This application claims the benefit of the filing date under 35 U.S.C. ยง 119(a)-(d) of Indian Patent Application No. 201941049895, filed on Dec. 4, 2019.
The present invention relates to a sensor assembly and, more particularly, to a temperature sensor assembly.
Temperature sensors are used in a variety of fields, for example in the automotive field. Often, temperature pins, also referred to as temperature lances, are used to measure a temperature at a defined location. The temperature pin can, for example, be a part of an electric engine and positioned at the hottest point in the engine where a measurement of the temperature is possible. A problem associated with current temperature sensors is that the contacting of temperature pins that have different shapes, for example due to the production process or because different engine models are used, is difficult.
A temperature sensor assembly including a carrier part having a receptacle for a temperature pin, a sensor element for measuring a temperature, and a pushing element pushing the sensor element into the receptacle.
The invention will now be described by way of example with reference to the accompanying Figures, of which:
The invention will now be described in greater detail and in an exemplary manner using advantageous embodiments and with reference to the drawings. The described embodiments are only possible configurations in which, however, the individual features as described herein can be provided independently of one another or can be omitted.
A temperature sensor assembly 100 according to an embodiment is shown in
In order to sense the temperature at the temperature pin 50, the temperature sensor assembly 100 further comprises a sensor element 30, shown in
The temperature pins 50 are usually shaped differently due to manufacturing tolerances. For example, they can be welded and the welding can result in different dimensions or shapes. In order to always contact the temperature pin 50 correctly, the temperature sensor assembly 100 further comprises a pushing element 40, shown in
The pushing element 40 is adapted to push the sensor element 30 into the receptacle 20 at a side 25 of the receptacle 20 and thus onto a side of the temperature pin 50, as shown in FIG. 2. The pushing element 40 pushes the sensor element 30 along a transverse direction T that is transverse, in particular perpendicular to an insertion direction I of the receptacle 20, along which the temperature pin 50 is inserted into the receptacle 20. The sensor element 30 and/or the pushing element 40 can form a side of the receptacle 20. The pushing element 40 allows the contacting of differently shaped temperature pins 50. It is adapted to push the sensor element 30 onto differently shaped temperature pins 50.
As shown in
The pushing element 40 contacts the sensor element 30 at the central curve 44. In
The temperature sensor assembly 100, as shown in
The temperature sensor assembly 100, as shown in
As shown in
At least one terminal 65 in the connection section 60 is connected to the sensor element 30. Such a connection can be either direct or indirect via an intermediate element such as a wire or cable 68.
The carrier part 10 and the housing part 70 are adapted to be attached to each other, as shown in
The carrier part 10 comprises a housing part receptacle 17 for at least partially receiving the housing part 70, as shown in the embodiment of
The temperature sensor assembly 100, as shown in
In
Each of the two embodiments can be seen as a set 200 for a temperature sensor assembly 100, shown in
The set 100, in an embodiment, further comprises at least one cable 68 for connecting the sensor element 30 to the terminal 65, as shown in
A set 200 can in particular comprise at least two different housing elements 70, 70A, 70B, differing for example in dimensions, in particular lengths, or the kind and number of fixing members 77. With such a set 200 the user can create an appropriate temperature sensor assembly 100 for different types of cars.
In order to improve the temperature measurement, thermal compound, also known as heat paste or thermal paste, can be present in the receptacle 20. The thermal compound can in particular fill the area between and around the temperature pin 50 and the sensor element 30. The thermal compound can be premounted in the receptacle 20 before the temperature pin is inserted or be applied later.
Number | Date | Country | Kind |
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201941049895 | Dec 2019 | IN | national |
Number | Name | Date | Kind |
---|---|---|---|
3099922 | Crocker | Aug 1963 | A |
3309237 | Kelchner et al. | Mar 1967 | A |
4643586 | Hansen | Feb 1987 | A |
4866410 | Deppe | Sep 1989 | A |
4959633 | Kiraly | Sep 1990 | A |
20100254428 | Rose | Oct 2010 | A1 |
20110150034 | Breimon | Jun 2011 | A1 |
20130182745 | Hertel et al. | Jul 2013 | A1 |
20160320249 | Reiman et al. | Nov 2016 | A1 |
20170122814 | Motooka et al. | May 2017 | A1 |
Number | Date | Country |
---|---|---|
108627257 | Oct 2018 | CN |
202010013086 | May 2011 | DE |
102022207562 | Jan 2024 | DE |
4040125 | Aug 2022 | EP |
2017227557 | Dec 2017 | JP |
WO-0055023 | Sep 2000 | WO |
WO-2015197352 | Dec 2015 | WO |
2016007685 | Jan 2016 | WO |
Entry |
---|
Translation of WO2015197352A1 (Year: 2015). |
Translation of DE202010013086U1 (Year: 2011). |
Extended European Search Report, European Application No. 20211408.8-1001, European Filing Date, Apr. 29, 2021. |
Examination Report from the European Patent Office dated Feb. 24, 2023, corresponding to Application No. 20 211 408.8-1001, 5 pages. |
Number | Date | Country | |
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20210172810 A1 | Jun 2021 | US |