Temperature monitoring in cold supply chains

Information

  • Patent Grant
  • 11346724
  • Patent Number
    11,346,724
  • Date Filed
    Wednesday, June 3, 2020
    4 years ago
  • Date Issued
    Tuesday, May 31, 2022
    2 years ago
Abstract
Embodiments disclosed herein includes temperature monitoring in cold supply chains. In this regard, electrical conductors are affixed to containers in respective patterns that enables a set of containers to be arranged in a particular configuration in which the electrical conductors provide electrical connections between electrical conductors and, in aggregate, creates a sensing network that is operable to measure temperature of respective ones of the containers.
Description
BACKGROUND

Embodiments disclosed herein generally relate to cold chain distribution systems, and more specifically to a method and an apparatus for monitoring temperature in cold supply chains.


SUMMARY

In an aspect, the invention includes electrical conductors affixed to containers in respective patterns that enables a set of containers to be arranged in a particular configuration in which the electrical conductors provide electrical connections between electrical conductors and, in aggregate, creates a sensing network that is operable to measure temperature of respective ones of the containers.


The invention also features apparatus operable to implement the method described above and computer-readable media storing computer-readable instructions causing a computer to implement the method described above.





DESCRIPTION OF DRAWINGS


FIG. 1 is a diagrammatic view of a set of containers for transporting perishable goods.



FIG. 2 is an exploded view of a set of containers arranged in a stacking order.



FIG. 3 is diagrammatic view of a stacked set of containers providing wired network connectivity between the containers.





DETAILED DESCRIPTION

In the following description, like reference numbers are used to identify like elements. Furthermore, the drawings are intended to illustrate major features of exemplary embodiments in a diagrammatic manner. The drawings are not intended to depict every feature of actual embodiments nor relative dimensions of the depicted elements, and are not drawn to scale.



FIG. 1 shows a set of containers 10, 12, 14 for transporting perishable goods. Perishable goods may include fruits, vegetables, grains, beans, nuts, eggs, dairy, seed, flowers, meat, poultry, fish, and pharmaceuticals. The containers 10, 12, 14 typically are configured to be stacked on one another. In some examples, the containers includes shapes or features, such as grooves, notches or recesses that enable the containers to be stacked in a precise stable alignment. The containers 10, 1214 also are associated with different types of electrical routing segments 16, 18, 20.


In some examples, the electrical routing segments 16, 18, 20 are affixed to the exterior surfaces of the containers 10, 12, 14. In some of these examples, each of the electrical routing segments 16, 18, 20 includes a respective adhesive layer (e.g., a pressure sensitive adhesive) on one side with an optional overlying release layer that can be easily removed. In these embodiments, the electrical routing segments 16, 18, 20 can be affixed to the containers 10, 12, 14 by removing the release layers and pressing the electrical routing segments onto the sides of the containers. In some examples, the electrical routing segments 16, 18, 20 are affixed to or embedded in the containers 10, 12, and 14 during manufacture.


In some embodiments, each electrical routing segment 16, 18, 20 defines a respective routing path 22, 24, 26. For example, the routing segment 16 on the container 10 defines a vertical routing path that extends from the bottom of the container 10 to the top of the container 10. The electrical routing segment 18 defines a vertical routing path and a leftward routing path. The electrical routing segment 20 defines a vertical routing path and a rightward routing path. Other electrical routing segment configurations are designed to cover all permutations.


Referring to the exploded view of FIG. 2, the containers 10, 12, 14 may be stacked on top of one another with the terminal ends of the electrical routing segments extending over bottom and top portions of the respective containers with the terminal ends of the adjacent electrical routing segments on adjacent containers overlapping in precise alignment.


Each electrical routing segment 16, 18, 20 includes one or more electrical conductors, wires, or traces. In some embodiments, the one or more electrical conductors, wires, or traces are within a protective sheath or casing, which may be made of plastic. In other embodiments, the one or more electrical conductors, wires, or traces are not protected by a sheath or casing.


As shown in FIG. 2, the top terminal end 28 of the electrical routing segment 16 on container 10 and the bottom terminal end 30 of the electrical routing segment 32 on a container 34 have respective pairs of contact terminals 36, 38 that are used to interconnect the routing segments 16 and 32. In some examples, this process is repeated until all the boxes are interconnected by respective electrical connection topologies. For example, in the embodiment shown in FIG. 2, the top terminal end 20 of the electrical routing segment 26 on a container 14 and the bottom terminal end 30 of the electrical routing segment 32 on a container 34 have respective pairs of contact terminals 37, 39 that are used to interconnect the routing segment 26 with the routing segments 16, 26, and 32.



FIG. 3 shows a stack 40 of containers that are interconnected by a network of electrical routing segments.


In some examples, the terminal ends of the electrical routing segments 16 and 32 between containers are electrically connected to a capacitor that includes a dielectric material between electrically conducting plates. In these examples, the input ends of the electrical routing segments 16 and 32 are connected to a source of an alternating voltage to measure temperature as a function of the impedance of the capacitor, which depends on the dielectric properties and the design of the capacitor.


Referring to FIG. 3, in some embodiments, the network circuitry is implemented with at least two electrical conductors, wires, or traces that define respective electrical paths from a master device to each of a set of peripheral devices and a logic circuit to select an electrical path to the target container. The master device includes a master processor (CPU) that controls the peripheral devices. The peripheral devices include respective peripheral processors (CPUs) and respective universally unique identifiers (UUIDs). In some embodiments, each peripheral device is associated with a respective temperature sensor that is located in a respective one of the containers. In some examples, the master device and each of the peripheral devices communicates with each other over two wired connections. In operation, the master device sends a request to a peripheral device associated with a target temperature sensor. In response to the request, the peripheral device reads one or more temperature sensor values from the associated temperature sensor. The peripheral device then sends a reply containing the UUID of the peripheral device and the one or more temperature sensor values to a memory device or to the master device.


In some examples, the master device is equipped with Bluetooth® wireless communications technology to communicate the reported temperature measurements to a user or a network service.


In some embodiments, instead of measuring temperatures of the containers, the network circuitry includes a logic circuit to select an electrical path to a target container and an associated violation detection circuit associated with each peripheral device. In general, the violation detection circuit is configured to detect one or more instances in which ambient conditions compromise the quality of perishable, fresh, chilled/frozen foods, beverages, and temperature sensitive biomedical and pharmaceutical products. An example violation is an instance in which the temperature measured within a transport vehicle is greater than a threshold level. In this example, a sensor that includes two opposing electrically conducting strips separated by an electrically insulating material that has a conductivity that increases with temperature and creates a short circuit between electrically conducting strips in response to the temperature exceeding the threshold level. In some embodiments, the time of the violation is recorded automatically by either the master device or the peripheral device associated with the violation detection circuit.


In response to a violation, the master device is operable to check each row of containers for the violation using triangulation. In some embodiments, instead of measuring temperature at any point in time, the master device transmits signals over the wired connections to locate the source of the violation.


Examples of the subject matter described herein, including the disclosed systems, methods, processes, functional operations, and logic flows, can be implemented in data processing apparatus (e.g., computer hardware and digital electronic circuitry) operable to perform functions by operating on input and generating output. Examples of the subject matter described herein also can be tangibly embodied in software or firmware, as one or more sets of computer instructions encoded on one or more tangible non-transitory carrier media (e.g., a machine readable storage device, substrate, or sequential access memory device) for execution by data processing apparatus.


The details of specific implementations described herein may be specific to particular embodiments of particular inventions and should not be construed as limitations on the scope of any claimed invention. For example, features that are described in connection with separate embodiments may also be incorporated into a single embodiment, and features that are described in connection with a single embodiment may also be implemented in multiple separate embodiments. In addition, the disclosure of steps, tasks, operations, or processes being performed in a particular order does not necessarily require that those steps, tasks, operations, or processes be performed in the particular order; instead, in some cases, one or more of the disclosed steps, tasks, operations, and processes may be performed in a different order or in accordance with a multi-tasking schedule or in parallel.


Other embodiments are within the scope of the claims.

Claims
  • 1. Apparatus, comprising electrical conductors affixed to containers in respective patterns that enable the set of containers to be arranged in a particular configuration in which the electrical conductors provide electrical connections between electrical conductors and, in aggregate, creates a sensing network that is operable to measure temperatures of respective ones of the containers, and network circuitry that comprises respective electrical paths from a master device to each of a set of peripheral devices and a logic circuit to select an electrical path to a target container.
  • 2. The apparatus of claim 1, wherein the containers are stackable on one another.
  • 3. The apparatus of claim 2, wherein the containers comprise features that enable the containers to be stacked in a stable alignment.
  • 4. The apparatus of claim 3, wherein the features comprise one or more of grooves, notches, and recesses that provide engagement between adjacent containers.
  • 5. The apparatus of claim 1, wherein respective ones of the containers are associated with different types of electrical routing segments.
  • 6. The apparatus of claim 5, wherein each electrical routing segment comprises one or more electrical conductors.
  • 7. The apparatus of claim 5, wherein the different types of routing segments comprise a vertical routing segment that extends vertically from a bottom of a container to a top of the container.
  • 8. The apparatus of claim 7, wherein the vertical routing segment extends over an area of a top side of the container and over an area of a bottom side of the container.
  • 9. The apparatus of claim 5, wherein the different types of routing segments comprise a vertical routing segment that extends vertically from a bottom of a container to a top of the container and, additionally, extends horizontally in a first direction to a first side of the container.
  • 10. The apparatus of claim 9, wherein the horizontal routing segment extends over an area of the first side of the container.
  • 11. The apparatus of claim 5, wherein the different types of routing segments comprise a vertical routing segment that extends vertically from a bottom of a container to a top of the container and, additionally, extends horizontally in a second direction to a second side of the container.
  • 12. The apparatus of claim 11, wherein the horizontal routing segment extends over an area of the second side of the container.
  • 13. The apparatus of claim 1, wherein respective ones of the electrical conductors are embedded in respective adhesive routing segments.
  • 14. The apparatus of claim 13, wherein respective ones of the adhesive routing segments comprise overlying release layers.
  • 15. The apparatus of claim 1, wherein the master device is operable to control the peripheral devices each of which is associated with a respective peripheral processor, and each peripheral device is associated with a respective temperature sensor that is located in a respective one of the containers.
  • 16. The apparatus of claim 15, wherein the master device and each of the peripheral devices communicates with each other over two-wire connections.
  • 17. The apparatus of claim 15, wherein the master device is operable to send a request to a particular peripheral device associated with a target temperature sensor; in response to the request, the particular peripheral device reads one or more temperature sensor values from the target temperature sensor; and the particular peripheral device is operable to send a reply to the master device comprising an identifier of the particular peripheral device and the one or more temperature sensor values.
  • 18. The apparatus of claim 15, wherein the network circuitry comprises a logic circuit to select an electrical path to a target container and a respective violation detection circuit associated with each peripheral device; wherein the violation detection circuit is configured to detect one or more instances in which ambient conditions compromise the quality of one or more of perishables, fresh foods, chilled/frozen foods, beverages, and temperature sensitive biomedical and pharmaceutical products.
  • 19. The apparatus of claim 18, wherein at least one of the respective temperature sensors comprises two opposing electrically conducting strips separated by an electrically insulating material comprising a conductivity that increases with temperature and creates a short circuit between electrically conducting strips in response to the temperature exceeding the threshold level.
  • 20. The apparatus of claim 19, wherein in response to a violation, the master device is operable to check each row of containers for the violation using triangulation.
US Referenced Citations (115)
Number Name Date Kind
5478991 Watanabe Dec 1995 A
5495250 Ghaem Feb 1996 A
5499717 Hayashi Mar 1996 A
5838253 Wurz Nov 1998 A
5917433 Keillor Jun 1999 A
6372342 Karaoglu Apr 2002 B1
6375780 Tuttle et al. Apr 2002 B1
6404341 Reid Jun 2002 B1
6614392 Howard Sep 2003 B2
6919803 Breed Jul 2005 B2
7009517 Wood Mar 2006 B2
7020701 Gelvin et al. Mar 2006 B1
7048194 Minami et al. May 2006 B2
7177054 Silverbrook et al. Feb 2007 B2
7259030 Daniels et al. Aug 2007 B2
7299990 Hoshina Nov 2007 B2
7321167 Zhong et al. Jan 2008 B2
7405656 Olsen Jul 2008 B2
7511616 Lake Mar 2009 B2
7540603 Otsuki Jun 2009 B2
7722249 Kim et al. May 2010 B2
7838844 Wagner Nov 2010 B2
7884727 Tran Feb 2011 B2
8062735 Bi Nov 2011 B2
8072620 Yamamoto et al. Dec 2011 B2
8110254 Sharma Feb 2012 B1
8171791 Sy et al. May 2012 B2
8269633 Hollander et al. Sep 2012 B2
8292173 Yturralde et al. Oct 2012 B2
8401238 Stahlin et al. Mar 2013 B2
8448530 Leuenberger et al. May 2013 B2
8658455 Shin et al. Feb 2014 B2
8716629 Klewer et al. May 2014 B2
8786510 Coleman Jul 2014 B2
8833664 Choi Sep 2014 B2
8879276 Wang Nov 2014 B2
8971673 Beinhocker Mar 2015 B2
9015071 Breed Apr 2015 B2
9070286 Moore Jun 2015 B2
9137637 Bilal et al. Sep 2015 B2
9159635 Elolampi et al. Oct 2015 B2
9182231 Skaaksrud Nov 2015 B2
9183738 Allen et al. Nov 2015 B1
9189226 Driesen et al. Nov 2015 B2
9372123 Li et al. Jun 2016 B2
9473902 Bilal et al. Oct 2016 B2
9496582 Lim et al. Nov 2016 B1
9543495 Paschkewitz et al. Jan 2017 B2
9543549 Bai et al. Jan 2017 B2
9583428 Rafferty et al. Feb 2017 B2
9632050 Zhong et al. Apr 2017 B2
9643460 Peine et al. May 2017 B2
9644401 Nguyen et al. May 2017 B2
9753568 McMillen Sep 2017 B2
9781825 Farkas et al. Oct 2017 B2
9824329 Stirling et al. Nov 2017 B2
9860688 Kulkarni et al. Jan 2018 B2
20030000128 Wood et al. Jan 2003 A1
20030018927 Gadir et al. Jan 2003 A1
20040044493 Coulthard Mar 2004 A1
20040131761 Shakespeare Jul 2004 A1
20060100299 Malik et al. May 2006 A1
20070049291 Kim et al. Mar 2007 A1
20070095905 Kadaba May 2007 A1
20070287473 Dupray Dec 2007 A1
20080184795 Woodard Aug 2008 A1
20080198002 Bartholf et al. Aug 2008 A1
20080239282 Zou et al. Oct 2008 A1
20090051530 Brooks et al. Feb 2009 A1
20090072974 Miyashita et al. Mar 2009 A1
20090174600 Mazlum et al. Jul 2009 A1
20090192709 Yonker et al. Jul 2009 A1
20090196267 Walker Aug 2009 A1
20100082870 Tokuhara Apr 2010 A1
20100096181 Nakamura Apr 2010 A1
20100180701 Daniel et al. Jul 2010 A1
20100201519 Dagher Aug 2010 A1
20100230498 Atherton Sep 2010 A1
20100299401 Lloyd Nov 2010 A1
20110251469 Varadan Oct 2011 A1
20120271540 Miksa et al. Oct 2012 A1
20120278676 Teraura Nov 2012 A1
20130107770 Marsden et al. May 2013 A1
20130131980 Ginsberg May 2013 A1
20130250357 Yu Sep 2013 A1
20140014403 Miller et al. Jan 2014 A1
20140240088 Robinette et al. Aug 2014 A1
20140265915 Huang et al. Sep 2014 A1
20140268780 Wang Sep 2014 A1
20140274139 Bilal et al. Sep 2014 A1
20140317406 Lewis et al. Oct 2014 A1
20150034635 Dagher Feb 2015 A1
20150154531 Skaaksrud Jun 2015 A1
20150324745 Goodall Nov 2015 A1
20150349667 Andosca et al. Dec 2015 A1
20150354973 Wang et al. Dec 2015 A1
20150382154 Bilal et al. Dec 2015 A1
20160011074 Mian et al. Jan 2016 A1
20160026213 Li et al. Jan 2016 A1
20160147353 Fliz et al. May 2016 A1
20160205509 Hopcraft et al. Jul 2016 A1
20160233927 Wu Aug 2016 A1
20160270215 Goto Sep 2016 A1
20160370210 Kapusta et al. Dec 2016 A1
20160377440 Dorum Dec 2016 A1
20170017872 Kato et al. Jan 2017 A1
20170025547 Cho et al. Jan 2017 A1
20170039666 Kuersten et al. Feb 2017 A1
20170079144 Coleman et al. Mar 2017 A1
20170161679 Stingel et al. Jun 2017 A1
20170337405 Schutz Nov 2017 A1
20180003507 Arslan et al. Jan 2018 A1
20180046964 Leoni et al. Feb 2018 A1
20180104609 Musliner Apr 2018 A1
20180165568 Khoche Jun 2018 A1
Foreign Referenced Citations (9)
Number Date Country
1786143 May 2007 EP
2008239282 Oct 2008 JP
2009230500 Oct 2009 JP
2011090670 May 2011 JP
2012141995 Jul 2012 JP
2014195756 Dec 2014 WO
2016120628 Aug 2016 WO
2017046699 Mar 2017 WO
2017100707 Jul 2017 WO
Non-Patent Literature Citations (19)
Entry
PCT Application No. PCT/US2018/064919, Written Opinion, dated Apr. 5, 2019, 7 pages.
Dementyev, SensorTape: Modular and Programmable 3D-Aware Dense Sensor Network on a Tape, In Proc. of UIST 2015.
Griffin et al., Adhesive RFID Sensor Patch for Monitoring of Sweat Electrolytes, in IEEE Transactionson Bio-Medical Engineering, Nov. 2014.
Pyo et al., Development of a Map Matching Method Using the Multiple Hypothesis Technique, 2001 IEEE.
Liu, Survey of Wireless Based Indoor Localization Technologies, arXiV:1709.01015v2 [cs.N1] Mar. 14, 2018.
Cheung et al., Least Squares Algorithms for Time-of-Arrival-Based Mobile Location, IEEE Transactions on Signal Processing, vol. 52, No. 4, Apr. 2004, pp. 1121-1128.
Frazier et al., Fully-Drawn Carbon-Based Chemical Sensors on Organic and Inorganic Surfaces, Lab Chip. Oct. 21, 2014; 14(20): 4059-4066. doi:10.1039/c4lc00864b.
Alsheikh et al., Machine Learning in Wireless Sensor Networks: Algorithms, Strategies, and Applications, arXiv:1405.4463v2 [cs.NI] Mar. 19, 2015.
Farooqui et al., A Paper Based Ink Jet Printed Real Time Location Tracking TAB, 2013 IEEE MTT-S International Microwave Symposium Digest (MTT).
Gong et al., Low-Cost Sensor Tape for Environment Sensing Based on Roll-to-Roll Manufacturing Process, In Proc. of IEEE Sensors 2012.
Olyazadeh, Least Square Approach on Indoor Positioning Measurement Techniques, 2012.
Wimmer et al., Modular and Deformable Touch-Sensitive Surfaces Based on Time Domain Reflectometry, UIST 11 Proceedings of the 24th Annual ACM Symposium on User Interface Software and Technology, pp. 517-526, Santa Barbara,CA, USA, Oct. 16-19, 2011.
Olberding et al., A Cuttable Multi-Touch Sensor, Proceeding UIST, 13 Proceedings of the 26th Annual ACM Symposium on User Interface Software and Technology, pp. 245-254, St. Andrews, Scotland, United Kingdom, Oct. 8-11, 2013.
Zhang et al., Deep Neural Networks for Wireless Localization in Indoor and Outdoor Environments, Neurocomputing 194 (2016), pp. 279-287.
Roundy et al., Energy Harvester for Rotating Environments Using Offset Pendulum and Nonlinear Dynamics, Smart Materials and Structures, IOP Publishing Ltd, Sep. 9, 2014.
Ku et al., Joint Power Waveforming and Beamforming for Wireless Power Transfer, IEEE Transactions on Signal Processing, vol. 65,No. 24,Dec. 15, 2017, p. 6409.
PCT Application No. PCT/US2019/042488, International Search Report and Written Opinion, dated Nov. 5, 2019.
Shen et al., A Mobility Framework to Improve Heterogeneous Wireless Network Services, Inderscience Enterprises Ltd., 2011.
Iacono, Wireless Sensor Network Protocols, Universidad De Mendoza, Argentina, 2011.
Related Publications (1)
Number Date Country
20200386623 A1 Dec 2020 US
Provisional Applications (1)
Number Date Country
62857807 Jun 2019 US