The present invention relates to a terminal which is received in a housing of a connector and is soldered on a wiring substrate.
Generally, in order to make electrical connection between a wiring substrate and a cable, a connector for substrate is mounted on the wiring substrate, and a connector of the cable side is connected to this connector for substrate.
This connector for substrate has plural terminals made of metal inside a housing, and these terminals are soldered and connected to a conductor pattern of the wiring substrate on which the connector is mounted.
As shown in FIG. 7, this kind of terminal 1 has a tab 2 inserted into a housing and received in a connector, and a lead part 3 soldered to a conductor pattern of a wiring substrate. The plural terminals 1 are formed in a chain shape joined by joining parts 5 extending from a carrier 4 by pressing a metal plate, and are used by being cut and separated from the joining parts 5 (see Patent Reference 1).
Patent Reference 1: JP-A-2009-158325
Incidentally, in the terminal 1 described above, the joining parts 5 are joined to both sides so as to pinch the tab 2 inserted into the housing, so that when the terminal 1 is cut and separated in the joining parts 5, burrs are formed on both sides of the terminal 1.
When the burrs are formed on both sides of the terminal 1, a creepage distance between pitches of the adjacent terminals 1 is not ensured sufficiently and a short circuit may occur in the case of being received in the connector. Also, in the case of receiving the terminal 1 in the housing, the burrs chip an inner wall of a housing receiving part to generate chips, and the chips may cause poor connection in the case of soldering the terminal 1.
The invention has been implemented in view of the circumstances described above, and an object of the invention is to provide a terminal capable of being received in a housing of a connector and being well soldered to a substrate without causing trouble such as a short circuit or poor connection.
The object according to the invention is achieved by the following configurations.
(1) A terminal, comprising a connecting part connected to a terminal of the other connector, and a lead part soldered to a conductor pattern of a circuit substrate, wherein the terminal is molded in a state joined to a joining part extending from a carrier by pressing a conductive metal material and is used by being cut and separated from the carrier, the lead part is plated with tin, and a notch part, whose thickness is thinned, cut from a surface side soldered to the conductor pattern by a cutter is had between the lead part and the joining part, and the notch part is provided with a guide part for guiding the cutter to a side of the joining part and forming a fillet forming piece made of a part of the notch part on a side of the lead part after cutting of the notch part by the cutter.
According to the terminal with the configuration of the above (1), when the notch part is cut by the cutter, by the guide part, the cutter is guided to the side of the joining part and the fillet forming piece made of a part of the notch part is formed on the end of the lead part after cutting of the notch part by the cutter. This fillet forming piece is deformed by the cutter and is formed in a shape warped to the side opposite to the side soldered to the conductor pattern in the lead part.
Consequently, according to this terminal, a large area of a tin-plated portion to which solder is fastened can be ensured in the end of the lead part on which the fillet forming piece is formed, and a large solder fillet is formed on a solder part in the case of soldering. Hence, even when the joining part of the carrier is joined to the back end of the lead part and the terminal is cut and separated in this joined place, the lead part can extremely well be soldered and fixed to the conductor pattern of the circuit substrate without performing complicated post plating processing with respect to its cut place.
Also, since the end of the lead part is joined to the joining part of the carrier, occurrence of burrs on both sides can be eliminated as compared with a conventional structure in which both sides of the intermediate part are joined to the joining part of the carrier. Accordingly, trouble in which a creepage distance between the adjacent terminals is not ensured sufficiently and a short circuit occurs can be prevented surely. Also, in the case of being received in the connector, there is no situation in which burrs chip the connector and the chips cause poor connection.
In addition, when the top of the connecting part is joined to the joining part of the carrier, burrs on both sides of the terminal do not occur, but burrs may occur on the top of the connecting part and become an obstacle to connection to a terminal of the other connector. However, in the configuration described above, the joining part of the carrier is joined to the end of the lead part, so that occurrence of the burrs on the connecting part can be prevented and hence, connection to the terminal of the other connector can be made well and smoothly.
(2) A terminal with the configuration of the above (1), wherein the guide part has a guide surface bulging in a circular arc shape.
According to the terminal with the configuration of the above (2), the cutter can naturally smoothly be guided to the side of the joining part to form the fillet forming piece on the side of the lead part by the guide surface bulging in the circular arc shape on the guide part.
a) and 3(b) are views showing the terminal mounted on a circuit substrate, and
a) to 6(d) are diagrams describing a situation of cutting and separation from the carrier, and
An embodiment according to the invention will hereinafter be described with reference to the drawings.
As shown in
As shown in
As shown in
As shown in
Here, an outer surface of the fixing piece part 16 of at least the lead part 13 in the terminal 11 is previously plated with pure tin (Sn), and a tin-plated layer 11a is formed on the outer surface of the fixing piece part 16. As a result, in the fixing piece part 16, solder 33 well adapts to the tin-plated layer 11a and the fixing piece part 16 is surely conducted and connected to the conductor pattern 32. Also, in the lead part 13 of the terminal 11, a fillet forming piece 17 extending in an upwardly warped state is formed on the back end of the fixing piece part 16. Then, in the back end of the fixing piece part 16 having this fillet forming piece 17, the tin-plated layer 11a to which the solder 33 is fastened has a large area, and a large solder fillet 33a is formed in the solder 33. In addition, an end face of the fillet forming piece 17 is a cut surface of the fixing piece part 16 after the fixing piece part 16 is plated with tin, and the tin-plated layer 11a is not formed on this cut surface.
As shown in
As shown in
After the plural terminals 11 joined to the carrier 41 thus are cut and separated from the joining parts 42 in the notch parts 44, the lead part 13 is folded in a predetermined shape and the joining piece part 15 and the fixing piece part 16 are formed and the terminal 11 is pressed in the cavity 23. In addition, in the terminal 11, the lead part 13 may be folded in a state joined to the carrier 41 to form the joining piece part 15 and the fixing piece part 16.
Next, cutting and separation in which the notch part 44 is cut and the terminal 11 joined to the carrier 41 is separated will be described.
a) to 6(d) are diagrams describing a situation of cutting and separation from the carrier 41, and
As shown by arrow A of
Then, when the blade edge 51a of this cutter 51 is moved dose to the notch part 44, the taper surface 51b of this cutter 51 makes contact with the guide surface 45a of the guide part 45 bulging in the circular arc shape before the blade edge 51a reaches the notch part 44 as shown in
When the taper surface 51b is brought into contact with the guide surface 45a and is moved, the cutter 51 is guided along the guide surface 45a as shown by arrow B of
Accordingly, after the blade edge 51a of the cutter 51 is displaced to the side of the joining part 42 in a direction away from the lead part 13, the blade edge 51a reaching the notch part 44 makes contact with the side of the joining part 42 in the notch part 44 as shown in
When the cutter 51 is further moved in this state, the blade edge 51a of the cutter 51 bites into the notch part 44 and the notch part 44 is cut as shown in
As described above, in the terminal 11 cut and separated from the carrier 41, the fillet forming piece 17 extending in an upwardly warped state is formed on the back end of the fixing piece part 16 of the lead part 13. Consequently, according to this terminal 11, a large area of the tin-plated layer 11a to which the solder 33 is fastened can be ensured in the back end of the fixing piece part 16 having the fillet forming piece 17, and when the fixing piece part 16 is soldered to the conductor pattern 32 of the circuit substrate 31, the large solder fillet 33a is formed as a formation part of the solder 33. Hence, even when the joining part 42 of the carrier 41 is joined to the back end of the lead part 13 and the terminal 11 is cut and separated in this joined place, the fixing piece part 16 of the lead part 13 can extremely well be soldered and fixed to the conductor pattern 32 of the circuit substrate 31 without performing complicated post plating processing with respect to its cut place.
Also, since the back end of the terminal 11 is joined to the carrier 41, occurrence of burrs on both sides can be eliminated as compared with a conventional structure in which both sides of the intermediate part of the terminal 11 are joined to the carrier 41. Accordingly, trouble in which a creepage distance between the adjacent terminals 11 is not ensured sufficiently and a short circuit occurs can be prevented surely. Also, in the case of being pressed in the cavity 23 of the housing 22, there is no situation in which burrs chip an inner wall of the cavity 23 and the chips cause poor connection.
In addition, when the top of the tab 12 is joined to the joining part 42 of the carrier 41, burrs by cutting and separation on both sides of the terminal 11 do not occur, but in this case, burrs may occur on the top of the tab 12 and become an obstacle to connection to a female terminal of the other connector. However, in the embodiment, the joining part 42 of the carrier 41 is joined to the end of the lead part 13, so that occurrence of the burrs on the tab 12 can be prevented and hence, connection to the female terminal of the other connector can be made well and smoothly.
That is, according to the terminal 11 according to the embodiment, the terminal 11 can well be soldered to the conductor pattern 32 of the circuit substrate 31 without causing trouble such as a short circuit or poor connection.
In addition, the invention is not limited to the embodiment described above, and modifications, improvements, etc. can be made properly. Moreover, as long as the invention can be achieved, materials, shapes, dimensions, numerical values, forms, the number of components, arrangement places, etc. of each component in the embodiment described above are freely selected and are not limited.
Also, the present application is based on Japanese patent application (patent application No. 2010-288104) filed on Dec. 24, 2010, and the contents of the patent application are hereby incorporated by reference.
According to a terminal according to the invention, the terminal can be received in a housing of a connector and be well soldered to a substrate without causing trouble such as a short circuit or poor connection.
Number | Date | Country | Kind |
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2010-288104 | Dec 2010 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/JP2011/079821 | 12/22/2011 | WO | 00 | 6/21/2013 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2012/086759 | 6/28/2012 | WO | A |
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Entry |
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Korean Office Action for the related Korean Patent Application No. 10-2013-7015927 dated Mar. 18, 2014. |
International Search Report and Written Opinion of the International Search Report for PCT/JP2011/079821 dated Feb. 28, 2012. |
Chinese Office Action and Search Report for the related Chinese Patent Application No. 201180062558.7 dated Feb. 3, 2015. |
Number | Date | Country | |
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20130273782 A1 | Oct 2013 | US |