Claims
- 1. A test socket for an integrated circuit package having a plurality of test sites comprising:
an upper housing positioned on a circuit board having a cavity for receipt of the integrated circuit package; a lower housing positioned below the circuit board having a plurality of channels for receipt of solid test pins; compliant means positioned below the circuit board for urging the test pins through the circuit board and into electrical contact with the test sites on the integrated circuit package; and means for insulating the test pins between the compliant means and the test sites.
- 2. The test socket of claim 1 wherein the circuit board includes a plurality of plated through holes for guiding the travel of the test pins through the circuit board and transferring test signals from the test sites to the circuit board.
- 3. The test socket of claim 1 wherein the compliant means is a spring positioned within each channel of the lower housing below the test pins.
- 4. The test socket of claim 3 wherein the means for insulating is a nonconductive pushrod positioned between the spring and the test pins.
- 5. The test socket of claim 1 wherein the means for insulating is a nonconductive cap positioned between the circuit board and the integrated circuit package.
- 6. The test socket of claim 4 wherein the test pins have a beveled edge for contacting the pushrod.
- 7. The test socket of claim 5 wherein the nonconductive cap includes means for retaining the test pins in the test socket.
- 8. A test socket for an integrated circuit package having a plurality of test sites comprising:
an upper housing positioned on a first circuit board, the upper housing having a cavity for receipt of the integrated circuit package; a second circuit board having a hole for receipt of the first circuit board; a lower housing positioned below the first circuit board and extending through the hole in the second circuit board, the lower housing having a plurality of channels for receipt of solid test pins; and compliant means positioned below the first circuit board for urging the test pins through the first circuit board and into electrical contact with the test sites on the integrated circuit package.
- 9. The test socket of claim 8 wherein the first circuit board includes a plurality of plated through holes for guiding the travel of the test pins through the first circuit board and transferring test signals from the test sites to the circuit board.
- 10. The test socket of claim 1 wherein the compliant means is a spring positioned within each channel of the lower housing below the test pins.
- 11. The test socket of claim 8 wherein the first circuit board is soldered to the second circuit board.
- 12. The test socket of claim 8 wherein the first circuit board is connected to the second circuit board by a shielded probe positioned between the first and second circuit boards.
- 13. The test socket of claim 8 wherein the first circuit board is connected to the second circuit board by a flexible circuit board.
- 14. The test socket of claim 13 wherein the lower housing is connected to the second circuit board by a bracket.
CROSS REFERENCE TO RELATED APPLICATIONS
1. This application is a continuation-in-part of U.S. patent application Ser. No. 09/044,874 filed Mar. 20, 1998 which is a continuation-in-part of U.S. patent application Ser. No. 08/839,723 filed Apr. 15, 1997.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09139543 |
Aug 1998 |
US |
Child |
09748519 |
Dec 2000 |
US |
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
09044874 |
Mar 1998 |
US |
Child |
09139543 |
Aug 1998 |
US |
Parent |
08839723 |
Apr 1997 |
US |
Child |
09044874 |
Mar 1998 |
US |