mounting to the charging apparatus, etc. The contact part 41 cannot completely contact the whole projected area of the charging terminal. Since the charging terminal is made of a copper material and has a high heat conduction speed, the temperature value at a certain position on it can represent the temperature of the entire charging terminal. Thus, the contact area between the contact part 41 and the measured object 6 may account for a minimum of 0.1% of the radial projected area of the measured object 6. As mentioned above, the larger the contact area between the contact part 41 and the measured object 6 is, the more the heat of the measured object 6 is conducted. If the contact area is less than 0.1%, the contact area between the contact part 41 and the measured object 6 is too small that the temperature value of a surface of the measured object 6 cannot be accurately reflected, resulting in an inaccuracy in temperature measurement.
Exemplarily, the contact area between the contact part 41 and the measured object 6 accounts for 1% to 45% of the radial projection area of the measured object 6.
In some other embodiments, the measured object 6 is an object with a relatively simpler structure and does not have a high heat-conducting property, so the contact part 41 must cover most of the surface area of it to achieve accurate measurement of the surface temperature of the measured object 6. Therefore, the contact area between the contact portion 41 and the measured object 6 may account for a maximum of 95% of the radial projected area of the measured object 6. If it is greater than 95%, the volume of the entire heat conduction medium 4 is too large, and consequently, the volume of the temperature measurement structure is too large, which would not only inconvenient to use but also cause an increase in cost and a decrease in efficiency of the temperature measurement structure. Moreover, the pressure supply mechanism would also be larger, thus causing operation difficulties.
In order to verify the influence of the proportion of the contact area between the contact part 41 and the measured object 6 to the radial projected area of the measured object 6 on the temperature drift of the heat conduction medium 4, the inventor selects measured objects 6 with the same size, and produces heat conduction medium 4 with different contact areas between the contact part 41 and the measured object 6, and uses the same pressure supply mechanism to cause the heat conduction medium 4 to contact the measured objects 6. The measured objects 6 are set at the same temperature, and a temperature sensor 2 is then used to measure the temperature drifts at the other end of the heat conduction medium 4, which are recorded in Table 1.
The temperature drift value of the heat conduction medium 4 refers to a temperature difference value between the measured object 6 and the other end of the heat conduction medium 4. A temperature drift value greater than 10K is considered unqualified.
As can be seen from Table 2, when the contact area between the contact part 41 and the measured object 6 is less than 0.1% of the radial projected area of the measured object 6, the temperature drift value is over 10K, or, when the contact area between the contact part 41 and the measured object 6 is more than 95% of the radial projected area of the measured object 6, the temperature drift value is also over 10K. At this time, the temperature of the heat conduction medium 4 measured by the temperature sensor 2 has a large error, which will cause reflection distortion of the measurement system, resulting in a situation that the temperature of the measured object 6 cannot be accurately controlled. Therefore, the inventor sets the contact area between the contact part 41 and the measured object 6 to be 0.1% to 95% of the radial projected area of the measured object 6. optionally, when the contact area between the contact part 41 and the measured object 6 accounts for 1% to 45% of the radial projected area of the object 6, the temperature drift value of the heat conduction medium 4 is in a relatively exemplary range. At this time, the temperature of the heat conduction medium 4 measured by the temperature sensor 2 has a small error, and the measurement system is capable of accurately reflecting the actual temperature of the measured object 6.
In this embodiment, when the heat conduction medium 4 is in the working position, the contact part 41 is capable of exerting pressure on the measured object 6, or the sensor contact part 43 is capable of exerting pressure on the temperature sensor 2, or, the contact part 41 is capable of exerting pressure on the measured object 6 and the sensor contact part 43 is capable of exerting pressure on the temperature sensor 2, as shown in
As can be seen from above, the more fully the contact part 41 is in contact with the measured object 6, the better the heat conduction effect will be. Similarly, the more fully the sensor contact part 43 is in contact with the temperature sensor 2, the more accurate the measurement of the temperature sensor 2 will be. However, since there are always tiny recesses and bulges on object surfaces, even if in contact with very flat surfaces, only some of the bulges of them are in contact, while there are still small gaps between the contact surfaces where air exists. The air, however, has very poor heat conduction effect, which will directly affect the heat conduction efficiency, making it impossible to obtain the accurate temperature of the measured object 6 in real time. In order to fully contact the contact part 41 with the measured object 6, and the sensor contact part 43 with the temperature sensor 2, it is necessary to apply force on the contact surfaces to flatten the tiny bulges thereon, so that even tiny recesses can come into contact, thereby achieving the purpose of increasing the contact area and enhancing the heat conduction effect.
In this embodiment, the pressure exerted by the contact part 41 on the measured object 6 is 0.5N to 100N, and the pressure exerted by the sensor contact part 43 on the temperature sensor 2 is 0.5N to 100N.
In order to verify the influence of the pressure exerted by the contact part 41 on the measured object 6 on the heat conduction effect and the operation situation of the pressure supply mechanism, the inventor selects the same measured objects 6 and heat conduction medium 4, and employs different pressures exerted by the contact part 41 on the measured object 6, to test the temperature rise values detected by the temperature sensor 2 and the operation situations of the pressure supply mechanism. In this embodiment, a temperature rise value of greater than 12K is considered unqualified, and if the operation of the pressure supply mechanism gets stuck more than 2 times, it is considered unqualified.
The method to detect the temperature rise values is to apply the same amount of heat to the measured objects 6 to keep their temperatures the same, then read the temperatures detected by the temperature sensor 2 in contact with the heat conduction medium 4, and obtain the temperature rise values by calculating the differences between the read temperatures and an initial temperature, and record them in Table 1.
The method to detect the operation situations of the pressure supply mechanism is to continuously operate the pressure supply mechanism under different pressures exerted by the contact part 41 on the measured object 6, and observe the numbers of times that it gets stuck after 50 times of operations, and record them in Table 3.
As can be seen from the above table, when the pressure exerted by the contact part 41 on the measured object 6 is less than 0.5N, the temperature rise value detected by the temperature sensor 2 exceeds the required value and does not meet the standard requirement. When the pressure exerted by the contact part 41 on the measured object 6 is greater than 100N, the operation of the pressure supply mechanism gets stuck for more than 2 times, which does not meet the standard requirement either. Therefore, the inventor sets the pressure exerted by the contact part 41 on the measured object 6 to be 0.5N to 100N.
In order to verify the influence of the pressure exerted by the sensor contact part 43 on the temperature sensor 2 on the detection result of the temperature sensor 2 and the damage condition of the temperature sensor 2, the inventor selects the same heat conduction medium 4 and temperature sensors 2, and employs different pressures exerted by the sensor contact part 43 on the temperature sensor 2, to test the temperature rise values detected by the temperature sensor 2 and the damage conditions of the temperature sensor 2 under different pressure conditions. In this embodiment, a temperature rise value of greater than 12K is considered unqualified, and if the temperature sensor 2 is damaged, it is considered unqualified.
The method to detect the temperature rise values is to apply the same amount heat to the sensor contact parts 43 to keep their temperatures the same, then read the temperatures detected by the temperature sensors 2 in contact with the sensor contact parts 43, and obtain the temperature rise values by calculating the differences between the read temperatures and an initial temperature, and record them in Table 4.
The method to detect the damage condition of the temperature sensor 2 is to conduct 50 times of pressure exertion experiments under different pressures exerted by the sensor contact part 43 on the temperature sensor 2, and observe the damage condition of the temperature sensor 2.
As can be seen from the above table, when the pressure exerted by the sensor contact part 43 on the temperature sensor 2 is less than 0.5N, the temperature rise value detected by the temperature sensor 2 exceeds the required value and does not meet the standard requirement. When the pressure exerted by the sensor contact part 43 on the temperature sensor 2 is greater than 100N, the temperature sensor 2 is damaged more than 2 times, which does not meet the standard requirement either. Therefore, the inventor sets the pressure exerted by the sensor contact part 43 on the temperature sensor 2 to be 0.5N to 100N.
In this embodiment, the pressure supply mechanism includes a support side wall 1. The support side wall 1 is a cylinder structure. The measured object 6 is accommodated in an accommodating cavity 11 enclosed by the support side wall 1. An axis of the measured object 6 coincides with an axis of the support side wall 1. A mounting opening 12 is provided on the support side wall 1. When the heat conduction medium 4 is in the working position, the heat conduction medium 4 is fixed within the mounting opening 12, as shown in
In this embodiment, in order that the heat conduction medium 4 can be in stable contact with the measured object 6 and the temperature sensor 2, the pressure supply mechanism further includes a support table 13 provided on an outer side of the support side wall 1. An upper portion of the support table 13 includes an upper contact surface 131, and the heat conduction medium 4 is matched and in contact with the upper contact surface 131 that is below the heat conduction medium (4), as shown in
In this embodiment, the upper contact surface 131 is arranged to be parallel with or inclined with respect to an axis of the mounting opening 12, as shown in
In this embodiment, the pressure supply mechanism further includes a guide rail 52 provided on an outer side of the support side wall 1 and a positioning member 5 provided on the guide rail 52, the positioning member 5 being movable up and down along an axis direction of the support side wall 1. The function of the guide rail 52 is to guide the positioning member 5 to move up and down, and the function of the positioning member 5 is to cause the heat conduction medium 4 to move or rotate to the working position and fix it there, as shown in
When the positioning member 5 is in an upper position, the heat conduction medium 4 is in the initial position. During downward movement of the positioning member 5, the positioning member 5 is capable of contacting the connection part 42 and driving the heat conduction medium 4 to move to the working position, as shown in
Exemplarily, the positioning member 5 includes a lower inclined surface 51, the connection part 42 includes an upper inclined surface 44, and during downward movement of the positioning member 5, the lower inclined surface 51 is capable of contacting the upper inclined surface 44 and driving the heat conduction medium 4 to move to the working position.
In order to realize separation of the heat conduction medium 4 from the measured object 6 and return of the heat conduction medium 4 to the initial position when temperature measurement is not needed, the pressure supply mechanism further includes a first return device 53, one end of the first return device 53 is fixed to the guide rail 52 while the other end of it is fixed to the positioning member 5, and the first return device 53 is capable of driving the positioning member 5 to return to the upper position.
In order to realize separation of the heat conduction medium 4 from the measured object 6 and return of the heat conduction medium 4 to the initial position when temperature measurement is not needed, the pressure supply mechanism further includes a second return device 45, one end of the second return device 45 is fixed to the support table 13 while the other end of it is fixed to the connection part 42, and the second return device 45 is capable of driving the heat conduction medium 4 to return to the initial position.
Exemplarily, the first return device 53 may be an existing spring or a rubber-based elastomer, and the second return device 45 may be an existing spring or a rubber-based elastomer.
In this embodiment, the temperature measurement structure also includes a PCBA 3 (Printed Circuit Board Assembly), on which the temperature sensor 2 is located. The temperature sensor 2 is fixed below the PCBA 3, the sensor contact part 43 protrudes from the connection part 42, and the temperature sensor 2 and the sensor contact part 43 are arranged from left to right.
In this embodiment, the whole heat conduction medium 4 may be made of existing non-conductor materials with good heat-conducting properties, and the heat conduction medium 4 is made of the same material. Alternatively, the heat conduction medium 4 is made of different materials, and at least the contact part 41 in the heat conduction medium 4 is made of a non-conductor heat conductive material.
A charging apparatus will be introduced below. The charging apparatus includes a measured object 6 and the temperature measurement structure described above. The charging apparatus is a charging plug or a charging socket.
When the charging apparatus is assembled for use, the pressure supply mechanism is capable of driving the heat conduction medium 4 to contact the measured object 6 and the temperature sensor 2.
For example, the charging apparatus is a charging plug. When the charging plug is assembled with a charging socket for use, the charging socket is capable of driving the positioning member 5 to move downward, so that the heat conduction medium 4 comes into contact with the measured object 6 of the charging apparatus and the temperature sensor 2 at the same time.
Alternatively, the charging apparatus is a charging socket. When the charging socket is assembled with a charging plug for use, the charging socket is capable of driving the positioning member 5 to move downward, so that the heat conduction medium 4 comes into contact with the measured object 6 of the charging apparatus and the temperature sensor 2 at the same time.
The present disclosure also provides a motor vehicle including the temperature measurement structure described above.
This embodiment is a transformation of Embodiment 1. The main difference between this embodiment and Embodiment 1 includes:
All other technical features in this embodiment may be the same as those in Embodiment 1, and will not be described in detail in this embodiment to save space.
This embodiment is a transformation of Embodiment 1. The main difference between this embodiment and Embodiment 1 includes:
All other technical features in this embodiment may be the same as those in Embodiment 1, and will not be described in detail in this embodiment to save space.
This embodiment is a transformation of Embodiment 3. The main difference between this embodiment and Embodiment 3 includes:
All other technical features in this embodiment may be the same as those in Embodiment 3, and will not be described in detail in this embodiment to save space.
This embodiment is a transformation of Embodiment 4. The main difference between this embodiment and Embodiment 3 includes:
the number of heat conduction medium 4 is two, the two heat conduction mediums 4 are overlapped and crossed from top to bottom and shown as an X-shape in top view, the two heat conduction mediums 4 are capable of rotating simultaneously in opposite directions around the articulated hole 14 (with the axis of the articulated hole 14 as an axis), so as to drive two contact parts 41 and two sensor contact parts 43 to rotate to the working position or the initial position, as shown in
For example, the upper (outer side in
All other technical features in this embodiment may be the same as those in Embodiment 4, and will not be described in detail in this embodiment to save space.
This embodiment is a transformation of Embodiment 1. The main difference between this embodiment and Embodiment 1 includes:
In order to facilitate replacement of the measured object 6, optionally the heat conduction medium 4 may be always in contact with the temperature sensor 2, that is, the heat conduction medium 4 and the temperature sensor 2 are always fixedly connected. The temperature sensor 2 and the sensor contact part 43 of the heat conduction medium 4 may be connected by one or more selected from adhesion connection, magnetic connection, snap connection, plug-in connection, locking connection, strapping connection, threaded connection, rivet connection and welding connection.
In a first feasible technical solution, contact surfaces of the heat conduction medium 4 and the temperature sensor 2 are adhesive layers, which are sticky materials made of a heat conductive material. The heat conduction medium 4 and the temperature sensor 2 are bonded together by the adhesive layer.
In a second feasible technical solution, the contact surfaces of the heat conduction medium 4 and the temperature sensor 2 are magnetic pieces. The connection of the conduction medium 4 and the temperature sensor 2 is realized by the magnetic force between the magnetic pieces. The connection is convenient and quick, and is mainly applied to environments that do not require high bonding strength between the heat conduction medium 4 and the temperature sensor 2.
In a third feasible technical solution, one selected from the contact surfaces of the heat conduction medium 4 and the temperature sensor 2 is a clamping claw, while the other is a clamping slot. Through the assembly of the clamping claw and the clamping slot, the contact surfaces of the heat conduction medium 4 and the temperature sensor 2 are stably connected together.
In a fourth feasible technical solution, one selected from the contact surfaces of the heat conduction medium 4 and the temperature sensor 2 is provided with a locking hook, while the other is provided with a latch. Through the assembly of the locking hook and the latch, the contact surfaces of the heat conduction medium 4 and the temperature sensor 2 are stably connected together.
In a fifth feasible technical solution, the heat conduction medium 4 and the temperature sensor 2 are provided with a groove. After the contact surfaces of the heat conduction medium 4 and the temperature sensor 2 are connected, a strapping member is used to strap the heat conduction medium 4 and the temperature sensor 2 together at the groove position. The strapping member includes a strapping belt, a pipe collar, a hook lock, etc.
In a sixth feasible technical solution, the heat conduction medium 4 and the temperature sensor 2 are provided with a thread and a screw, respectively. Through the threaded connection between the thread and the screw, the contact surfaces of the heat conduction medium 4 and the temperature sensor 2 are stably connected together. The minimum structure of the threaded connection is M3 thread and screw; and the minimum torque is 0.2 Nm when the threaded connection structure is tightened.
In a seventh feasible technical solution, the heat conduction medium 4 and the temperature sensor 2 are respectively provided with a connection hole. A rivet passes through the connection holes, and the end of the rivet that passes through the connection holes is deformed to tighten the connecting holes, so that the heat conduction medium 4 and the temperature sensor 2 are stably connected together.
In an eighth feasible technical solution, in addition to the contact surfaces, the heat conduction medium 4 and the temperature sensor 2 respectively also have a welding surface. By melting and connecting the welding surfaces together using a welding machine, the heat conduction medium 4 and the temperature sensor 2 are stably connected together. The welding machine includes a hot melt welding machine and an ultrasonic welding machine.
In order to facilitate understanding and description, the present disclosure uses absolute positional relationships for expression. Unless otherwise specified, the directional word “upper” represents the upper side direction in
The above are only some specific examples of the present disclosure and cannot be used to limit the scope of the present disclosure. Therefore, the replacement of equivalent components, or equivalent changes and modifications made based on the patent protection scope of the present disclosure, should still belong to the scope of disclosure included in the present disclosure. In addition, combinations of the technical features, of the technical features and the technical solutions, and of the technical solutions in the present disclosure may be freely made for use.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202110939761.3 | Aug 2021 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2022/112063 | 8/12/2022 | WO |
