Claims
- 1. A method for processing a terminal of a cable having a plurality of coaxial cables arranged in parallel, comprising the steps of:removing sheaths of said coaxial cables in a portion close to said terminal so as to expose outer conductors of said coaxial cables; covering entirety of said outer conductors thus exposed with a solder layer; separating said solder layer and said outer conductors into two portions at a predetermined longitudinal position of said solder layer; and removing said portion of said solder layer and said outer conductors positioned on tip side relative to said predetermined longitudinal position, in a lump, so as to expose insulative layers of said coaxial cables.
- 2. The method as defined in claim 1, wherein:the step of separating comprises the step of bending said solder layer together with outer conductors, said insulative layers and said inner conductors up and down at a fulcrum of said predetermined position.
- 3. The method as defined in claim 7, wherein:the step of bending comprises the step of forming a groove on said solder layer at said predetermined position thereof to be used for said fulcrum.
- 4. The method as defined in claim 3, wherein:the step of forming comprises the step of radiating laser light to said solder layer to form said groove.
- 5. The method as defined in claim 3, wherein:the step of forming comprises the step of grooving said solder layer by use of a knife.
- 6. The method as defined in claim 1, further comprising the step of:soldering a grounding conductive metal plate on said solder layer.
- 7. The method as defined in claim 6, wherein:the step of soldering comprises the step of soldering a pair of said grounding conductive metal plates on both surfaces of said solder layer.
- 8. The method as defined in claim 1, further comprising the steps of:adhering an insulative tape to said insulative layers exposed at the step of removing, thereby arranging said insulative layers in parallel with a predetermined pitch; radiating laser light on said insulative layers at a predetermined radiating position between said insulative tape and said solder layer left on said outer conductors; and shifting said insulative layers towards ends thereof together with said insulative tape, thereby exposing said inner conductors along a predetermined length measuring from said predetermined radiation position.
- 9. The method as defined in claim 8, wherein:the step of shifting comprises the step of cutting said insulative layers extended out of said insulative tape.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-40398 |
Feb 1999 |
JP |
|
Parent Case Info
This application is a Divisional of application Ser. No. 09/506,387 filed Feb. 18, 2000.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5940963 |
Tolmie et al. |
Aug 1999 |
A |
6148510 |
Yokoi et al. |
Nov 2000 |
A |
Foreign Referenced Citations (1)
Number |
Date |
Country |
10-144145 |
May 1998 |
JP |