Some electronic devices may include a covering that provides a visually-appealing appearance and/or a pleasing tactile user interface. Providing a suitable textile covering for an electronic device that embodies these characteristics while also avoiding additional complexity and/or cost in corresponding manufacturing and assembly processes can prove challenging.
This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Furthermore, the claimed subject matter is not limited to implementations that solve any or all disadvantages noted in any part of this disclosure.
Examples are disclosed that relate to textile coverings for electronic devices and methods for manufacturing textile coverings for electronic devices. In one example, a textile covering for an electronic device comprises one or more structural fibers woven into a seamless tube, the seamless tube configured to encircle at least a portion of the electronic device. The textile covering also comprises one or more heat-shrink fibers woven into the seamless tube. The heat-shrink fibers shrink when the seamless tube is heated above a threshold temperature, thereby constricting the seamless tube around the electronic device. Additionally or alternatively, the textile covering may comprise one or more adhesive fibers woven into the seamless tube. The one or more adhesive fibers adhere the textile covering to the electronic device.
Another example provides a method for manufacturing a textile covering for an electronic device. The method comprises weaving one or more structural fibers into a seamless tube, the seamless tube configured to encircle at least a portion of the electronic device. The method also comprises weaving one or more heat-shrink fibers and/or one or more adhesive fibers into the seamless tube. When the textile covering comprises the one or more heat-shrink fibers, the method comprises heating the seamless tube above a threshold temperature, thereby constricting the seamless tube around the electronic device. When the textile covering comprises the one or more adhesive fibers, the method comprises adhering the textile covering to the electronic device via the adhesive fibers.
Electronic device coverings may provide a device with a visually pleasing and/or personalized appearance, as well as provide a comfortable tactile experience when touched. For example, a textile covering may mask unappealing parts of the electronic device, such as areas that are formed from different materials, openings in the device, or components such as speakers, lights, or sensors.
In some examples, the textile covering may be configured as a tube that encircles at least a portion of the electronic device. However, tubular textile coverings that include one or more seams may provide a less-than-desirable user experience. For example, a seam may detract from the appearance of the covering and the underlying device. Further, a seam also may hinder or negatively impact the user's tactile interactions with the covering, particularly if it obstructs or overlies a location where the user intends to touch or grip the device.
Additionally, utilizing a seam may add complexity and/or cost to the covering's assembly and manufacturing processes. For example, in addition to sewing the seam itself, the tube may further require trimming, smoothing, and/or other post-processing procedures to smooth raw edges, treat, or otherwise finish the seam.
Accordingly, and in one potential advantage of the present disclosure, a textile covering for an electronic device comprises a seamless tube. As described in more detail below, utilizing the seamless tube may simplify the covering's assembly and/or manufacturing, while also contributing to a pleasing visual and tactile user experience. The seamless tubes may include heat-shrink fibers and/or adhesive fibers to improve manufacturability and related installation considerations of the covering.
In some examples, textile coverings of the present disclosure also may provide electronic devices with an intuitive tactile user interface. For example, as described in more detail below, one or more locations on the device may be designated by portions of the textile having distinctive characteristic(s), such as a unique or contrasting tactile feel, a different color, etc. In this manner, users may be guided or naturally drawn to touch or grip the device at such locations.
As shown in
The seamless tube 112 may be formed via any suitable technique, such as by weaving the one or more structural fibers 108 on a loom. In other examples, knitting, sewing, felting, or other techniques may be utilized. As described below, the yarns may be woven together in a plain weave pattern, in which a single crosswise or weft fiber alternates over and under a single lengthwise or warp fiber. It will be appreciated that the seamless tube may have any other suitable dimensions and textile characteristics that accommodate different types and configurations of electronic devices. For example, the seamless tube may be configured to cover the entire electronic device or only a portion of the device.
In some examples, multiple textile coverings may be created by weaving a single, continuous seamless tube that is then cut to produce coverings of a desired length. Each covering may then be finished using any suitable finishing processes, and treated as a piece part during assembly of the electronic device. Producing the textile covering in this manner may provide operational and cost advantages. However, it will also be appreciated that the textile covering may be produced in any other suitable manner, including producing one at a time.
In the example of
In this example, the seamless tube 208 comprises a tapered end 212 configured to encircle and envelop the tapered portion 216 of the pen 104.
It will also be appreciated that various characteristics of the textile, such as the EPI and PPI, may be configured in any suitable manner to accommodate the structure of the tapered seamless tube 208. For example, these characteristics may change in locations where the textile tapers. In this manner, the textile covering 200 may conform to an underlying structure of the electronic device to provide a desired form factor or achieve an intended user experience.
A variety of suitable methods may be used to create such varying forms or structures. In one example of producing a tapered end, the seamless tube 208 may be woven on a loom that includes one or more adjustable reeds. When the loom is set up, a lengthwise or warp fiber may be threaded through heddles that move the structural fibers into a pattern, then through a “V” reed that sets a density of the fibers. By collapsing the V reed, the fibers may be compacted into a denser structure that reduces the diameter of the seamless tube to produce a tapered end. In this manner, the seamless tube 208 may be woven with a variety of textures and/or shapes.
Additionally and in some examples, different types of fibers may be utilized to alter the shape, texture, and/or other properties of the seamless tube. For example, and with reference again to
As noted above, incorporating different textures into a textile covering may augment a user's tactile experience with an electronic device. Accordingly, the seamless tube 112 may comprise a plurality of differently-textured areas to provide a user of the pen 104 with a different tactile experience in each area. For example, the textile covering 100 may provide a grip area 122 that features a softer texture, such as a sateen weave, as compared to other areas of the textile covering. In this manner, the user may have a more comfortable tactile experience and may be more inclined to grip the pen at the grip area 122.
In some examples, the textile covering may be made thicker in one or more areas to provide the user with visual and tactile cues for where and/or how to grip the device. For example, the grip feature described above may comprise a raised area 116 that projects outwardly from the seamless tube 112. The structural fibers in the raised area 116 may differ from the structural fibers in the rest of the seamless tube 112. For example, cutout view 120 depicts the structural fibers 108 that comprise most of the seamless tube 112 in the example of
Additionally and in some examples, differently-textured areas on the textile covering may be used to guide the user to a location of an underlying component of the pen 104. Such components may include one or more haptic feedback mechanisms, such as a linear resonant actuator, input buttons, pressure or touch sensors, biometric sensors, etc. Utilizing unique textures at these locations may also enhance tactile feedback when the user interacts with such components.
Such different textures in a textile covering may be provided in a variety of ways. For example, as described above, a loom may be used to weave various textures, forms, and materials into the seamless tube 112. In other examples, one or more post-processing treatments may be applied to change the texture of the seamless tube 112. Some non-limiting examples of post-processing treatments may include trimming, chemical processing, or applying additional materials onto the seamless tube 112. In other examples, the yarns or other structural fibers may have any other suitable structure configurable to create differently textured areas within the seamless tube 112.
In some examples, different textures may also be provided by incorporating two or more different weave patterns at different locations of the textile covering. For example, one or more of satin, twill, basket weave, and plain weave patterns may utilized at different locations. Accordingly, each weave pattern may provide a different tactile experience when touched.
For example and with continued reference to
In this manner, the basket weave pattern may provide a coarser texture in the rough area 132 as compared to the plain weave pattern utilized in other portions of the cover. It will also be appreciated that in other examples, different weave patterns may be incorporated to provide other effects, such as making the texture smoother.
The seamless tube 112 may additionally or alternatively include one or more differently-colored areas. Like the differently-textured areas, different colors may indicate various functional areas on the pen 104, such as a location of a button or a sensor. For example, the large structural fibers 130 in the raised area 116 may be given a different color that contrasts with the structural fibers 108 in the remainder of the covering. This may highlight the grip area 122 for users. In another example, the rough textured area 132 may be a different color than the remainder of the seamless tube 112 to indicate the location of a button or sensor.
In some examples, different weave patterns may be used to incorporate different colors into the seamless tube 112. For example, a jacquard weave may be used to incorporate structural fibers of different colors at different positions on the seamless tube 112 to weave differently-colored areas or different patterns directly into the textile.
It will also be appreciated that such differently-colored areas may be provided in any suitable manner, such as using one or more post-processing treatments. Some non-limiting examples of post-processing color treatments include dying, bleaching, or depositing one or more colored materials on the seamless tube 112. It will be appreciated that these and other post-processing treatments described herein may be applied at any point during manufacturing or assembly of the textile covering 100 and pen 104, including before and/or after the textile covering 100 is fitted over the device.
As described in more detail below and with reference now to
To facilitate an easier assembly process, in some examples the seamless tube 308 may comprise one or more heat-shrink fibers. In these examples, and in one potential advantage of the present disclosure, the heat-shrink fibers may be configured to stretch while being slid over the pen 304, and then constrict around at least a portion of the pen when heated. In the example of
The one or more heat-shrink fibers 320 may comprise any suitable heat-shrink material. Some examples of suitable heat-shrink fibers 320 include a polyester, lycra, or elastane core surrounded by a natural or synthetic material such as nylon. In this manner, the one or more heat-shrink fibers 320 may complement the material properties of the structural fibers 312 by providing the seamless tube 308 with heat-shrink properties.
Each heat-shrink fiber 320 may be configured to shrink when the seamless tube 308 is heated to a temperature above a threshold temperature, thereby constricting the seamless tube 308 around the barrel 326 of the pen 304. In some examples, to facilitate easier assembly, the seamless tube 308 may be woven with a slightly larger diameter than the barrel 326 of the pen 304. After sliding and positioning the seamless tube 308 over the barrel 326 of pen 304, the tube may be heated above a threshold temperature, such as approximately 250-260° C. for a polymer yarn, to cause the heat-shrink fibers 320 to constrict and squeeze the tube against the barrel of the pen. In this manner, the seamless tube 308 may accommodate and be securely fitted to a variety of form factors of the underlying device.
For example, the heat-shrink fibers 320 may enable a seamless tube to accommodate a tapered portion of an electronic device without weaving a tapered end into the seamless tube itself. In one example, the length of seamless tube 308 of
In other examples, a seamless tube that includes a woven tapered end, such as the seamless tube 208 of
In some examples, a seamless tube of a textile covering may additionally or alternatively include one or more adhesive fibers woven into the tube. In these examples, the one or more adhesive fibers may fuse or adhere the seamless tube to the underlying structure of an electronic device. Examples of adhesive fibers that may be utilized include nylon and polyester filaments that melt or fuse when heated above a threshold temperature.
In one example and with reference now to
In other examples, a textile covering may be adhered to an electronic device via a layer or film of adhesive material deposited on an inner surface of the covering. For example,
In some examples, one or more of the textile coverings described herein may be configured to be interchangeable with other coverings. In this manner, and with reference to the example of
In some examples, a seamless tube of a textile covering may additionally or alternatively include one or more conductive fibers woven into the tube that may complement functionality of an underlying electronic device. For example, sensing and/or output functionality of a device may be provided or enhanced by incorporating one or more conductive fibers into a textile covering.
With reference now to
The one or more conductive fibers 812 may comprise any suitable material or structure. In some examples, each of the conductive fibers 812 may comprise an intrinsically conductive wire covered by a textile material, such as a silver or copper core covered with nylon or polyester. For example, a conductive yarn may be formed via a pull through yarn process. In this manner, robust, wrapped wires may be produced that may be woven into the seamless tube 816.
In another example, each of the one or more conductive fibers 812 may comprise a nonconductive material, such as a polymer, monofilament, or staple filament, that is treated with a conductor, such as copper or silver, and formed into a yarn. In other examples, each conductive fiber 812 may comprise a conductive yarn coated with an enamel dielectric coating. In this manner, the dielectric coating may prevent the conductive fibers 812 from short-circuiting.
The one or more conductive fibers 812 may provide the textile covering 800 with touch-sensing or other electronic capability. For example, the one or more conductive fibers 812 may comprise a resistive or capacitive touch sensor, pressure sensor, and/or proximity sensor, an antenna, an inductive coil for wireless charging, an inductive sensor, or any other suitable electronic component. The conductive fibers 812 may additionally or alternatively facilitate connections with one or more output components and/or indicators, such as standalone lights or LED arrays, which in some examples may be printed on flexible circuit boards.
Utilizing conductive fibers in this manner may provide the pen 804 with a wide range of functionality. For example, the one or more conductive fibers 812 may comprise a touch sensor integrated into the textile covering 800 and configured to detect how a user is holding the pen 804. In some examples, the user's grip on the pen 804 may be used to predict how the user's hand may occlude a display of a tablet computing device, which may respond by rearranging how user interface elements are displayed. Similar inputs may also help the tablet computing device filter out noise from the user's hand contacting a touch-screen display, or rearrange the user interface to accommodate preferences of left- or right-handed users. In yet another example, the one or more conductive fibers 812 may also provide biometric sensing capabilities, which may be used to help a computing device identify the user.
Accordingly, by weaving the one or more conductive fibers 812 into the seamless tube 816, sensing functionality may be provided by the textile covering 800. In some examples, the one or more conductive fibers 812 may form a continuous sensor around the entirety of the seamless tube 816. In other examples, electronic functionality may be provided by depositing one or more conductive traces on the textile material. For example, conductive traces may be printed on an inside or outside surface of the textile by processes such as silk screening or ink jet printing.
It will be appreciated that textile coverings of the present disclosure may or may not include electronic functionality and/or conductive components. For example, a textile covering configured to cover an electronic device for cosmetic and/or tactile purposes may not include conductive properties.
With reference now to
At 904, the method 900 includes weaving one or more structural fibers into a seamless tube that is configured to encircle at least a portion of the electronic device. At 908, the method 900 includes weaving one or more heat-shrink fibers and/or one or more adhesive fibers into the seamless tube. At 912, the method 900 includes, when the textile covering comprises the one or more heat-shrink fibers, heating the seamless tube above a threshold temperature to constrict the seamless tube around the electronic device. At 916, the method 900 includes, when the textile covering comprises the one or more adhesive fibers, adhering the textile covering to the electronic device via the adhesive fibers.
The following paragraphs provide additional support for the claims of the subject application. One aspect provides a textile covering for an electronic device, the textile covering comprising: one or more structural fibers woven into a seamless tube, the seamless tube configured to encircle at least a portion of the electronic device; and one or more heat-shrink fibers woven into the seamless tube, wherein the heat-shrink fibers shrink when the seamless tube is heated above a threshold temperature, thereby constricting the seamless tube around the electronic device. The textile covering may additionally or alternatively include, wherein the seamless tube further comprises a tapered end. The textile covering may additionally or alternatively include, wherein the one or more heat-shrink fibers comprise one or more polyester or elastane fibers. The textile covering may additionally or alternatively include, an adhesive layer configured to adhere the textile covering to the electronic device. The textile covering may additionally or alternatively include, one or more adhesive fibers woven into the seamless tube, wherein the one or more adhesive fibers adhere the textile covering to the electronic device. The textile covering may additionally or alternatively include, wherein the one or more structural fibers comprise two or more different structural fibers that each comprise a different material. The textile covering may additionally or alternatively include, wherein the seamless tube further comprises a plurality of differently-textured areas. The textile covering may additionally or alternatively include, wherein each of the differently-textured areas comprises a differently-sized structural fiber. The textile covering may additionally or alternatively include, wherein each of the differently-textured areas comprises a different weave pattern. The textile covering may additionally or alternatively include, wherein one or more of the plurality of differently-textured areas indicate an underlying component of the electronic device. The textile covering may additionally or alternatively include, one or more conductive fibers woven into the seamless tube. The textile covering may additionally or alternatively include, wherein the one or more conductive fibers provide inputs to the electronic device. The textile covering may additionally or alternatively include, wherein the electronic device comprises a hand-held pen configured to provide user input to a computing device.
Another aspect provides a textile covering for an electronic device, the textile covering comprising: one or more structural fibers woven into a seamless tube, the seamless tube configured to encircle at least a portion of the electronic device; and one or more adhesive fibers woven into the seamless tube, wherein the one or more adhesive fibers adhere the textile covering to the electronic device. The textile covering may additionally or alternatively include, wherein the seamless tube further comprises a tapered end. The textile covering may additionally or alternatively include, wherein the one or more structural fibers comprise two or more different structural fibers that each comprise a different material. The textile covering may additionally or alternatively include, wherein the seamless tube further comprises a plurality of differently-textured areas. The textile covering may additionally or alternatively include, wherein each of the differently-textured areas comprises a differently-sized structural fiber. The textile covering may additionally or alternatively include, wherein each of the differently-textured areas comprises a different weave pattern. The textile covering may additionally or alternatively include, wherein one or more of the plurality of differently-textured areas indicate an underlying component of the electronic device. The textile covering may additionally or alternatively include, one or more conductive fibers woven into the seamless tube. The textile covering may additionally or alternatively include, wherein the one or more conductive fibers provide inputs to the electronic device. The textile covering may additionally or alternatively include, wherein the electronic device comprises a hand-held pen configured to provide user input to a computing device.
Another aspect provides a method for manufacturing a textile covering for an electronic device, the method comprising: weaving one or more structural fibers into a seamless tube, the seamless tube configured to encircle at least a portion of the electronic device; weaving one or more heat-shrink fibers and/or one or more adhesive fibers into the seamless tube; when the textile covering comprises the one or more heat-shrink fibers, heating the seamless tube above a threshold temperature, thereby constricting the seamless tube around the electronic device; and when the textile covering comprises the one or more adhesive fibers, adhering the textile covering to the electronic device via the adhesive fibers.
It will be understood that the configurations and/or approaches described herein are exemplary in nature, and that these specific embodiments or examples are not to be considered in a limiting sense, because numerous variations are possible. The specific routines or methods described herein may represent one or more of any number of strategies. As such, various acts illustrated and/or described may be performed in the sequence illustrated and/or described, in other sequences, in parallel, or omitted. Likewise, the order of the above-described processes may be changed.
The subject matter of the present disclosure includes all novel and non-obvious combinations and sub-combinations of the various processes, systems and configurations, and other features, functions, acts, and/or properties disclosed herein, as well as any and all equivalents thereof.