Not Applicable.
To drill a well, a drill bit bores thousands of feet into the crust of the earth. The drill bit typically extends downward from a drilling platform on a string of pipe, commonly referred to as a “drill string.” The drill string may be jointed pipe or coiled tubing, through which drilling fluid is pumped to cool and lubricate the bit and lift the drill cuttings to the surface. At the lower, or distal, end of the drill string is a bottom hole assembly (BHA), which includes, among other components, the drill bit.
To obtain measurements and information from the downhole environment while drilling, the BHA includes electronic instrumentation. Various tools on the drill string, such as logging-while-drilling (LWD) tools and measurement-while-drilling (MWD) tools, incorporate the instrumentation. Such tools on the drill string contain various electronic components incorporated as part of the BHA that generally consist of computer chips, circuit boards, processors, data storage, power converters, and the like.
Downhole tools must be able to operate near the surface of the earth as well as many hundreds of meters below the surface. Environmental temperatures tend to increase with depth during the drilling of the well. As the depth increases, the tools are subjected to a severe operating environment. For example, downhole temperatures are generally high and may even exceed 200° C. In addition, pressures may exceed 138 MPa. There is also vibration and shock stress associated with operating in the downhole environment, particularly during drilling operations.
The electronic components in the downhole tools also internally generate heat. For example, a typical wireline tool may dissipate over 135 watts of power, and a typical downhole tool on a drill string may dissipate over 10 watts of power. While performing drilling operations, the tools on the drill string also typically remain in the downhole environment for periods of several weeks. In other downhole applications, drill string electronics may remain downhole for as short as several hours to as long as one year. For example, to obtain downhole measurements, tools are lowered into the well on a wireline or a cable. These tools are commonly referred to as “wireline tools.” However, unlike in drilling applications, wireline tools generally remain in the downhole environment for less than twenty-four hours.
A problem with downhole tools is that when downhole temperatures exceed the temperature of the electronic components, the heat cannot dissipate into the environment. The heat may accumulate internally within the electronic components and this may result in a degradation of the operating characteristics of the component or may result in a failure. Thus, two general heat sources must be accounted for in downhole tools, the heat incident from the surrounding downhole environment and the heat generated by the tool components, e.g., the tool's electronics components.
While the temperatures of the downhole environment may exceed 200° C., the electronic components are often rated to operate at no more than 125° C. Thus, exposure of the tool to elevated temperatures of the downhole environment and the heat dissipated by the components may result in the degradation of the thermal failure of those components. Generally, thermally induced failure has at least two modes. First, the thermal stress on the components degrades their useful lifetime. Second, at some temperature, the electronics may fail and the components may stop operating. Thermal failure may result in cost not only due to the replacement costs of the failed electronic components, but also because electronic component failure interrupts downhole activities. Trips into the borehole also use costly rig time.
There are at least two methods for managing the temperature of thermal components in a downhole tool. One method is a heat storing temperature management system. Heat storing temperature management involves removing heat from the thermal component and storing the heat in another element of the heat storing temperature management system, such as a heat sink. Another method is a heat exhausting temperature management system. Heat exhausting temperature management involves removing heat from the thermal component and transferring the heat to the environment outside the heat exhausting temperature management system. The heat may be transferred to the drill string or to the drilling fluid inside or outside the drill string.
For a more detailed description of the embodiments, reference will now be made to the following accompanying drawings:
The present disclosure relates to a thermal component temperature management system and includes embodiments of different forms. The drawings and the description below disclose specific embodiments with the understanding that the embodiments are to be considered an exemplification of the principles of the invention, and are not intended to limit the invention to that illustrated and described. Further, it is to be fully recognized that the different teachings of the embodiments discussed below may be employed separately or in any suitable combination to produce desired results. The term “couple,” “couples,” or “thermally coupled” as used herein is intended to mean either an indirect or a direct connection. Thus, if a first device couples to a second device, that connection may be through a direct connection; e.g., by conduction through one or more devices, or through an indirect connection; e.g., by convection or radiation. The term “temperature management” as used herein is intended to mean the overall management of temperature, including maintaining, increasing, or decreasing temperature and is not meant to be limited to only decreasing temperature.
Referring now to
In this embodiment, rig 110 is land-based. In other embodiments, downhole tools 135 may be positioned within a drill string suspended from a rig on a floating platform. Furthermore, downhole tools 135 need not be disposed in a drill string, but may also be suspended by wireline, coiled tubing, or other similar device.
In
To remove heat from the cold plate 201, a metal hydride container 210 is selectively thermally coupled to the cold plate 201. The metal hydride inside the metal hydride container 210 may be packed as a powder surrounded by hydrogen, a gel with hydrogen infusing the gel, or in a binder with hydrogen permeating the binder. Metal hydrides reversibly store hydrogen in their metal lattice. Metal hydrides cool while releasing hydrogen and warm while absorbing hydrogen. Metal hydrides can be engineered to operate at different temperatures and pressures by modifying alloy composition and production techniques, which adjusts the equilibrium temperature and pressure. An example of a commercially available metal hydride is H
At a pressure or temperature lower than an equilibrium pressure or temperature, the metal hydride will absorb hydrogen as heat from the temperature sensitive components 205 and transfer heat to the cold plate 201, as shown in
While thermally coupled to the heat exhaustion component 220, the metal hydride will desorb hydrogen as it cools down, thus recharging the heat exhaustion component 220's ability to absorb heat. After cooling, the metal hydride container 210 may then be again thermally coupled to the cold plate 201 to repeat the heating and cooling cycle. Hydrogen may be absorbed and desorbed by the metal hydrides over a virtually unlimited number of cycles, which allows for the downhole tool to be used for extended time periods in the wellbore.
In one embodiment, the metal hydride container 210 includes a eutectic material 215 to reduce the severity of temperature swings during the heating and cooling cycle. Eutectic material is an alloy having a component composition designed to achieve a desired melting point for the material. The desired melting point takes advantage of latent heat of fusion to absorb energy. Latent heat is the energy absorbed by the material as it changes phase from solid into liquid. Thus, when the material changes its physical state, it absorbs energy without a change in the temperature of the material. Therefore, additional heat will only change the phase of the material, not its temperature. To take advantage of the latent heat of fusion, the eutectic material may have a melting point below the desired maintenance temperature of the temperature sensitive component 205.
In
To remove heat from the temperature sensitive components 205, pressure on the metal hydrides 315 is reduced and the pump 307 circulates the working fluid. The conduit 305 may run through channels or holes 501 formed in the cold plate 201, such as shown in
During the recharge cycle, the valves 306a and 306b are closed and the pump 307 is inactive to thermally decouple the metal hydrides 315 from the cold plate 201. In the recharge cycle, the pressure piston 310 increases the pressure of the hydrogen inside the sealed container 330, which causes the metal hydrides 215 to reabsorb hydrogen and release heat. The heat may be exhausted to the wellbore through the tool body or any other thermal coupling. After exhausting heat, the circulation of the working fluid may be restarted and the pressure on the metal hydrides 315 reduced to start absorbing heat from the temperature sensitive components 205 again.
In
The TEC system 401 is thermally coupled to a hot plate 402, which is thermally coupled to the cold plate 201 through a circulation system similar to the circulation system shown in
In
Various cooling mixtures may be used. In one embodiment, water is provided in component chamber 610 and combined with one or more of the following substances as the other component contained in component chamber 611: ammonium nitrate, sodium acetate, sodium nitrate, sodium thiosulfate, hydrous calcium chloride, sodium chloride, sodium bromide, magnesium chloride, and sulfuric acid. To optimize cooling efficiency, the relative portions of water and the other component may be controlled by the pistons or augers 605, 606 according to predetermined ratios. For example, 100 parts of ammonium nitrate may be combined with 94 parts of water. In another example, 36 parts of calcium chloride may be combined with 100 parts of water. It should be appreciated that the cooling mixtures disclosed herein are intended as examples of cooling mixtures that may be used in combination with the temperature management system 600.
Power for the downhole tool and the thermal management systems disclosed herein may be supplied by a turbine alternator, which is driven by the drilling fluid pumped through the drill string. The turbine alternator may be of the axial, radial, or mixed flow type. Alternatively, the alternator may be driven by a positive displacement motor driven by the drilling fluid, such as a Moineau-type motor. It is understood that other power supplies, such as batteries or power from the surface, may also be used. In one embodiment, electrical power is provided by the drill string from an electrical source on the surface.
The temperature management system removes enough heat to maintain the temperature sensitive component at or below its rated temperature, which may be; e.g., no more than 125° C. For example, the temperature management system may maintain the temperature sensitive components 205 at or below 135° C., or even at or below 80° C. Typically, the lower the temperature, the longer the life of the temperature sensitive components 205.
Thus, the temperature management system manages the temperature of the temperature sensitive components 205. Absorbing heat from the temperature sensitive components 205 thus extends the useful life of the temperature sensitive components 205 at a given environment temperature.
While specific embodiments have been shown and described, modifications can be made by one skilled in the art without departing from the spirit or teaching of this invention. The embodiments as described are exemplary only and are not limiting. Many variations and modifications are possible and are within the scope of the invention. Accordingly, the scope of protection is not limited to the embodiments described, but is only limited by the claims that follow, the scope of which shall include all equivalents of the subject matter of the claims.
This application is a continuation of prior application Ser. No. 13/266,669, filed Nov. 17, 2011, which is a 35 U.S.C. §371 national stage application of Application No. PCT/US2010/032537, filed Apr. 27, 2010, which claims the benefit of U.S. Provisional Patent Application No. 61/172,995, filed Apr. 27, 2009, all of which are incorporated herein by reference in their entireties for all purposes.
Number | Name | Date | Kind |
---|---|---|---|
3075361 | Lindberg, Jr. | Jan 1963 | A |
3125159 | Lindberg, Jr. | Mar 1964 | A |
4199953 | Richter, Jr. | Apr 1980 | A |
4282931 | Golben | Aug 1981 | A |
4375157 | Boesen | Mar 1983 | A |
4402915 | Nishizaki | Sep 1983 | A |
4510759 | Sakai et al. | Apr 1985 | A |
5184470 | Moser et al. | Feb 1993 | A |
6128904 | Rosso et al. | Oct 2000 | A |
6134892 | Turner | Oct 2000 | A |
6672093 | DiFoggio | Jan 2004 | B2 |
6695061 | Fripp | Feb 2004 | B2 |
6736194 | Rockenfeller et al. | May 2004 | B2 |
6737180 | Johnson | May 2004 | B2 |
7124596 | DiFoggio | Oct 2006 | B2 |
7160639 | Johnson | Jan 2007 | B2 |
7213409 | Nuckols | May 2007 | B1 |
7246940 | Storm et al. | Jul 2007 | B2 |
7258169 | Fripp et al. | Aug 2007 | B2 |
7717167 | Storm et al. | May 2010 | B2 |
7806173 | Kaul et al. | Oct 2010 | B2 |
8024936 | Storm | Sep 2011 | B2 |
8699227 | Hovik | Apr 2014 | B2 |
8820397 | Marzouk | Sep 2014 | B2 |
20020064692 | Johnson | May 2002 | A1 |
20020100288 | Zuo | Aug 2002 | A1 |
20030159829 | Fripp et al. | Aug 2003 | A1 |
20040016769 | Redmond | Jan 2004 | A1 |
20060102353 | Storm et al. | May 2006 | A1 |
20080223579 | Goodwin | Sep 2008 | A1 |
Entry |
---|
International Search Report and Written Opinion issued by the Korean Intellectual Property Office regarding International application No. PCT/US2010/032537, dated Dec. 30, 2010, 7 pages. |
Number | Date | Country | |
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20140367165 A1 | Dec 2014 | US |
Number | Date | Country | |
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61172995 | Apr 2009 | US |
Number | Date | Country | |
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Parent | 13266669 | US | |
Child | 14473067 | US |