Thermal expansion valve

Information

  • Patent Grant
  • D765226
  • Patent Number
    D765,226
  • Date Filed
    Monday, April 13, 2015
    9 years ago
  • Date Issued
    Tuesday, August 30, 2016
    8 years ago
  • US Classifications
    Field of Search
    • US
    • D23 233-250
    • 137 468000
    • 137 012000
    • 137 625480
    • 236 0920B0
    • 236 0990R0
    • 062 222000
    • 062 225000
    • 062 115000
    • 062 498000
    • 062 210000
    • 062 204000
    • 062 613000
    • 062 197000
    • 062 504000
    • 062 527000
    • CPC
    • F16K11/10
    • F16K31/0613
    • F16K3/246
  • International Classifications
    • 2301
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a front view of a thermal expansion valve according to the present application;



FIG. 2 is a rear view of the thermal expansion valve according to the present application;



FIG. 3 is a left view of the thermal expansion valve according to the present application;



FIG. 4 is a right view of the thermal expansion valve according to the present application;



FIG. 5 is a top view of the thermal expansion valve according to the present application;



FIG. 6 is a bottom view of the thermal expansion valve according to the present application; and,



FIG. 7 is a perspective view of the thermal expansion valve according to the present application.


The broken lines shown in the figures represent unclaimed portions of the thermal expansion valve and form no part of the claimed design.


Claims
  • The ornamental design for a thermal expansion valve, as shown and described.
Priority Claims (1)
Number Date Country Kind
2014 3 0413767 Oct 2014 CN national
US Referenced Citations (9)
Number Name Date Kind
D429315 Okada Aug 2000 S
D434831 Okada Dec 2000 S
D440632 Fukuda Apr 2001 S
D532080 Kobayashi Nov 2006 S
D589118 Watanabe Mar 2009 S
D649222 Kobayashi Nov 2011 S
D683815 Kobayashi Jun 2013 S
D712010 Okutsu Aug 2014 S
D746410 Kaneko Dec 2015 S
Non-Patent Literature Citations (1)
Entry
U.S. Appl. No. 29/523,675, filed Apr. 13, 2015, Yin et al.