Tension mask assembly for flat cathode ray tube

Information

  • Patent Grant
  • 6734612
  • Patent Number
    6,734,612
  • Date Filed
    Monday, December 3, 2001
    24 years ago
  • Date Issued
    Tuesday, May 11, 2004
    22 years ago
Abstract
A tension mask assembly for a flat cathode ray tube includes a tension mask having a plurality of strips separated from one another by a predetermined gap, real bridges connecting adjacent strips to thus define slots through which electron beams pass, and first and second dummy bridges extending from adjacent strips toward each slot therebetween, the tension mask being installed such that its top surface faces a panel forming a screen and it is separated from the panel by a predetermined gap, a plurality of supporting members disposed at opposite sides of the tension mask to support the tension mask, and a plurality of rigid members secured to opposite ends of the supporting members to apply tension to the tension mask. A first etching boundary formed at an end of the first dummy bridge near to the center of the tension mask is lower with respect to the screen than a second etching boundary formed at an end of the second dummy bridge near to the periphery of the tension mask. The shape of a section of a slot having dummy bridges are formed such that an electron beam is prevented from passing through the slot, thereby solving the problem of visibility. Therefore, cathode ray tubes having a high definition can be manufactured.
Description




This application makes reference to, incorporates the same herein, and claims all benefits accruing under 35 U.S.C. § 119 from an application for TENSION MASK FOR FLAT CATHODE RAY TUBE earlier filed in the Korean Industrial Property Office on Dec. 4, 2000, and there duly assigned Serial No. 2000-72936 by that Office.




BACKGROUND OF THE INVENTION




1. Field of the Invention




The present invention relates to a cathode ray tube, and more particularly, to a tension mask assembly having a slot of an improved structure, in which a dummy bridge is formed, and having a color selecting function for a flat cathode ray tube.




2. Description of the Related Art




Generally, a flat cathode ray tube includes a panel having a flat screen and a funnel having is an electronic gun at a neck portion and a deflection yoke at a cone portion. Such a cathode ray tube employs a tension mask for accurately landing red, green and blue electron beams emitted from the electron gun on the phosphor screen. The tension mask is disposed to be a predetermined gap apart from a phosphor screen formed on the inner surface of the panel.




An exemplar of the art U.S. Pat. No. 4,926,089 issued to Moore for Tied Slit Foil Shadow Mask with False Ties discloses a tension mask.




The tension mask includes a plurality of strips which is formed on a metal foil such that they are separated from one another at predetermined intervals, slots intermittently formed between the strips for allowing many electron beams to pass, real bridges for supporting the slots, and dummy bridges extending from the strips to the slots. At least one dummy bridge is formed for each slot.




A plurality of dummy bridges extending from opposite strips toward the center of the slot are formed along the opposite borders of the slot. The dummy bridges face the center of the slot at the strip so that they are located on opposed sides of the slot. Accordingly, a width of the slot in which dummy bridges are not formed is different from a width of the slot at which the dummy bridges are formed.




A tension mask having such a structure is formed by an etching method. An etching process is performed so that a clipping phenomenon, in which an electron beam emitted from an electron gun can be blocked by the tension mask, is suppressed at a portion of the slot in which the dummy bridge is not formed. In other words, to prevent an electron beam from colliding with the strip, an etching process is performed such that a lower end surface of a first strip is less etched than an upper end surface thereof in a direction in which an electron beam is deflected and a lower end surface of a second strip is less etched than the lower end surface of the first strip. Accordingly, an electron beam can pass through the slot without being clipped.




For a portion of the slot in which the dummy bridge is formed, a lower end surface of a first dummy bridge is more etched than an upper end surface thereof and an upper end surface of a second dummy bridge is more etched than a lower end surface thereof. As a result, although the width of the portion of the slot in which the dummy bridges are formed is narrower than the width of the portion of the slot in which the dummy bridges are not formed, a deflected electron beam can pass through the portion of the slot having the dummy bridges.




A conventional tension mask has the following problems. During a procedure in which electron beams emitted from an electron gun pass through slots and then land on the phosphor screen of a panel so as to display an image on a screen, passing of electron beams occurs at portions where dummy bridges are formed so that traces appearing due to real bridges and dummy bridges which shade the phosphor screen cannot be uniform. Consequently, the problem of visibility cannot be overcome completely. Therefore, it is desired to change the shape of a slot at which a dummy bridge is formed in order to solve the problem of visibility.




In addition, in order to adjust the degree of a shadow occurring when a deflected electron beam passes through the portion of each slot having dummy bridges, it needs to form a long dummy bridge. Accordingly, a design margin of a dummy bridge is deficient.




SUMMARY OF THE INVENTION




It is therefore an object of the present invention to provide a tension mask assembly for a flat cathode ray tube, in which the structure of a dummy bridge formed at a slot is improved to completely solve a visible line problem so that the definition of an image can be improved.




It is another object to provide a tension mask assembly that is easy to manufacture.




It is another object to have a tension mask that is inexpensive to manufacture.




It is yet another object to have a tension mask that can accommodate the manufacture of a high definition cathode ray tube.




Accordingly, to achieve the above object of the invention, there is provided a tension mask assembly for a flat cathode ray tube. The tension mask assembly includes a tension mask having a plurality of strips separated from one another by a predetermined gap, real bridges connecting adjacent strips to thus define slots through which electron beams pass, and first and second dummy bridges extending from adjacent strips toward each slot therebetween, the tension mask being installed such that its top surface faces a panel forming a screen and it is separated from the panel by a predetermined gap, a plurality of supporting members disposed at opposite sides of the tension mask to support the tension mask, and a plurality of rigid members secured to opposite ends of the supporting members to apply tension to the tension mask. A first etching boundary formed at an end of the first dummy bridge near to the center of the tension mask is lower with respect to the screen than a second etching boundary formed at an end of the second dummy bridge near to the periphery of the tension mask.




In addition, the vertical center axis of an etched area at the upper end surfaces of the first and second dummy bridges is offset from the vertical center axis of an etched area at the lower end surfaces of the first and second dummy bridges toward the center of the tension mask so that a deflected electron beam can be blocked. The amount of offset increases from the center of the tension mask toward the periphery thereof.




Moreover, an etched area at the upper end surfaces of the first and second dummy bridges is wider than an etched area at the lower end surfaces of the first and second dummy bridges.




Furthermore, an etched area at an upper surface above the first etching boundary of the first dummy bridge is wider than an etched area at a lower surface therebelow, and an etched area at a lower surface below the second etching boundary of the second dummy bridge is wider than an etched area at an upper surface thereabove.











BRIEF DESCRIPTION OF THE DRAWINGS




A more complete appreciation of this invention, and many of the attendant advantages thereof, will be readily apparent as the same becomes better understood by reference to the following detailed description when considered in conjunction with the accompanying drawings in which like reference symbols indicate the same or similar components, wherein:





FIG. 1

is a plan view of an earlier tension mask;





FIG. 2

is an enlarged plan view of the part A of

FIG. 1

;





FIG. 3

is a plan view of a slot in which an earlier dummy bridge is formed;





FIG. 4A

is a sectional view taken along the line


1





1


of

FIG. 3

;





FIG. 4B

is a sectional view taken along the line II—II of

FIG. 3

;





FIG. 5

is an sectional elevation view of a cathode ray tube according to an embodiment of the present invention;





FIG. 6

is a perspective view of a tension mask assembly of

FIG. 5

;





FIG. 7

is an enlarged perspective view of the part B of

FIG. 6

;





FIG. 8

is a perspective view of a portion of a slot at which a dummy bridge shown in FIG. is formed;





FIG. 9A

is a sectional view taken along the line III—III of

FIG. 8

;





FIG. 9B

is a sectional view taken along the line IV—IV of FIG.


8


and shows an etching step;





FIG. 9C

is a sectional view taken along the line IV—IV of FIG.


8


and shows a state after the etching step according to a first embodiment of the present invention;





FIG. 9D

is a sectional view taken along the line IV—IV of FIG.


8


and shows a state after the etching step according to a first embodiment of the present invention;





FIG. 10A

is a sectional view of the part C of

FIG. 6

, taken along the line V—V, and shows a portion of a slot in which dummy bridges are formed;





FIG. 10B

is a sectional view of the part D of

FIG. 6

, taken along the line V—V, and shows a portion of a slot in which dummy bridges are formed; and





FIG. 10C

is a sectional view of the part E of

FIG. 6

, taken along the line V—V, and shows a portion of a slot in which dummy bridges are formed.











DETAILED DESCRIPTION OF THE PRESENT INVENTION




Turning now to the drawings, referring to

FIGS. 1 and 2

, the tension mask


10


includes a plurality of strips


12


formed on a metal foil


11


such that they are separated from one another at predetermined intervals, slots


13


intermittently formed between the strips


12


for allowing many electron beams to pass, real bridges


14


for supporting the slots


13


, and dummy bridges


15


extending from the strips


12


to the slots


13


. At least one dummy bridge


15


is formed for each slot


13


.





FIG. 3

illustrates a slot


33


in which a dummy bridge


35


is formed. Referring to

FIG. 3

, a plurality of dummy bridges


35


extending from opposite strips


32


toward the center of the slot


33


are formed along the opposite borders of the slot


33


. The dummy bridges


35


face the center of the slot


33


at the strip


32


so that they are located on opposed sides of the slot


33


. Accordingly, a width W


1


of the slot


33


is different from a width W


2


of the slot


33


at which the dummy bridges


35


are formed, and the width W


1


is larger than the W


2


.




A tension mask having such a structure is formed by an etching method.

FIG. 4A

is a sectional view taken along the line I—I of

FIG. 3

, and

FIG. 4B

is a sectional view taken along the line II—II of FIG.


3


. Referring to

FIG. 4A

, an etching process is performed so that a clipping phenomenon, in which an electron beam emitted from an electron gun can be blocked by the tension mask, is suppressed at a portion of the slot


33


in which the dummy bridge


35


is not formed. In other words, to prevent an electron beam from colliding with the strip


32


, an etching process is performed such that a lower end surface of a first strip


32




a


is less etched than an upper end surface thereof in a direction (an arrow-headed direction) in which an electron beam is deflected and a lower end surface of a second strip


32




b


is less etched than the lower end surface of the first strip


32




a


. Accordingly, an electron beam can pass through the slot


33


without being clipped.




As shown in

FIG. 4B

, for a portion of the slot


33


in which the dummy bridge


35


is formed, a lower end surface of a first dummy bridge


35




a


is more etched than an upper end surface thereof and an upper end surface of a second dummy bridge


35




b


is more etched than a lower end surface thereof. As a result, although the width W


2


of the portion of the slot


33


in which the dummy bridges


35


are formed is narrower than the width W, of the portion of the slot


33


in which the dummy bridges


35


are not formed, a deflected electron beam can pass through the portion of the slot


33


having the dummy bridges


35


, as marked by the arrow.





FIG. 5

is an sectional elevation view of a cathode ray tube


50


according to an embodiment of the present invention. Referring to

FIG. 5

, the cathode ray tube


50


includes a panel


51


which has a phosphor screen


51




a


on its inside, and a funnel


52


which is mounted on the panel


51


to thus form a bulb. A tension mask assembly


60


is installed on the inside of the panel


51


. An inner shield


54


is secured to the tension mask assembly


60


. Here, the front side of the panel


51


forms a screen on which images are displayed.




An electron gun


55


for emitting electron beams to the phosphor screen


51




a


is sealed in a neck portion


52




a


of the funnel


52


. A deflection yoke


56


is installed in a cone portion


52




b


of the funnel so that an electron beam can be deflected and projected to a proper position on the phosphor screen


51




a.







FIG. 6

is a perspective view of the tension mask assembly


60


of FIG.


5


.

FIG. 7

is an enlarged perspective view of the part B of FIG.


6


. Referring to

FIGS. 6 and 7

, the tension mask assembly


60


includes a tension mask


61


and a frame


62


supporting the tension mask


61


.




The tension mask


61


is formed of a metal foil. A plurality of strips


63


are formed on the front surface of the tension mask


61


to be separated from one another by a predetermined gap. Many strip-shaped slots


64


are intermittently formed among the strips


63


so that an electron beam emitted from an electron gun can pass through each slot


64


. A real bridge


65


is formed between adjacent slots


64


to support the slots


64


. A dummy bridge


66


extending from each strip


63


toward the center of each slot


64


is formed at each of the opposed sides of the slot


64


.




The frame


62


includes a plurality of supporting members


67


for supporting the tension mask


61


in a lengthwise direction. The supporting members


67


are disposed to face each other. Two rigid members


68


for applying tension to the tension mask


61


are secured to opposite ends of the supporting members


67


such that the rigid members


68


connect the supporting members


67


.





FIG. 8

is a perspective view of a portion of the slot


64


at which the dummy bridge


66


shown in

FIG. 7

is formed. Referring to

FIG. 8

, the dummy bridges


66


are formed along the border of the slot


64


at the opposed sides of the slot


64


such that one end of each dummy bridge


66


is connected to the strip


63


and the other end extends toward the center of the slot


64


. The dummy bridges


66


are formed to be perpendicular to the strip


63


and to face the center of the slot


64


. The width of the slot


64


at which the dummy bridges


66


are formed is narrower than the width of the slot


64


at which the dummy bridges


66


are not formed.




Here, the slot


64


is formed by etching so that clipping of an electron beam can be suppressed and the problem of visibility can be solved. This is shown in

FIGS. 9A through 9D

in more detail.

FIG. 9A

is a sectional view taken along the line III—III of FIG.


8


.

FIG. 9B

is a sectional view taken along the line IV—IV of FIG.


8


and shows an etching step.

FIG. 9C

is a sectional view taken along the line IV—IV of FIG.


8


and shows a state after the etching step according to a second embodiment of the present invention.




Referring to

FIG. 9A

, a slot


91


having no dummy bridges is formed by etching a first strip


92


and a second strip


93


in different ways in an arrow-headed direction in which an electron beam is deflected and passes through the slot


91


so that a clipping phenomenon occurring when an electron beam hits a strip can be suppressed. Here, the first strip


92


is nearer to the center of the tension mask


61


of

FIG. 6

than the second strip


93


, and the second strip


93


is nearer to the periphery of the tension mask


61


than the first strip


92


.




An etched area at upper end surfaces


92




a


and


93




a


of the first and second strips


92


and


93


is wider than an etched area at lower end surfaces


92




b


and


93




b


of the first and second strips


92


and


93


. Here, the top surfaces of first and second strips


92


and


93


face the screen formed on the front side of the panel


51


of FIG.


5


. In addition, the central axis of the etched area at the upper end surfaces


92




a


and


93




a


of the respective first and second strips


92


and


93


is offset toward the periphery (in an X1 direction) of the tension mask


61


from the central axis of the etched area at the lower end surfaces


92




b


and


93




b


of the respective first and second strips


92


and


93


. The offset in the X1 direction allows a deflected electron beam to pass through the portion of the slot


91


which does not have a dummy bridge.




For this, the upper end surface


92




a


of the first strip


92


is more etched than the lower end surface


92




b


thereof, and the upper end surface


93




a


of the second strip


93


is more etched than the lower end surface


93




b


thereof. Accordingly, a first etching boundary


92




c


formed at the end of the first strip


92


is higher with respect to the screen than a second etching boundary


93




c


formed at the end of the second strip


93


. Accordingly, the portion of the slot


91


which does not have a dummy bridge passes a deflected electron beam, thereby suppressing a clipping phenomenon.




As shown in

FIGS. 9B and 9C

, a portion of the slot


91


having dummy bridges is formed such that electron beams cannot pass through the slot


91


in order to increase the clipping of the electron beams.




In other words, with respect to the screen, an etched area at upper end surfaces


94




a


and


95




a


of the first and second dummy bridges


94


and


95


is wider than an etched area at lower end surfaces


94




b


and


95




b


of the first and second dummy bridges


94


and


95


. Here, the top surfaces of the first and second dummy bridges


94


and


95


face the screen formed on the front side of the panel


51


of FIG.


5


. In addition, the first dummy bridge


94


is nearer to the center of the tension mask


61


than the second dummy bridge


95


, and the second dummy bridge


95


is nearer to the periphery of the tension mask


61


than the first dummy bridge


94


.




An etched depth at the upper end surface


94




a


of the first dummy bridge


94


is deeper than an etched depth at the upper end surface


95




a


of the second dummy bridge


95


. In addition, a central axis Y1 of an etched area at the upper end surfaces


94




a


and


95




a


of the respective first and second dummy bridges


94


and


95


is offset toward the center (in an X2 direction) of the tension mask


61


from a central axis Y2 of the etched area at the lower end surfaces


94




b


and


95




b


of the respective first and second dummy bridges


94


and


95


. The offset in the X2 direction prevents a deflected electron beam from passing through the portion of the slot


91


having the dummy bridges


94


and


95


. In other words, the offset in the X2 direction increases the clipping of electron beams.




In the portion of the slot


91


having the first and second bridges


94


and


95


, the etched depth at the upper end surface


94




a


of the first dummy bridge


94


is deeper than the etched area at the lower end surface


94




b


thereof, and the etched depth at the upper end surface


95




a


of the second dummy bridge


95


is shallower than the etched area at the lower end surface


95




b


thereof. In addition, the etched depth at the upper end surface


94




a


of the first dummy bridge


94


is deeper than the etched depth at the upper end surface


95




a


of the second dummy bridge


95


, and the etched depth at the lower end surface


94




b


of the first dummy bridge


94


is shallower than the etched depth at the lower end surface


95




b


of the second dummy bridge


95


. Accordingly, a first etching boundary


94




c


formed at the end of the first dummy bridge


94


is lower with respect to the screen than a second etching boundary


95




c


formed at the end of the second dummy bridge


95


. Therefore, the portion of the slot


91


having the first and second dummy bridges


94


and


95


blocks deflected electron beams. Briefly, the portion of the slot


91


having the first and second dummy bridges


94


and


95


is etched such that clipping of electron beams can be increased.




During a procedure of passing an electron beam through the slot


64


in the tension mask


61


having such a structure, the electron beam is prevented from landing on a phosphor screen on the inside of a panel corresponding to the real bridge


65


, so phosphor cannot be excited. As a result, a black point appears in an image. Since an electron beam does not pass through the portion of the slot


64


having the dummy bridges


66


, the distribution of black points is uniform throughout the image so that viewers cannot recognize traces. Consequently, an improvement can be made in overcoming the problem of visibility.





FIG. 9D

is a sectional view taken along the line IV—IV of FIG.


8


and shows a state after the etching step according to a second embodiment of the present invention. Referring to

FIG. 9D

, the shape of the section of the end portion of a first dummy bridge


96


and the shape of the section of the end portion of a second dummy bridge


97


are symmetric. In the first and second dummy bridges


96


and


97


, an etched depth at each of the upper end surfaces


96




a


and


97




a


is substantially the same as an etched depth at each of the lower end surfaces


96




b


and


97




b


. In other words, in a portion of the slot


91


having the first and second dummy bridges


96


and


97


, offset for preventing a deflected electron beam from passing through the slot


91


is zero. Here, the top surfaces of the first and second dummy bridges


96


and


97


face the screen formed on the front side of the panel


51


of FIG.


5


.





FIG. 10A

is a sectional view of the part C of

FIG. 6

, taken along the line V—V, and shows a portion of a slot having dummy bridges.

FIG. 10B

is a sectional view of the part D of

FIG. 6

, taken along the line V—V, and shows a portion of a slot having dummy bridges.

FIG. 10C

is a sectional view of the part E of

FIG. 6

, taken along the line V—V, and shows a portion of a slot having dummy bridges.




Referring to

FIGS. 10A through 10C

, a portion of a slot


101


having first and second dummy bridges is etched such that the amount of clipped electron beams gradually increases from the center of the screen toward the periphery. Here, the first dummy bridge is nearer to the center m of the tension mask


61


than the second dummy bridge, and the second dummy bridge is nearer to the periphery of the tension mask


61


than the first dummy bridge.




In the part C at the center of the tension mask


61


, the end portions of first and second dummy bridges


102


and


103


, respectively, are symmetric. In the first and second dummy bridges


102


and


103


, an etched area at upper end surfaces


102




a


and


103




a


is substantially the same as an etched area at lower end surfaces


102




b


and


103




b


. In other words, offset is zero in the portion of the slot


101


having the first and second dummy bridges


102


and


103


. Here, the top surfaces of the first and second dummy bridges


102


and


103


face the screen formed on the front side of the panel


51


of FIG.


5


.




In the part D at the left peripheral portion of the tension mask


61


, the slot


101


is formed such that an electron beam represented by an arrow cannot pass through the slot


101


in order to increase clipping of the electron beam.




In other words, an etched depth at an upper end surface


104




a


of a first dummy bridge


104


is deeper than an etched depth at an upper end surface


105




a


of a second dummy bridge


105


. In contrast, an etched depth at a lower end surface


104




b


of the first dummy bridge


104


is shallower than an etched depth at a lower end surface


105




b


of the second dummy bridge


105


. Accordingly, a first etching boundary


104




c


formed at the end of the first dummy bridge


104


is lower with respect to the screen than a second etching boundary


105




c


formed at the end of the second dummy bridge


105


so that an electron beam deflected to the left of the screen cannot pass through the slot


101


. Here, the top surfaces of the first and second dummy bridges


104


and


105


face the screen formed on the front side of the panel


51


of FIG.


5


.




In the part E at the right peripheral portion of the tension mask


61


, the slot


101


is formed Id such that an electron beam represented by an arrow cannot pass through the slot


101


in order to increase clipping of the electron beam.




In other words, an etched depth at an upper end surface


106




a


of a first dummy bridge


106


is deeper than an etched depth at an upper end surface


107




a


of a second dummy bridge


107


. In contrast, an etched depth at a lower end surface


106




b


of the first dummy bridge


106


is shallower than an etched depth at a lower end surface


107




b


of the second dummy bridge


107


. Accordingly, the portion of the slot


101


having the first and second dummy bridges


106


and


107


is etched so that an electron beam deflected to the right of the screen cannot pass through the slot


101


. Here, the top surfaces of the first and second dummy bridges


106


and


107


face the screen formed on the front side of the panel


51


of FIG.


5


.




Briefly, portions of slots having first and second dummy bridges are etched such that the degree of offset gradually increases from the center of the screen toward the periphery thereof. As a result, the amount of passed electron beams decreases from the center of the screen toward the periphery thereof.




As described above, in a tension mask assembly for a flat cathode ray tube according to the present invention, the shape of a section of a dummy bridge formed at each slot is formed to block an electron beam so that the problem of visibility can be solved. Therefore, a cathode ray tube of a high definition can be manufactured. In addition, since a portion of a slot having dummy bridges is formed such that an etched area at the upper end surface is wider than an etched area at the lower end surface, the design margin of a dummy bridge is sufficient.




Although the invention has been described with reference to particular embodiments, it will be apparent to one of ordinary skill in the art that modifications to the described embodiments may be made. Accordingly, the scope of the invention will be defined by the spirit of the attached



Claims
  • 1. A tension mask assembly for a flat cathode ray tube, comprising:a tension mask comprising a plurality of strips separated from one another by a predetermined gap, real bridges connecting adjacent strips to define slots accommodating electron, beams to pass, and first and second dummy bridges extending from adjacent strips toward each slot therebetween, said tension mask being installed to include a top surface of said tension mask facing a panel forming a screen and being separated from said panel by a predetermined gap; a plurality of supporting members disposed at opposite sides of said tension mask to support said tension mask; and a plurality of rigid members secured to opposite ends of said supporting members to apply tension to said tension mask, a first etching boundary being formed at an end of said first dummy bridge near to the center of the tension mask being lower with respect to the screen than a second etching boundary formed at an end of said second dummy bridge near to the periphery of said tension mask.
  • 2. The tension mask assembly of claim 1, with the vertical center axis of an etched area at the upper end surfaces of said first and second dummy bridges being offset from the vertical center axis of an etched area at the lower end surfaces of said first and second dummy bridges toward the center of said tension mask to accommodate a deflected electron beam being blocked.
  • 3. The tension mask assembly of claim 1, with an etched area at the upper end surfaces of said first and second dummy bridges being wider than an etched area at the lower end surfaces of said first and second dummy bridges.
  • 4. The tension mask assembly of claim 1, with an etched area at an upper surface above the first etching boundary of said first dummy bridge being wider than an etched area at a lower surface therebelow, and an etched area at a lower surface below the second etching boundary of said second dummy bridge being wider than an etched area at an upper surface thereabove.
  • 5. A tension mask assembly for a flat cathode ray tube, comprising:a tension mask comprising a plurality of strips separated from one another by a predetermined gap, real bridges connecting adjacent strips to define slots accommodating electron beams to pass, and first and second dummy bridges extending from adjacent strips toward each slot therebetween, said tension mask being installed to include a top surface of said tension mask facing a panel forming a screen and being separated from said panel by a predetermined gap; a plurality of supporting members disposed at opposite sides of said tension mask to support said tension mask; and a plurality of rigid members secured to opposite ends of said supporting members to apply tension to said tension mask, a first etching boundary being formed at an end of said first dummy bridge near to the center of the tension mask being lower with respect to the screen than a second etching boundary formed at an end of said second dummy bridge near to the periphery of said tension mask, with the vertical center axis of an etched area at the upper end surfaces of said first and second dummy bridges being offset from the vertical center axis of an etched area at the lower end surfaces of said first and second dummy bridges toward the center of said tension mask to accommodate a deflected electron beam being blocked, with the amount of offset increasing from the center of said tension mask toward the periphery of said tension mask.
  • 6. A tension mask assembly, comprising:a tension mask including a plurality of strips separated from one another by a predetermined gap, real bridges connecting adjacent strips to define slots accommodating electron beams to pass, and first and second dummy bridges extending from adjacent strips toward each slot therebetween, said tension mask being installed to include a top surface of said tension mask facing a panel forming a screen and being separated from said panel by a predetermined gap, a first etching boundary being formed at an end of said first dummy bridge near to the center of the tension mask being lower with respect to the screen than a second etching boundary formed at an end of said second dummy bridge near to the periphery of said tension mask.
  • 7. The tension mask assembly of claim 6, with the vertical center axis of an etched area at the upper end surfaces of said first and second dummy bridges being offset from the vertical center axis of an etched area at the lower end surfaces of said first and second dummy bridges toward the center of said tension mask to accommodate a deflected electron beam being blocked.
  • 8. The tension mask assembly of claim 6, with an etched area at the upper end surfaces of said first and second dummy bridges being wider than an etched area at the lower end surfaces of said first and second dummy bridges.
  • 9. The tension mask assembly of claim 6, with an etched area at an upper surface above the first etching boundary of said first dummy bridge being wider than an etched area at a lower surface therebelow, and an etched area at a lower surface below the second etching boundary of said second dummy bridge being wider than an etched area at an upper surface thereabove.
  • 10. A tension mask assembly, comprising;a tension mask including a plurality of strips separated from one another by a predetermined gap, real bridges connecting adjacent strips to define slots accommodating electron beams to pass, and first and second dummy bridges extending from adjacent strips toward each slot therebetween, said tension mask being installed to include a top surface of said tension mask facing a panel forming a screen and being separated from said panel by a predetermined gap, a first etching boundary being formed at an end of said first dummy bridge near to the center of the tension mask being lower with respect to the screen than a second etching boundary formed at an end of said second dummy bridge near to the periphery of said tension mask, with the vertical center axis of an etched area at the upper end surfaces of said first and second dummy bridges being offset from the vertical center axis of an etched area at the lower end surfaces of said first and second dummy bridges toward the center of said tension mask to accommodate a deflected electron beam being blocked, with the amount of offset increasing from the center of said tension mask toward the periphery of said tension mask.
  • 11. A tension mask assembly, comprising:a tension mask, comprising: a plurality of strips separated from one another by a predetermined gap; real bridges connecting adjacent strips to define slots accommodating electron beams to pass; and first and second dummy bridges extending from adjacent first and second strips, respectively, toward each slot therebetween, said tension mask being installed to include a top surface of said tension mask facing a panel forming a screen and being separated from said panel by a predetermined gap, with each one of the slots on a first portion of the tension mask including a first etching boundary being formed at an end of the first dummy bridge near to the center of the tension mask being lower with respect to the screen than a second etching boundary formed at an end of the second dummy bridge near to the periphery of said tension mask, and at a section of the slots without the dummy bridges including a third etching boundary being formed at an end of the first strip near to the center of the tension mask being higher with respect to the screen than a fourth etching boundary formed at an end of the second strip near to the periphery of the tension mask; and a first unit supporting and applying tension to said tension mask.
  • 12. The tension mask assembly of claim 11, further comprising a center portion of the tension mask including slots with first and second dummy bridges being symmetric with each other where an etched area at an upper end surface of the first and second dummy bridges is substantially the same as an etched area at lower end surfaces of the first and second dummy bridges.
  • 13. The tension mask assembly of claim 12, further comprising a peripheral portion of the tension mask including slots with a first etching boundary being formed at an end of a first dummy bridge near to the center of the tension mask being lower with respect to the screen than a second etching boundary formed at an end of a second dummy bridge near to the periphery of said tension mask, the first dummy bridge of the peripheral portion being nearer to the center of the tension mask than the second dummy bridge and the second dummy bridge being nearer to the periphery of the tension mask than the first dummy bridge of the peripheral portion.
  • 14. The tension mask assembly of claim 13, with an etched area at the upper end surfaces of said first and second dummy bridges being wider than an etched area at the lower end surfaces of said first and second dummy bridges.
  • 15. The tension mask assembly of claim 14, with an etched area at an upper surface above the first etching boundary of said first dummy bridge being wider than an etched area at a lower surface therebelow, and an etched area at a lower surface below the second etching boundary of said second dummy bridge being wider than an etched area at an upper surface thereabove.
  • 16. The tension mask assembly of claim 15, with the etched area at the top surfaces of the first and second strips being wider than the etched area at the lower surface of the first and second strips where the top surfaces of the first and second strips face the screen.
  • 17. The tension mask assembly of claim 16, with the vertical center axis of an etched area at the upper end surfaces of said first and second dummy bridges being offset from the vertical center axis of an etched area at the lower end surfaces of said first and second dummy bridges toward the center of said tension mask to accommodate a deflected electron beam being blocked,with the amount of offset increasing from the center of said tension mask toward the periphery of said tension mask.
  • 18. The tension mask assembly of claim 11, with the vertical center axis of an etched area at the upper end surfaces of said first and second dummy bridges being offset from the vertical center axis of an etched area at the lower end surfaces of said first and second dummy bridges toward the center of said tension mask to accommodate a deflected electron beam being blocked.
  • 19. The tension mask assembly of claim 18, with the amount of offset increasing from the center of said tension mask toward the periphery of said tension mask.
  • 20. A tension mask assembly, comprising:a tension mask, comprising: a plurality of strips separated from one another by a predetermined gap; real bridges connecting adjacent strips to define slots accommodating electron beams to pass; and first and second dummy bridges extending from adjacent first and second strips, respectively, toward each slot therebetween, said tension mask being installed to include a top surface of said tension mask facing a panel forming a screen and being separated from said panel by a predetermined gap, an etched depth at each one of the upper end surfaces of the first and second dummy bridges being substantially the same as an etched depth at each one of the lower end surfaces of the first and second dummy bridges where the first dummy bridge is near to the center of the tension mask and the second dummy bridge is near to the periphery of said tension mask, and a portion without the dummy bridges of each of the slots including a third etching boundary being formed at an end of the first strip near to the center of the tension mask being higher with respect to the screen than a fourth etching boundary formed at an end of the second strip near to the periphery of said tension mask; and a first unit supporting and applying tension to said tension mask.
Priority Claims (1)
Number Date Country Kind
2000-72936 Dec 2000 KR
US Referenced Citations (7)
Number Name Date Kind
5856725 Ueda Jan 1999 A
6388370 Ohmae May 2002 B1
6433468 Shinoda Aug 2002 B1
6577047 Ohmae et al. Jun 2003 B2
20010050524 Choe et al. Dec 2001 A1
20020014821 Kobayashi et al. Feb 2002 A1
20020050777 Kim et al. May 2002 A1
Foreign Referenced Citations (1)
Number Date Country
52022474 Feb 1977 JP