Patent Grant
9447995
In some embodiments, a regulated thermal transfer device for a storage container includes: a phase change material unit, the phase change material unit including one or more walls surrounding a phase-change material region, and an aperture in the one or more walls; a heat pipe with a first end positioned within the phase change material unit, and a second end; a thermoelectric unit thermally connected to the second end of the heat pipe; a heat sink connected to the thermoelectric unit, and positioned to radiate heat away from the thermoelectric unit; and an electronic controller operably connected to the thermoelectric unit; wherein the regulated thermal transfer device is of a size and shape to be positioned so that the phase change material unit is within a storage region of a temperature-stabilized storage container, and the thermoelectric unit is positioned adjacent to an external surface of the temperature-stabilized storage container.
In some embodiments, a temperature-stabilized storage container includes: one or more sections of ultra-efficient insulation material substantially defining a temperature-stabilized storage container including a temperature-stabilized storage region with a single access aperture to the temperature-stabilized storage region; a phase change material unit attached to an internal surface of the temperature-stabilized storage region; a heat pipe with a first end positioned within the phase-change material unit, and a second end positioned adjacent to the single access aperture on an outer surface of the temperature-stabilized storage container; a thermoelectric unit in contact with the second end of the heat pipe; a heat sink connected to the thermoelectric unit and positioned to radiate heat away from the thermoelectric unit; and an electronic controller connected to the thermoelectric unit.
In some embodiments, a temperature-stabilized storage container includes: an outer wall substantially defining an outer surface of a storage container, the outer wall including an outer aperture in an upper region; an inner wall substantially defining a temperature-stabilized storage region internal to the storage container, the inner wall including an inner aperture in an upper region; a gap between the outer wall and the inner wall; a conduit connecting the outer aperture to the inner aperture; one or more sections of ultra-efficient insulation material within the gap; a phase-change material unit attached to an internal surface of the temperature-stabilized storage region; a heat pipe with a first end positioned within the phase-change material unit, and a second end positioned adjacent to the outer aperture; a thermoelectric unit in contact with the second end of the heat pipe; a heat sink connected to the thermoelectric unit and positioned to radiate heat away from the thermoelectric unit; and an electronic controller connected to the thermoelectric unit.
The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.
In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here.
The use of the same symbols in different drawings typically indicates similar or identical items unless context dictates otherwise.
In some embodiments, a temperature-stabilized storage container includes a substantially thermally sealed storage container. See, for example, U.S. patent application Ser. No. 13/906,909, entitled TEMPERATURE-STABILIZED STORAGE SYSTEMS WITH REGULATED COOLING, naming Jonathan Bloedow, Ryan Calderon, David Gasperino, William Gates, Roderick A. Hyde, Edward K. Y. Jung, Shieng Liu, Nathan P. Myhrvold, Nathan John Pegram, Clarence T. Tegreene, Charles Whitmer, Lowell L. Wood, Jr. and Ozgur Emek Yildirim as inventors, filed 31 May, 2013, which is incorporated by reference.
In some embodiments, a temperature-stabilized storage container can be of a portable size and shape, for example a size and shape within reasonable expected portability estimates for an individual person. The temperature-stabilized storage container can be configured of a size and shape for carrying or hauling by an individual person. For example, in some embodiments the temperature-stabilized storage container has a mass that is less than approximately 50 kilograms (kg), or less than approximately 30 kg. For example, in some embodiments the temperature-stabilized storage container has a length and width that are less than approximately 1 meter (m). The temperature-stabilized storage container 100 illustrated in
In some embodiments, a temperature-stabilized storage container includes a base attached to the exterior of the container at a region of the container positioned to be a lower region during expected use of the container. The temperature-stabilized storage container 100 illustrated in
The temperature-stabilized storage container 100 can include, in some embodiments, one or more handles 170 attached to an exterior surface of the container 100, wherein the handles 170 are configured for transport of the container 100. The handles can be fixed on the surface of the container, for example welded, fastened or glued to the surface of the container. The handles can be operably attached but not fixed to the surface of the container, such as with a harness, binding, hoop or chain running along the surface of the container. The handles can be positioned to retain the container with an access conduit on the top of the container during transport to minimize thermal transfer from the exterior of the container through the access conduit.
The temperature-stabilized storage container can include electronic components. For example,
Depending on the embodiment, one or more power sources can be attached to the temperature-stabilized storage container, wherein the power source is configured to supply power to circuitry within the container or within a regulated thermal transfer device affixed to the container. For example, a photovoltaic unit can be attached to the exterior surface of the temperature-stabilized storage container. For example, a photovoltaic unit can be attached to a building or structure that the container is placed within, and a wire or similar electrical conduit can connect the circuitry within the container or within a regulated thermal transfer device affixed to the container to the external photovoltaic unit. For example, a battery unit can be attached to the exterior surface of the temperature-stabilized storage container. For example, one or more wires can be positioned within an access conduit of the temperature-stabilized storage container to supply power to circuitry within the container or within a regulated thermal transfer device affixed to the temperature-stabilized storage container. For example, one or more power sources can be attached to an exterior surface of the temperature-stabilized storage container, wherein the power source is configured to supply power to circuitry within the container. For example, one or more power sources can be attached to an exterior surface of the temperature-stabilized storage container, wherein the power source is configured to supply power to circuitry integral to a regulated thermal transfer device affixed to the temperature-stabilized storage container. A power source can include wirelessly transmitted power sources, such as described in U.S. Patent Application No. 2005/0143787 to Boveja, titled “Method and system for providing electrical pulses for neuromodulation of vagus nerve(s), using rechargeable implanted pulse generator,” which is herein incorporated by reference. A power source can include a magnetically transmitted power source. A power source can include a battery. A power source can include a solar panel, such as a photovoltaic panel. A power source can include an AC power source with a converter to supply DC current to the circuitry within the temperature-stabilized storage container or within a regulated thermal transfer device affixed to the temperature-stabilized storage container.
Depending on the embodiment, one or more temperature sensors can be attached to an exterior surface of the temperature-stabilized storage container. The one or more temperature sensors can be configured, for example, to display the ambient temperature at the surface of the temperature-stabilized storage container. The one or more temperature sensors can be configured, for example, to transmit data to one or more system. The one or more temperature sensors can be configured, for example, as part of a temperature monitoring system.
Depending on the embodiment, one or more transmission units can be operably attached to the temperature-stabilized storage container. For example, one or more transmission units can be operably attached to the exterior surface of the temperature-stabilized storage container. For example, one or more transmission units can be operably attached to an interior unit within the temperature-stabilized storage container. For example, one or more transmission units can be operably attached to the regulated thermal transfer device affixed to the temperature-stabilized storage container. Depending on the embodiment, one or more receiving units can be operably attached to the temperature-stabilized storage container. For example, one or more receiving units can be operably attached to the exterior surface of the temperature-stabilized storage container. For example, one or more receiving units can be operably attached to an interior unit within the temperature-stabilized storage container. For example, one or more receiving units can be operably attached to the regulated thermal transfer device affixed to the temperature-stabilized storage container.
In some embodiments, a regulated thermal transfer device includes a phase change material unit, the phase change material unit including one or more walls surrounding a phase-change material region, and an aperture in the one or more walls. For example, in the illustrated embodiment of
In some embodiments, the phase change material unit includes additional material positioned in a location to encourage freezing of the phase change material at that location. In some embodiments, the phase change material unit includes one or more nucleation agents. For example, a phase change material unit can include water as a phase change material and nucleation agents, such as silver iodide or plant-based nucleating agents such as Ina proteins from Pseudomonas syringae. In some embodiments, the phase change material unit includes a mechanical shock unit, such as a piezo actuator or a solenoid unit positioned to nucleate ice formation in supercooled phase change material, such as water. In some embodiments, a phase change material includes a second thermoelectric unit positioned to provide additional cooling to the phase change material unit.
“Phase change material” as used herein, includes materials that change their state (e.g. liquid to solid) at specific temperatures with a high heat of fusion. For example, in some embodiments the phase change material is water or ice. For example, in some embodiments the phase change material is an organic or inorganic material. The phase change material for an embodiment can be selected based on factors such as cost, thermal capacity, toxicity, mass and freezing temperature for a specific phase change material. In some embodiments a phase change material includes PureTemp™ 4 (available from Entropy Solutions Inc.), with a melting point of 5° C. In some embodiments a phase change material includes Phase 5™, (available from Cryopak Inc.), with a melting point of 5° C. In some embodiments a phase change material includes materials with a melting point up to 8° C. In some embodiments a phase change material includes materials with a melting point between 2° C. and 8° C. In some embodiments, the phase change material is a hydrocarbon-based material. In some embodiments, the phase change material is a salt-water solution. In some embodiments, the phase change material is a salt-hydrate solution, wherein the salt is present in a crystalline form. In some embodiments, the phase change material is a salt eutectic solution. In some embodiments, the phase change material includes one or more clathrates, for example tetrahydrofuran clathrate. In some embodiments, the phase change material is structured as beads or pellets within the phase change material unit. In some embodiments, the phase change material is structured as a solid or semi-solid three-dimensional unit within the phase change material unit, so that no internal containment structure for the phase change material is required. For example, in some embodiments a phase change material can be structured as a semi-solid gel, or a solid crystalline array.
In some embodiments, a phase change material unit can include one or more additional elements positioned to enhance thermal transfer within the phase change material unit. For example, in some embodiments the phase change material unit includes an expanded graphite material saturated with a hydrocarbon-based phase change material. For example, during manufacture, one or more 10% graphite sheets can be saturated with a hydrocarbon-based phase change material and the combined materials positioned within a phase change material unit. In some embodiments, a phase change material unit can include one or more thermal conduction elements, such as plate structures, linear structures, or other features fabricated from thermally-conductive material and positioned within the phase change material unit in a manner to enhance thermal transfer within the phase change material unit. For example, in some embodiments a phase change material unit can include one or more mesh structures fabricated from copper and positioned to enhance thermal transfer within the phase change material unit.
The phase change material unit illustrated in
In some embodiments, a regulated thermal transfer device also includes a phase change material unit with a second internal container including phase change material. For example, a second internal container can include the same phase change material as the main container. For example, a second internal container can include a second phase change material. For example, the second internal container can include an internal enclosure with phase change material sealed within the internal closure. In some embodiments, a phase change material unit includes a plurality of internal containers, each including phase change material. The phase change material can be the same in each of the plurality of internal containers. The phase change material can be different among the plurality of internal containers. The one or more internal containers within the phase change material unit can be positioned, for example, between the exterior of the phase change material unit and the heat pipe within the phase change material unit. The one or more internal containers within the phase change material unit can be positioned, for example, between the internal storage region of the container and the heat pipe within the phase change material unit.
In some embodiments, a regulated thermal transfer device also includes a heat pipe with a first end positioned within the phase change material unit, and a second end traversing the aperture of the one or more walls of the phase change material unit. For example, in some embodiments the heat pipe includes a substantially tubular structure. For example, in some embodiments the heat pipe includes a substantially vertical structure when the regulated thermal transfer device is positioned for use within a storage container. See, e.g.
In some embodiments, a regulated thermal transfer device also includes a thermoelectric unit thermally connected to the second end of the heat pipe. The thermoelectric unit is positioned adjacent to an external surface of the temperature-stabilized storage container. For example, in some embodiments the thermoelectric unit includes a Peltier device. For example, in some embodiments the thermoelectric unit is positioned to transfer thermal energy away from the second end of the heat pipe. For example, in some embodiments the thermoelectric unit is positioned to transfer thermal energy to the heat sink connected to the thermoelectric unit. For example, the thermoelectric unit can include a side in thermal contact with a heat sink.
In some embodiments, a regulated thermal transfer device also includes a heat sink connected to the thermoelectric unit, and positioned to radiate heat away from the thermoelectric unit. For example, in some embodiments the heat sink includes a passive heat sink device. For example, a passive heat sink can include unpowered components, such as radiative fins, a heat block, and one or more heat pipes positioned to radiate heat away from the thermoelectric unit. For example, in some embodiments the heat sink includes an active heat sink device, the active heat sink device operably coupled to the controller. For example, an active heat sink device can include one or more fan units positioned to circulate air and thereby radiate heat away from the thermoelectric unit. For example, in some embodiments a fan is attached to a shell (see, e.g. shell 130 in
In some embodiments, a regulated thermal transfer device also includes an electronic controller operably connected to the thermoelectric unit. For example, in some embodiments an electronic controller is included within a circuitry unit (see, e.g.
Some embodiments of a regulated thermal transfer device also include a temperature sensor attached to the phase change material unit; and a connector between the temperature sensor and the electronic controller. For example, an electronic temperature sensor can be attached to the wall of a phase change material unit and a wire connector can be positioned within the phase change material unit, traversing the adiabatic region of the regulated thermal transfer device, and connected to an electronic controller within the attached a circuitry unit. Some embodiments of a regulated thermal transfer device also include a connector attached to the electronic controller, the connector configured to provide electricity to the regulated thermal transfer device from an external power source. For example, in some embodiments an external power source includes a photovoltaic unit. For example, in some embodiments an external power source includes a battery. For example, in some embodiments an external power source includes a municipal power supply.
Some embodiments of a regulated thermal transfer device also include a communications unit operably coupled to the electronic controller. For example, a communications unit can include a transmitter, such as a Bluetooth™ transmitter. For example, a communications unit can include a receiver. For example, a communications unit can include an antenna. For example, a communications unit can include a digital memory device.
Some embodiments of a regulated thermal transfer device also include a second phase change material unit including one or more walls surrounding a phase-change material region, and an aperture in the one or more walls, and a second heat pipe with a first end positioned within the second phase change material unit, and a second end thermally connected to the thermoelectric unit. The second phase change material unit can be configured, for example, to be positioned distal to the first phase change material unit within a storage region of the temperature-stabilized storage container. The second phase change material unit can be configured, for example, to be positioned within a second storage region of the temperature-stabilized storage container.
The embodiment illustrated in
In the embodiment shown in
In some embodiments, a temperature-stabilized storage container includes wherein the conduit is substantially vertical when the temperature-stabilized storage container is positioned for use. For example, in the embodiment shown in
In some embodiments, a temperature-stabilized storage container includes at least one section of ultra-efficient insulation material. In some embodiments, a temperature-stabilized storage container includes one or more sections of ultra-efficient insulation material substantially defining a temperature-stabilized storage container including a temperature-stabilized storage region with a single access aperture to the temperature-stabilized storage region. In the embodiment shown in
In some embodiments, the circuitry unit includes one or more controllers and one or more memory units. As described above, the regulated thermal transfer device may control the temperature in the temperature-stabilized storage region by controlling operation of the one or more thermoelectric unit integral to the regulated thermal transfer device. A controller of the circuitry unit according to an embodiment can include at least one processor coupled to a power source (e.g., a photovoltaic panel) and to a power management unit. The controller can include a processor configured to direct a power management unit to provide power to the thermoelectric unit in response to input from a temperature sensor within the temperature-stabilized storage region of a temperature-stabilized storage container.
For instance, a thermoelectric unit may be connected at a power output connection to the circuitry unit. A controller within the circuitry unit may direct a power management unit to supply power to the power output connection and to the thermoelectric unit. As such, by controlling whether the thermoelectric unit operates or voltage provided to the thermoelectric unit, the controller can control the temperature in the temperature-stabilized storage region of a temperature-stabilized storage container. In other words, for example, the controller may direct the thermoelectric unit to remove heat from the phase change material unit until a predetermined portion of the phase change material is at a suitable temperature or is in a solid phase. Consequently, the controller can control the temperature in the storage compartment to within about ±1° C.
The controller and the power management unit also may adjust or transform the power received from the power source to a suitable voltage or, for example, may convert the power to direct current. For instance, as described above, the power source may include a photovoltaic panel. In some operating conditions, the output voltage from the photovoltaic panel may vary (e.g., due to variance in exposure to light). The controller and the power management unit may convert the power received from the photovoltaic panel to a suitable voltage, which may be further supplied to other elements or components of the regulated thermal transfer device, such as to the controller and to the thermoelectric unit, among others. In other words, the circuitry unit may be programmed to receive varying or variable voltage from the power source and to regulate such voltage to further provide suitable voltage to the heat pump.
In an embodiment, the power output connection may be coupled to a memory, which may contain operating instructions for the power output connection. Specifically, in an embodiment, the memory may include instructions about desirable temperature or temperature distribution in the phase change material unit. For example, the memory may include instructions that relate change in volume of the phase change material unit to a suitable temperature distribution therein.
For instance, the phase change material unit may include a whase change material that is water. As water changes phase from liquid to solid, the total volume of the water in the phase change material unit will change. Furthermore, the initial volume of the water (e.g., when all of the water is in a liquid phase) may be known or stored in the memory. Accordingly, the circuitry unit may receive information about the volume (e.g., from one or more sensors) of the phase change material unit and may calculate change in volume. Moreover, the processor may calculate the amount of solid phase change material. Hence, the instructions stored in the memory may allow the processor to determine the amount of solid phase PCM or temperature distribution in the phase change material unit.
In additional or alternative embodiments, the instructions stored in the memory also may allow the processor to use one or more temperature readings from the phase change material unit to control operation of the thermoelectric unit. For instance, the processor may receive a single or multiple temperature readings (e.g., from sensors) indicative of the temperature in one or more zones in the phase change material unit. When the temperature in the predetermined one or more zone in the phase change material unit is at a predetermined level, as set in the instructions in the memory, the processor may stop operation of the thermoelectric unit.
In any case, the memory may include instructions that may allow the processor to determine whether to direct power management unit to supply power to the thermoelectric unit connected at power output connection, thereby controlling the temperature in the phase change material unit and, thus, in the temperature-stabilized storage region of a temperature-stabilized storage container. For instance, the processor may maintain operation of the thermoelectric unit until reaching a predetermined temperature level (e.g., 3° C.).
The memory also may include instructions regarding priority or hierarchy of power needs. In other words, when the power received from the power source is insufficient to power all elements or components connected at the power output connection, the processor may use the priority instructions to direct the power management unit to provide power to elements or components indicated as having priority over other elements or components. For instance, the processor may give priority to providing power to the controller over the thermoelectric unit. In an embodiment, the priority hierarchy may be as follows, listed from highest to lowest: controller (or battery attached to the controller, if any); thermoelectric unit of the heat sink unit, fan for the heat sink unit (if any); display unit (if any).
The state of the art has progressed to the point where there is little distinction left between hardware, software (e.g., a high-level computer program serving as a hardware specification), and/or firmware implementations of aspects of systems; the use of hardware, software, and/or firmware is generally (but not always, in that in certain contexts the choice between hardware and software can become significant) a design choice representing cost vs. efficiency tradeoffs. There are various vehicles by which processes and/or systems and/or other technologies described herein can be effected (e.g., hardware, software (e.g., a high-level computer program serving as a hardware specification), and/or firmware), and that the preferred vehicle will vary with the context in which the processes and/or systems and/or other technologies are deployed. For example, if an implementer determines that speed and accuracy are paramount, the implementer may opt for a mainly hardware and/or firmware vehicle; alternatively, if flexibility is paramount, the implementer may opt for a mainly software (e.g., a high-level computer program serving as a hardware specification) implementation; or, yet again alternatively, the implementer may opt for some combination of hardware, software (e.g., a high-level computer program serving as a hardware specification), and/or firmware in one or more machines, compositions of matter, and articles of manufacture, limited to patentable subject matter under 35 U.S.C. §101. Hence, there are several possible vehicles by which the processes and/or devices and/or other technologies described herein may be effected, none of which is inherently superior to the other in that any vehicle to be utilized is a choice dependent upon the context in which the vehicle will be deployed and the specific concerns (e.g., speed, flexibility, or predictability) of the implementer, any of which may vary.
In some implementations described herein, logic and similar implementations may include computer programs or other control structures. Electronic circuitry, for example, may have one or more paths of electrical current constructed and arranged to implement various functions as described herein. In some implementations, one or more media may be configured to bear a device-detectable implementation when such media hold or transmit device detectable instructions operable to perform as described herein. In some variants, for example, implementations may include an update or modification of existing software (e.g., a high-level computer program serving as a hardware specification) or firmware, or of gate arrays or programmable hardware, such as by performing a reception of or a transmission of one or more instructions in relation to one or more operations described herein. Alternatively or additionally, in some variants, an implementation may include special-purpose hardware, software (e.g., a high-level computer program serving as a hardware specification), firmware components, and/or general-purpose components executing or otherwise invoking special-purpose components. Specifications or other implementations may be transmitted by one or more instances of tangible transmission media as described herein, optionally by packet transmission or otherwise by passing through distributed media at various times.
Alternatively or additionally, implementations may include executing a special-purpose instruction sequence or invoking circuitry for enabling, triggering, coordinating, requesting, or otherwise causing one or more occurrences of virtually any functional operation described herein. In some variants, operational or other logical descriptions herein may be expressed as source code and compiled or otherwise invoked as an executable instruction sequence. In some contexts, for example, implementations may be provided, in whole or in part, by source code, such as C++, or other code sequences. In other implementations, source or other code implementation, using commercially available and/or techniques in the art, may be compiled//implemented/translated/converted into a high-level descriptor language (e.g., initially implementing described technologies in C or C++ programming language and thereafter converting the programming language implementation into a logic-synthesizable language implementation, a hardware description language implementation, a hardware design simulation implementation, and/or other such similar mode(s) of expression). For example, some or all of a logical expression (e.g., computer programming language implementation) may be manifested as a Verilog-type hardware description (e.g., via Hardware Description Language (HDL) and/or Very High Speed Integrated Circuit Hardware Descriptor Language (VHDL)) or other circuitry model which may then be used to create a physical implementation having hardware (e.g., an Application Specific Integrated Circuit).
The foregoing detailed description has set forth various embodiments of the devices and/or processes via the use of block diagrams, flowcharts, and/or examples. Insofar as such block diagrams, flowcharts, and/or examples contain one or more functions and/or operations, it will be understood that each function and/or operation within such block diagrams, flowcharts, or examples can be implemented, individually and/or collectively, by a wide range of hardware, software (e.g., a high-level computer program serving as a hardware specification), firmware, or virtually any combination thereof, limited to patentable subject matter under 35 U.S.C. 101. In an embodiment, several portions of the subject matter described herein may be implemented via Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), digital signal processors (DSPs), or other integrated formats. However, some aspects of the embodiments disclosed herein, in whole or in part, can be equivalently implemented in integrated circuits, as one or more computer programs running on one or more computers (e.g., as one or more programs running on one or more computer systems), as one or more programs running on one or more processors (e.g., as one or more programs running on one or more microprocessors), as firmware, or as virtually any combination thereof, limited to patentable subject matter under 35 U.S.C. 101, and that designing the circuitry and/or writing the code for the software (e.g., a high-level computer program serving as a hardware specification) and or firmware would be well within the skill of one of skill in the art in light of this disclosure. The mechanisms of the subject matter described herein are capable of being distributed as a program product in a variety of forms, and that an illustrative embodiment of the subject matter described herein applies regardless of the particular type of signal bearing medium used to actually carry out the distribution. Examples of a signal bearing medium include, but are not limited to, the following: a recordable type medium such as a floppy disk, a hard disk drive, a Compact Disc (CD), a Digital Video Disk (DVD), a digital tape, a computer memory, etc.; and a transmission type medium such as a digital and/or an analog communication medium (e.g., a fiber optic cable, a waveguide, a wired communications link, a wireless communication link (e.g., transmitter, receiver, transmission logic, reception logic, etc.), etc.).
In a general sense, the various aspects described herein which can be implemented, individually and/or collectively, by a wide range of hardware, software (e.g., a high-level computer program serving as a hardware specification), firmware, and/or any combination thereof can be viewed as being composed of various types of “electrical circuitry.” Consequently, as used herein “electrical circuitry” includes, but is not limited to, electrical circuitry having at least one discrete electrical circuit, electrical circuitry having at least one integrated circuit, electrical circuitry having at least one application specific integrated circuit, electrical circuitry forming a general purpose computing device configured by a computer program (e.g., a general purpose computer configured by a computer program which at least partially carries out processes and/or devices described herein, or a microprocessor configured by a computer program which at least partially carries out processes and/or devices described herein), electrical circuitry forming a memory device (e.g., forms of memory (e.g., random access, flash, read only, etc.)), and/or electrical circuitry forming a communications device (e.g., a modem, communications switch, optical-electrical equipment, etc.). The subject matter described herein may be implemented in an analog or digital fashion or some combination thereof.
The herein described subject matter sometimes illustrates different components contained within, or connected with, different other components. It is to be understood that such depicted architectures are merely exemplary, and that in fact many other architectures may be implemented which achieve the same functionality. In a conceptual sense, any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved. Hence, any two components herein combined to achieve a particular functionality can be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components. Likewise, any two components so associated can also be viewed as being “operably connected”, or “operably coupled,” to each other to achieve the desired functionality, and any two components capable of being so associated can also be viewed as being “operably couplable,” to each other to achieve the desired functionality. Specific examples of operably couplable include but are not limited to physically mateable and/or physically interacting components, and/or wirelessly interactable, and/or wirelessly interacting components, and/or logically interacting, and/or logically interactable components.
In some instances, one or more components may be referred to herein as “configured to,” “configured by,” “configurable to,” “operable/operative to,” “adapted/adaptable,” “able to,” “conformable/conformed to,” etc. Those skilled in the art will recognize that such terms (e.g. “configured to”) generally encompass active-state components and/or inactive-state components and/or standby-state components, unless context requires otherwise.
The herein described components (e.g., operations), devices, objects, and the discussion accompanying them are used as examples for the sake of conceptual clarity and that various configuration modifications are contemplated. Consequently, as used herein, the specific exemplars set forth and the accompanying discussion are intended to be representative of their more general classes. In general, use of any specific exemplar is intended to be representative of its class, and the non-inclusion of specific components (e.g., operations), devices, and objects should not be taken limiting.
All of the above U.S. patents, U.S. patent application publications, U.S. patent applications, foreign patents, foreign patent applications and non-patent publications referred to in this specification and/or listed in any Application Data Sheet, are incorporated herein by reference, to the extent not inconsistent herewith.
While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.
If an Application Data Sheet (ADS) has been filed on the filing date of this application, it is incorporated by reference herein. Any applications claimed on the ADS for priority under 35 U.S.C. §§119, 120, 121, or 365(c), and any and all parent, grandparent, great-grandparent, etc. applications of such applications, are also incorporated by reference, including any priority claims made in those applications and any material incorporated by reference, to the extent such subject matter is not inconsistent herewith. The present application claims the benefit of the earliest available effective filing date(s) from the following listed application(s) (the “Priority Applications”), if any, listed below (e.g., claims earliest available priority dates for other than provisional patent applications or claims benefits under 35 USC §119(e) for provisional patent applications, for any and all parent, grandparent, great-grandparent, etc. applications of the Priority Application(s)). The present application constitutes a continuation-in-part of U.S. patent application Ser. No. 13/906,909, entitled TEMPERATURE-STABILIZED STORAGE SYSTEMS WITH REGULATED COOLING, naming Jonathan Bloedow, Ryan Calderon, David Gasperino, William Gates, Roderick A. Hyde, Edward K. Y. Jung, Shieng Liu, Nathan P. Myhrvold, Nathan John Pegram, Clarence T. Tegreene, Charles Whitmer, Lowell L. Wood, Jr. and Ozgur Emek Yildirim as inventors, filed 31 May, 2013.The present application constitutes a continuation-in-part of U.S. patent application Ser. No. 12/658,579, entitled TEMPERATURE-STABILIZED STORAGE SYSTEMS, naming Geoffrey F. Deane, Lawrence Morgan Fowler, William Gates, Zihong Guo, Roderick A. Hyde, Edward K. Y. Jung, Jordin T. Kare, Nathan P. Myhrvold, Nathan Pegram, Nels R. Peterson, Clarence T. Tegreene, Charles Whitmer and Lowell L. Wood, Jr. as inventors, filed 8 Feb. 2010. If the listings of applications provided above are inconsistent with the listings provided via an ADS, it is the intent of the Applicant to claim priority to each application that appears in the Domestic Benefit/National Stage Information section of the ADS and to each application that appears in the Priority Applications section of this application. All subject matter of the Priority Applications and of any and all applications related to the Priority Applications by priority claims (directly or indirectly), including any priority claims made and subject matter incorporated by reference therein as of the filing date of the instant application, is incorporated herein by reference to the extent such subject matter is not inconsistent herewith.
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| Number | Date | Country | |
|---|---|---|---|
| 20140150464 A1 | Jun 2014 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 13906909 | May 2013 | US |
| Child | 14098886 | US | |
| Parent | 12658579 | Feb 2010 | US |
| Child | 13906909 | US |
