The present invention relates to electronic circuits and, in particular, to CMOS (complementary metal oxide semiconductor) circuits for generating temperature stable voltage references and to CMOS circuits for generating temperature stable voltage comparators.
Voltage references are required to provide a substantially constant output voltage irrespective of changes in input voltage, output current, or temperature. Such references are used in many design applications, such as stable current references, multipliers, control circuits, portable meters, two-terminal references and process controllers, a comparator mode for causing a logic transition, and a servo mode for generating a fixed voltage reference.
Modern voltage references are generally based on either zener diodes or bandgap generated voltages. A disadvantage of conventional bandgap voltage reference circuits is that they comprise resistors of comparatively large value, which resistors should be matched in value with each other. Particularly in integrated circuit (“IC”) processes, in which it is difficult or not possible to fabricate resistors which are accurate and have comparatively high resistance values, said disadvantage is a very significant factor.
The challenge in using CMOS circuit design for generating voltage references is minimizing area for cost reduction. This necessitates the use of purely CMOS components to obsolete area-consuming bipolar devices. Furthermore, in order to further reduce the cost of manufacturing, the circuit design must use standard N-channel and P-channel type CMOS transistors.
In electronic systems including power management systems, it becomes necessary to monitor the supply voltage and effect a decision based upon a comparison of the supply voltage level with respect to a fixed reference voltage. For instance, LDO power-management systems require voltage blocking, referred to as lockout, when the supply is less than the minimum sustainable operating voltage. Also, load-switch and charge-pump systems require a supply voltage-level detection to change the charge-pump voltage levels. Moreover, for system stability and predictable performance, the logic comparison must be predictable and stable over temperature variation. Finally, when these electronic systems are battery powered, minimizing quiescent current becomes paramount. Thus, CMOS becomes the integrated circuit process of choice.
The problem then is to derive a circuit using standard CMOS transistors, N-channel and P-channel type transistors, for monitoring supply voltage with respect to a fixed reference. As a result, it is desirable to provide circuits for this function with a minimum number of transistors and can operate in either of two modes: (1) comparator mode for detecting supply voltage as an independent variable compared to an inherent temperature-independent reference; and (2) servo mode for generating a fixed temperature-independent voltage reference.
An object of this invention is to provide IC circuits for generating a temperature stable voltage reference.
Another object of this invention is to provide IC circuits for generating a voltage reference having an area-efficient design with relatively few circuit branches and operating with relatively low quiescent current.
Yet another object of this invention is to provide IC circuits having at least two modes of operation, including a comparator mode to compare an independent voltage to an inherent voltage reference and a servo mode to generate a fixed temperature-stable voltage.
Briefly, the present invention discloses a temperature stable comparator circuit, comprised of: a branch C having a first end, a second end, a first type-1 device and first type-2 device, wherein the first type-1 device and the first type-2 device are connected to a node O; a branch B having a first end, a second end, a second type-1 device, a second type-2 device, and a resistor; and a branch A having a first end, a second end, a third type-2 device and a current-control device; wherein the first ends of the branch A, branch B, and branch C are commonly connected, and the second ends of the branch B and branch C are commonly connected; wherein the third type-2 device is diode-connected having a first terminal and a second terminal and having a VCT voltage across the first and second terminals, wherein the second terminal is connected to the first end of the branch A, and the first terminal is connected to the first type-2 device and the second type-2 device; wherein the second type-1 device is diode-connected and is connected to the first type-1 device; wherein the current in the branches are proportional to absolute temperature (PTAT); and wherein the current in branch A is proportional to the voltage VR.
An advantage of this invention is that IC circuits for generating a temperature stable voltage reference are provided.
Another advantage of this invention is that IC circuits for generating a voltage reference having an area-efficient design with relatively few circuit branches and operating with relatively low quiescent current are provided.
Yet another advantage of this invention is that IC circuits having at least two modes of operation, including a comparator mode to compare an independent voltage to an inherent voltage reference and a servo mode to generate a fixed temperature-stable voltage, are provided.
The foregoing and other objects, aspects, and advantages of the invention can be better understood from the following detailed description of the preferred embodiment of the invention when taken in conjunction with the accompanying drawings in which:
The following circuit diagrams of the present invention, illustrated in the figures, can be understood by a person having ordinary skill in the art, e.g., an electrical engineer who designs integrated circuits using common-practiced techniques including hierarchical circuit design with schematic-entry tools. Integrated circuit techniques for properly biasing circuit junctions and methods for properly biasing CMOS body junctions, and permutations thereof, are also understood by a person having ordinary skill in the art. Thus, such commonly known techniques are incorporated. Furthermore, for purposes of clarity and brevity, like elements and components may bear the same designations and numbering throughout the figures. Moreover, N-type MOSFET (metal-oxide-semiconductor field-effect transistor) can be referred to as NMOS and P-type MOSFET (metal-oxide-semiconductor field-effect transistor) can be referred to as PMOS.
As evident to a circuit designer having ordinary skill in the art, there are many degrees of freedom for selecting the relationship between the scaling sizes of PMOS MP1108, PMOS MP2110, and PMOS MP3112. In a preferred configuration, PMOS MP2110 and PMOS MP3112 can be selected to be of equal size and to allow the size of PMOS MP1108 to be an integer multiple N, e.g., a value of 2, times the size of PMOS MP2110 and PMOS MP3112. The multiplication factor N can also be a fixed value by design.
The drain of PMOS MP2110 connects directly to the drain of NMOS MN1104 to create the voltage node O 158. The drain of PMOS MP3112 connects directly to the drain of NMOS MN2106 at the voltage node VGN 156. Note that VGN can also be referred to as VG. The gates of NMOS MN1104 and NMOS MN2106 connect together at the voltage node VGN 156. NMOS MN1104 and NMOS MN2106 are matched to have a predictable voltage at voltage node VX 154.
While a circuit designer having ordinary skill in the art would recognize infinite permutations for relating the size of NMOS MN1104 to the size of NMOS MN2106, a preferred design choice would be to select the size of NMOS MN2106 to be larger than NMOS MN1104 by an integer scale factor M, e.g., a value of 4. The source and body of NMOS MN1104 connect to ground. The source of NMOS MN2106 connects to resistor R2102 at a voltage node labeled VX 154. The other end of resistor R2102 connects to ground. The body of NMOS MN2106 connects to ground. If isolated NMOS devices are available, the body of NMOS MN2106 can be connected to its source at voltage node VX 154.
For optimum results, NMOS MN1104 and NMOS MN2106 should be designed for operation in the sub-threshold region. The circuit designer having ordinary skill in the art can understand this to require the devices to be sized for operation at or below the sub-threshold knee.
This circuit configuration may be referred to as comparator mode and is well suited for providing an output voltage O 158 which depends upon the applied voltage at VR 150. The trip or transition voltage at VR 150 is determined by a balance condition in which the drain current of PMOS MP2110 equals the drain current of NMOS MN1104. By design, when the voltage VR 150 reaches the trip voltage, the drain current of PMOS MP2110 is a scaled multiple of PMOS MP1108's drain current, which, in turn, is calculated by dividing the voltage VGP 152 by the resistance of R1100. A circuit designer can select the scale factor between PMOS MP1108 and PMOS MP2110. For instance, one option could be to choose PMOS MP1108 to be twice the size of PMOS MP2110 so that the width to length ratio of PMOS MP1108 is twice that of PMOS MP2110. In this way, the drain current in PMOS MP2110, at the balance (trip point) condition, would be one half the drain current in MP1108.
Also, at the balance (trip point) condition, the drain currents in both PMOS MP2110 and PMOS MP3112 are a scaled multiple of the drain current in PMOS MP1108. While it is not necessary, both PMOS MP2110 and PMOS MP3112 can be designed to be of equal size, e.g., have the same width-to-length ratio. For instance, if the width-to-length ratio of PMOS MP1108 is chosen to be twice that of PMOS MP2110, while the width-to-length ratios of both PMOS MP2110 and PMOS MP3112 are equal, then the currents in PMOS MP2110 and PMOS MP3112 are both equal to one-half the current in PMOS MP1108 at the trip point. It can be appreciated that the scale ratios between PMOS MP1108, PMOS MP2110, and PMOS MP3112 represent a design degree-of-freedom. Thus, numerous matching or scaling permutations for such design can be selected.
The drain current in NMOS MN1104, at the balance trip point condition, is by design a scaled multiple of the voltage VX 154 divided by the resistance of R2102. Also, at the trip point, the voltage VX 154 is given by the gate-source voltage of MN1104 minus the gate-source voltage of MN2106. Under the balanced condition, the physics of operation of both NMOS MN1104 and NMOS MN2106, is by design, predictable. A good choice of design is to have NMOS MN1104 and NMOS MN2106 operate in the sub-threshold region so that the voltage VX 154 takes on a PTAT (proportional-to-absolute-temperature) behavior.
In deriving the voltage VX 154, the gate-source voltage of NMOS MN2106 must be less than the gate-source voltage of NMOS MN1104. This is possible only if the drain current-density in NMOS MN2106 is, by design, less than the current-density in NMOS MN1104.
A circuit designer having ordinary skill in the art can recognize that if PMOS MP2110 and PMOS MP3112 have been selected to be of equal scale, then by design, NMOS MN2106 must be scaled larger than NMOS MN1104. As this scaling ratio also represents a design degree-of-freedom, one simple choice is to take NMOS MN2106 to be four times that of NMOS MN1104.
In all cases presented thus far, the meaning of scaling and matching should be common knowledge to an IC design engineer familiar with matching and scaling CMOS devices. Once the designer has selected the scale factors and sizing of the individual MOS devices for issues such as common-mode range and desired mode of operation, e.g., sub-threshold operation, the values of resistors R1100 and R2102 become the final degrees of freedom. These values in combination with the CMOS sizing constraints will determine the balance or trip-point condition as a function of the voltage VR 150.
An additional design consideration is temperature sensitivity. A relationship may be derived for the voltage VR 150 at the balance condition with temperature dependent terms. Since the current in PMOS MP1108 increases with temperature, when the voltage VX 154 is PTAT and the current through NMOS MN1104 increases with temperature, a temperature independent relationship may be derived. The mathematical relationship is found by setting the derivative of voltage VR 150, with respect to temperature, equal to zero. In this way resistor R1100, resistor R2102, or a combination of resistors R1100 and R2102 can be adjusted to cause the trip point at voltage VR 150 to have reduced temperature sensitivity.
Simulation is a valuable circuit tool for selecting appropriate values of resistor R1100 and resistor R2102 for deriving this temperature-stable trip point. When the voltage at VR 150 is less than the trip point value, the output voltage O 158 is logic high. When the voltage at the output voltage VR 150 is above the trip point value, the output voltage O 158 takes on a logic low. In order to improve the gain of the transition at output voltage O 158, a buffer may be used as illustrated in
For positive feedback, resistor R1100 is connected between the drain of PMOS MP1108 and an additional resistor R3308. Resistor R3308 is typically designed to be a smaller fraction of the net resistance of resistor R1100 and resistor R3308. Thus, this configuration has a positive feedback with NMOS MN3306.
The other end of resistor R3308 connects to ground. NMOS MN3306 operates as a switch with its drain connected to one end of resistor R3308 and with body-connected source connected to ground. The gate of NMOS MN3306 connects to the output of inverter 300. In this way, the trip point when the voltage at VR 150 increases will be higher than the trip point when the voltage at VR 150 decreases.
In theory, the stable value should be equivalent to the trip point (i.e., balanced condition) described in the discussion of
The circuit design illustrated in
Referring to
As evident to a circuit designer having ordinary skill in the art, there are many degrees of freedom for selecting the relationship between the scaling sizes of NMOS MN5504, NMOS MN6506, and NMOS MN7508. In a preferred configuration, NMOS MN6506 and MN7508 can be of equal size. Furthermore, the size of NMOS MN5504 can be an integer multiple N, e.g., a value of 2, times the size of NMOS MN6506 and NMOS MN7508. The multiplication factor N can then be fixed by design.
The drain of NMOS MN6506 connects directly to the drain of PMOS MP5510 to create the voltage node output O 558. The drain of NMOS MN7508 connects directly to the drain of PMOS MP6512 at the voltage node VGP2556. The gates of PMOS MP5510 and PMOS MP6512 connect together at the voltage node VGP2556. PMOS MP5510 and PMOS MP6512 are matched so as to form a predictable voltage at voltage node VY 554.
While there are many permutations for relating the size of PMOS MP5510 to the size of PMOS MP6512, a preferred configuration can be to select the size of PMOS MP6512 to be larger than PMOS MP5510 by an integer scale factor M, e.g., a value of 4. The source and body of PMOS MP5510 connect to voltage VR 150. The source of PMOS MP6512 connects to resistor R5502 at voltage node labeled VY 554. The other end of resistor R5502 connects to VR 150. The body of PMOS MP6512 connects to voltage node VR 150. The body of PMOS MP6512 can be connected to its source at voltage node VY 554 by isolating the PMOS devices. For optimum results, PMOS MP5510 and PMOS MP6512 should be designed for operation in the sub-threshold region. It can be understood this requires the devices to be sized for operation at or below the sub-threshold knee.
This complementary approach to the circuit of
In addition, the current through branch A 762 is proportional to VR 150. Voltage VCT 700 supplies gate voltage to the remaining device in the comparison branch. Branches C 764 and B 766 are by design in parallel with general endpoint node voltages labeled VA 740 and VB 760. The difference between voltages VA 740 and VB 760 is the branch differential voltage VR 150.
This general structure reduces to that of
In addition, the current through branch A 762 is proportional to voltage VR 150. Voltage VCT 700 supplies a gate voltage to the remaining device in the comparison branch. Branches C 764 and B 766 are in parallel with general endpoint node voltages labeled VA 740 and VB 760. The difference in value between voltages VA 740 and VB 760 is the branch differential voltage VR 150. This general structure reduces to that of
Referring to
For simulation, amplifier OA 450 is a behavioral VCVS (voltage controlled voltage source) with a gain of 50. The resistor R1100 is adjusted until the voltage VR 150 versus temperature curve is stable, as shown in
Since other modifications and changes varied to fit particular operating requirements and environments will be apparent to those skilled in the art, the invention is not considered limited to the example chosen for purposes of disclosure, and covers all changes and modifications which do not constitute departures from the true spirit and scope of this invention. Furthermore, for the purpose of clarity and brevity, the following nomenclature can be used: in one case, a type-1 device can refer to a PMOS device and a type-2 device can refer to an NMOS device; in a second case, a type-1 device can refer to an NMOS device and a type-2 device can refer to a PMOS device; and in other cases, a type-1 device can refer to a P-channel transistor and a type-2 device can refer to an N-channel transistor, or vice versa.
While the present invention has been described with reference to certain preferred embodiments or methods, it is to be understood that the present invention is not limited to such specific embodiments or methods. Rather, it is the inventor's contention that the invention be understood and construed in its broadest meaning as reflected by the following claims. Thus, these claims are to be understood as incorporating not only the preferred methods described herein but all those other and further alterations and modifications as would be apparent to those of ordinary skilled in the art.
This application claims priority from a provisional patent application entitled “A CMOS Temperature-Stable Voltage Reference” filed on Oct. 19, 2010 and having an Application No. 61/394,665. Said application is incorporated herein by reference.
Number | Date | Country | |
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61394665 | Oct 2010 | US |