Patent Application
20180201026
The present invention relates to a thermal head and a thermal printer.
As printing devices for use in facsimiles, or video printers, etc., various types of thermal heads have been proposed to date. For example, there is known a thermal head comprising: a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate, the electrode having a connecting portion connected to the heat generating section; and a protective layer which covers the heat generating section and the connecting portion of the electrode (refer to Patent Literature 1).
In Patent Literature 1, there is shown a description as to a way to achieve efficient transmission of heat generated in the heat generating section to a recording medium with use of the highly heat-conductive protective layer for improvement in thermal efficiency in the thermal head.
Patent Literature 1: Japanese Unexamined Patent Publication JP-A 7-132628 (1995)
A thermal head according to the disclosure comprises: a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate, the electrode having a connecting portion connected to the heat generating section; and a protective layer which covers the heat generating section and the connecting portion of the electrode. Moreover, a part of the protective layer which is disposed on the connecting portion has a closed first void therein.
A thermal printer according to the disclosure comprises: the thermal head mentioned above; a conveyance mechanism which conveys a recording medium onto the heat generating section; and a platen roller which presses the recording medium against a top of the heat generating section.
Hereinafter, a thermal head X1 will be described with reference to
As shown in
The heat dissipating plate 1 has a rectangular parallelepiped shape. The heat dissipating plate 1 is formed of a metal material such for example as copper, iron or aluminum, and functions to dissipate part of the heat evolved in the heat generating section 9 of the head base body 3 which part is not conducive to printing.
The head base body 3 has a rectangular shape as seen in plan view, and, each member constituting the thermal head X1 is disposed on a substrate 7 of the head base body 3. The head base body 3 functions to perform printing on a recording medium (not shown) in response to an externally supplied electric signal.
Now, each of the constituent members of the head base body 3 will be described with reference to
The substrate 7 is placed on the heat dissipating plate 1, and has a rectangular shape as seen in plan view. Thus, the substrate 7 is defined by a first long side 7a, a second long side 7b, a first short side 7c, a second short side 7d, a side surface 7e, a first principal surface 7f, and a second principal surface 7g. The side surface 7e is located on the connector 31 side. On the first principal surface 7f, the individual constituent members of the head base body 3 are provided. The second principal surface 7g is located on the heat dissipating plate 1 side. For example, the substrate 7 is formed of an electrically insulating material such as alumina ceramics, or a semiconductor material such as single-crystal silicon.
On the first surface 7f of the substrate 7, a heat storage layer 13 is provided. The heat storage layer 13 is disposed so as to extend over the entire area of the first principal surface 7f of the substrate 7. A height of the heat storage layer 13 from the substrate 7 is set to 15 to 90 μm.
The heat storage layer 13 is formed of glass having a low thermal conductivity, and temporarily stores part of the heat evolved in the heat generating section 9. Hence, the heat storage layer 13 is capable of shortening the time required to raise the temperature of the heat generating section 9, and thus functions to improve the thermal response characteristics of the thermal head X1.
For example, the heat storage layer 13 is formed by applying a predetermined glass paste obtained by blending a suitable organic solvent in glass powder to the upper surface of the substrate 7 by heretofore known technique such as screen printing, and thereafter firing the glass paste. The heat storage layer 13 does not necessarily have to be disposed so as to extend over the entire area of the first principal surface 7f of the substrate 7. For example, it is possible to place the heat storage layer 13 only in a region below the heat generating section 9.
An electrical resistance layer 15 is located on the substrate 7, as well as on the heat storage layer 13, and also, on the electrical resistance layer 15, various types of electrodes constituting the head base body 3 are provided. The electrical resistance layer 15 is patterned in the same configuration as that of each electrode constituting the head base body 3. Thus, the electrical resistance layer 15 has exposed regions, each of which is an exposed electrical-resistance-layer 15 region lying between a common electrode 17 and a discrete electrode 19. Each exposed region left exposed from the common electrode 17 and the discrete electrode 19 constitutes the heat generating section 9, and, the individual heat generating sections 9 are arranged in array form on the heat storage layer 13. The electrical resistance layer 15 may be formed only in a region between the common electrode 17 and the discrete electrode 19.
The plurality of heat generating sections 9, while being illustrated in simplified form in
The common electrode 17 comprises: main wiring portions 17a and 17d; sub wiring portions 17b; and lead portions 17c. The common electrode 17 electrically connects the connector 31 and the plurality of heat generating sections 9. The main wiring portion 17a extends along one long side 7a of the substrate 7. The sub wiring portions 17b extend along one short side 7c and the other short side 7d, respectively, of the substrate 7. The lead portions 17c extend from the main wiring portion 17a toward the corresponding heat generating sections 9 on an individual basis. The main wiring portion 17d extends along the other long side 7b of the substrate 7.
The plurality of discrete electrodes 19 provide electrical connection between the heat generating section 9 and a driving IC 11. Moreover, the discrete electrodes 19 allow the plurality of heat generating sections 9 to fall into a plurality of groups. The discrete electrode 19 provides electrical connection between each heat generating section 9 group and corresponding one of the driving ICs 11 assigned one to each group.
There are provided a plurality of IC-connector connection electrodes 21 for providing electrical connection between the driving IC 11 and the connector 31. The plurality of IC-connector connection electrodes 21 connected to the corresponding driving ICs 11 are composed of a plurality of wiring lines having different functions.
A ground electrode 4 is located so as to be surrounded by the discrete electrode 19, the IC-connector connection electrode 21, and the main wiring portion 17d of the common electrode 17. The ground electrode 4 is maintained at a ground potential of 0 to 1 V.
A connection terminal 2 is located on the other long side 7b side of the substrate 7 to connect the common electrode 17, the discrete electrode 19, the IC-connector connection electrode and the ground electrode 4 to the connector 31. The connection terminal 2 is disposed corresponding to a connector pin 8, and the connector pin 8 and the connection terminal 2 are connected to each other so that each becomes electrically independent at the time of establishing connection with the connector 31.
A plurality of IC-IC connection electrodes 26 electrically connects adjacent driving ICs 11. The plurality of IC-IC connection electrodes 26 are each disposed corresponding to the IC-connector connection electrode 21. IC-IC connection electrode 26 transmits various signals to the adjacent driving ICs 11.
For example, various electrodes constituting the head base body 3 described above are formed by laminating layers of materials for constituting the different electrodes one after another on the heat storage layer 13 by thin-film forming technique such as sputtering, and thereafter working the resultant laminate body into predetermined patterns by heretofore known technique such as photoetching. The various electrodes constituting the head base body 3 may be formed at the same time through common procedural steps.
As shown in
The driving IC 11, while being connected to the discrete electrode 19, the IC-IC connection electrode 26, and the IC-connector connection electrode 21, is sealed with a hard coating 29 formed of resin such as epoxy resin or silicone resin.
The protective layer 25 is disposed on the one long side 7a side of the substrate 7 to cover the heat generating section 9, part of the common electrode 17, and part of the discrete electrode 19.
The protective layer 25 serves to protect the heat generating section 9 and the covered areas of the common electrode 17 and the discrete electrode 19 against corrosion caused by adhesion of atmospheric water content, etc., or against wear caused by contact with a recording medium under printing. Moreover, it is preferable that the protective layer 25 has high thermal conductivity in the interest of efficient transmission of heat to a recording medium P (refer to
For example, the protective layer 25 may be formed of SiN, SiO2, SiON, SiC, or diamond-like carbon, etc. The protective layer 25 may be composed either of a single layer or of a stack of layers of these materials. Such a protective layer 25 may be produced by thin-film forming technique such as sputtering or ion plating, or thick-film forming technique such as screen printing.
On the substrate 7, there is provided a cover layer 27 which partly covers the common electrode 17, the discrete electrode 19, and the IC-connector connection electrode 21. The cover layer 27 serves to protect the covered areas of the common electrode 17, the discrete electrode 19, the IC-IC connection electrode 26, and the IC-connector connection electrode 21 against oxidation caused by exposure to air, or corrosion caused by adhesion of atmospheric water content, etc. The cover layer may be formed of a resin material such as epoxy resin, polyimide resin, or silicone resin.
The connector 31 and the head base body 3 are secured to each other via the connector pin 8, a conductive member 23, and the sealing member 12. The conductive member 23 is disposed between the connection terminal 2 and the connector pin 8, and, exemplary of the conductive member 23 is solder or an anisotropic conductive adhesive. A Ni-, Au-, or Pd-plating layer (not shown in the drawings) may be interposed between the conductive member 23 and the connection terminal 2. The conductive member 23 does not necessarily have to be provided. That is, the connector pin 8 may be connected directly to the connection terminal 2.
The connector 31 comprises the plurality of connector pins 8 and a housing 10 which receives the plurality of connector pins 8. Each of the plurality of connector pins 8 has one side exposed from the housing 10, and another side received within the housing 10. The plurality of connector pins 8 are electrically connected to the connection terminal 2 of the head base body 3
The sealing member 12 comprises a first sealing member 12a and a second sealing member 12b. The first sealing member 12a is located on the first principal surface 7f of the substrate 7. The first sealing member 12a is disposed so as to seal the connector pin 8 and the various electrodes. The second sealing member 12b is located on the second principal surface 7g of the substrate 7. The second sealing member 12b is disposed so as to seal an area where the connector pin 8 and the substrate 7 make contact with each other.
The sealing member 12 is provided so as not to expose the connection terminal 2 and the connector pin 8 to the outside, and may be formed of a thermosetting epoxy resin, an ultraviolet-curable resin, or a visible light-curable resin, for example. The first sealing member 12a and the second sealing member 12b may be formed either of the same material or of different materials.
The bonding member 14 is placed on the heat dissipating plate 1 to bond the second principal surface 7g of the head base body 3 with the heat dissipating plate 1. Exemplary of the bonding member 14 is a double-faced tape or a resin-based adhesive.
Referring to
The discrete electrode 19 comprises a connecting portion 19a and a wiring portion 19b. The connecting portion 19a is connected to the heat generating section 9, and is shaped so that a thickness thereof becomes smaller gradually with approach toward the heat generating section 9. The wiring portion 19b is electrically connected to the heat generating section 9 through the connecting portion 19a. The connecting portion 19a does not necessarily have to be inclined rectilinearly at a certain angle of inclination as shown in
Since the connecting portion 19a is shaped so that a thickness thereof becomes smaller gradually with approach toward the heat generating section 9, part of the heat generated in the heat generating section 9 is less likely to be transmitted to the connecting portion 19a. Hence, the heat produced in the heat generating section 9 is less likely to be dissipated from the discrete electrode 19. This can improve thermal efficiency in the thermal head X1.
The protective layer 25 is disposed so as to cover a part of the common electrode 17 which is close to the heat generating section 9, a part of the discrete electrode 19 which is close to the heat generating section 9, and the heat generating section 9. The protective layer 25 has a first region 25a, a second region 25b, and a third region 25c. The first region 25a is a region located on the heat generating section 9. The second region 25b is a region located on the connecting portion 19a. The third region 25c is a region located on the wiring portion 19b.
The protective layer 25 has a first void 16 therein. More specifically, the first void 16 lies in the first region 25a and in the second region 25b as well. That is, part of the first void 16 is located within the first region 25a, and the remaining part of the first void 16 is located within the second region 25b. The first void 16 is surrounded by the protective layer 25 corresponding to the first region 25a and the second region 25b. Thus, the first void 16 is not in communication with the outside.
The first void 16 is disposed so as to extend obliquely upwardly from a corner of the connecting portion 19a, as seen in sectional view. For example, the first void 16 may have a width W of 0.1 to 1 μm, and a length L in a thickness direction of the substrate 7 of 1 to 15 μm in length L. The first void 16 extends in planar form from the plane of section toward the back. Note that the first void 16 does not necessarily have to extend in planar form, and may be disposed so as to extend linearly at the plane of section.
The first void 16 is spaced away from the surface of the protective layer 25, and is thus confined within the protective layer 25 in a closed state without communication with the outside. Hence, the first void 16 is lower in thermal conductivity than the second region 25b, and thus serves as a heat-insulating portion within the second region 25b.
The first void 16 contains a gas therein. Exemplary of the gas are air, nitrogen gas, and argon gas.
The thermal head X1 performs printing operation by transmitting heat generated in the heat generating section 9 under Joule heating effect to a recording medium. The heat generated in the heat generating section 9 is transmitted upwardly through the first region 25a of the protective layer 25, and also, part of the heat is transmitted in a sub-scanning direction through the second region 25b and the third region 25c. The heat in a condition of being transmitted in the sub-scanning direction is dissipated from the discrete electrode 19, which results in deterioration in thermal efficiency in the thermal head X1.
In this regard, the thermal head X1 has the first void 16 existing in a closed state within the second region 25b of the protective layer 25. Hence, the first void 16 serves as a heat-insulating portion, wherefore the protective layer 25 is provided at the second region 25b thereof with the heat-insulating portion.
In consequence, even if part of the heat generated in the heat generating section 9 is about to be transmitted toward the second region 25b as indicated by the arrow shown in
The insulation of part of the heat generated in the heat generating section 9 by the first void 16 facilitates retention of the heat generated in the heat generating section 9 within the first region 25a. In consequence, the heat generated in the heat generating section 9 can be transmitted efficiently to a recording medium, thus increasing the thermal efficiency of the thermal head X1.
Since the first void 16 is present in a closed state within the protective layer 25, external moisture, etc. is less likely to enter the first void 16, wherefore the heat-insulating capability of the first void 16 can be maintained. Moreover, since the possibility of intrusion of external moisture, etc. into the first void 16 can be reduced, it is possible to ensure the sealability of the protective layer 25, and thereby corrosion is less likely to occur in the common electrode 17 and the discrete electrode 19.
With the placement of the first void 16 in the second region 25b, even if the second region 25b is subjected to a thermal stress resulting from the heat generated in the heat generating section 9, the thermal stress can be relaxed by the first void 16.
Moreover, since a gas such as air is present in the first void 16, the thermal conductivity of the first void 16 can be further reduced, and part of the heat generated in the heat generating section 9 is less likely to be transmitted to the second region 25b.
Moreover, the first void 16 is disposed so as to extend in the thickness direction of the substrate 7. In other words, the first void 16 extends obliquely upwardly toward the surface of the protective layer 25 located on the substrate 7. This permits efficient insulation of part of the heat generated in the heat generating section 9. That is, with the second region 25b disposed adjacent the first region 25a, part of the heat generated in the heat generating section 9 is transmitted in the sub-scanning direction. In this regard, the first void 16 extends in the thickness direction of the substrate 7 so as to be intersected by the sub-scanning direction, wherefore part of the heat generated in the heat generating section 9 can be insulated efficiently.
For example, the protective layer 25 may be formed by the following procedure.
On the substrate 7 patterned with the various electrodes, the protective layer 25 is formed by sputtering technique. To begin with, a film of the protective layer 25 is formed by non-bias sputtering technique at a faster-than-normal film-forming rate. At this time, owing to the difference in level between the connecting portion 19a of the discrete electrode 19 and the electrical resistance layer 15, and also to the film-forming rate, the first void 16 is created near the boundary between the first region 25a and the second region 25b.
Next, a film of the protective layer 25 is formed by bias sputtering technique at a normal film-forming rate so as to be laminated onto the protective layer 25 film formed by the non-bias sputtering technique. In the case of forming the protective layer 25 by the bias sputtering technique, a dense protective layer 25 can be formed on the first void 16. This makes it possible to form the closed first void 16 in the protective layer.
Next, a thermal printer Z1 will be described with reference to
The thermal printer Z1 according to the embodiment comprises: the thermal head X1 described above; a conveyance mechanism 40; a platen roller 50; a power supply device 60; and a control unit 70. The thermal head X1 is attached to a mounting face 80a of a mounting member 80 disposed in a housing (not shown) for the thermal printer Z1. The thermal head X1 is mounted on the mounting member 80 so as to be oriented along the main scanning direction which is perpendicular to a conveying direction S of the recording medium P which will hereafter be described.
The conveyance mechanism 40 comprises a driving section (not shown) and conveying rollers 43, 45, 47 and 49. The conveyance mechanism 40 serves to convey the recording medium P such as thermal paper or ink-transferable image-receiving paper, in a direction indicated by the arrow S shown in
The platen roller 50 functions to press the recording medium P against the top of the protective layer 25 located on the heat generating section 9 of the thermal head X1. The platen roller 50 is disposed so as to extend along a direction perpendicular to the conveying direction S of the recording medium P, and is fixedly supported at ends thereof so as to be rotatable while pressing the recording medium P against the top of the heat generating section 9. For example, the platen roller 50 may be composed of a cylindrical shaft body 50a formed of metal such as stainless steel covered with an elastic member 50b formed of butadiene rubber, for example.
The power-supply device 60 functions to supply electric current for enabling the heat generating section 9 of the thermal head X1 to generate heat as described above, as well as electric current for operating the driving IC 11. The control unit 70 functions to feed a control signal for controlling the operation of the driving IC 11 to the driving IC 11 in order to cause the heat generating sections 9 of the thermal head X1 to selectively generate heat as described above.
The thermal printer Z1 performs predetermined printing on the recording medium P by, while pressing the recording medium P against the top of the heat generating section 9 of the thermal head X1 by the platen roller 50, conveying the recording medium P onto the heat generating section 9 by the conveyance mechanism 40, and also operating the power-supply device 60 and the control unit 70 so as to enable the heat generating sections 9 to selectively generate heat. When using image-receiving paper or the like as the recording medium P, printing on the recording medium P is performed by thermally transferring the ink of the ink film (not shown), which is conveyed together with the recording medium P, onto the recording medium P.
A thermal head X2 will be described with reference to
A protective layer 125 has a first region 125a, a second region 125b, and a third region 125c.
Two or more first voids 116 are spaced apart from each other. More specifically, the two or more first voids 116 are spaced apart from each other in the thickness direction of the substrate 7. The first voids 116 lie only within the second region 125b. The first void 116 is surrounded by the second region 125b of the protective layer 125, and thus, the two or more first voids 116 are each present in a closed state within the protective layer 125. That is, the first void 116 is spaced away from the connecting portion 19a, and also away from the surface of the protective layer 125.
Since the two or more first voids 116 are spaced apart from each other, it is possible to relax a compressive stress exerted upon the protective layer 125 by the pressing action of the platen roller 50 (refer to
Moreover, the first void 116 is elongated in the sub-scanning direction. This makes it possible to shorten the length of the first void 116 in the thickness direction of the substrate 7 without a reduction in cross-sectional area, and thereby the large first void 116 is less likely to occur in the thickness direction of the substrate 7. In consequence, damage is less likely to occur in the protective layer 125.
Moreover, cross-sectional areas of the first voids 116 increase with decreasing distance from the heat generating section 9. This makes it possible to achieve efficient insulation of part of the heat generated in the heat generating section 9, as well as to allow the first voids 116 to effect relaxation of a compressive stress exerted upon the protective layer 125.
Moreover, the first void 116 is present in the second region 125b alone, but is not present in the first region 125a. This makes it possible to suppress that the heat generated in the heat generating section 9 is less likely to be transmitted to the recording medium P (refer to
In forming the protective layer 125, for example, a film of the protective layer 125 is formed by screen printing technique, and, after the formation of the film of the protective layer 125, a volatile binder is applied, in a predetermined area, to a region where the first void 116 is to be formed. After that, another film of the protective layer 125 is further formed by the screen printing technique. Following the repetition of these process steps, firing operation is performed for completion of the protective layer 125.
A thermal head X3 will be described with reference to
The discrete electrode 19 comprises a connecting portion 19a and a wiring portion 19b. A protective layer 225 has a first region 225a, a second region 225b, and a third region 225c.
Two or more first voids 216 are spaced apart from each other in the thickness direction of the substrate 7. The first voids 216 are each formed so as to perpendicularly extend with respect to the slanted surface of the connecting portion 19a. As employed herein “perpendicularly extend with respect to the surface of the connecting portion 19a” means “arranged inclined at an angle of 75° to 105° to the surface of the connecting portion 19a”.
In the thermal head X3, the first void 216 is formed so as to perpendicularly extend with respect to the surface of the connecting portion 19a. Thus, the first void 216 is configured to extend substantially perpendicular to the direction of transmission of heat generated in the heat generating section 9.
In consequence, the heat-insulating capability of the first void 216 can be enhanced, and the possibility of transmission of part of the heat produced in the heat generating section 9 to the second region 225b can be reduced. Therefore, part of the heat generated in the heat generating section 9 is less likely to be dissipated from the discrete electrode 19.
Cross-sectional areas of the first voids 216 may increase with decreasing distance from the heat generating section 9. Also in this case, part of the heat generated in the heat generating section 9 can be insulated efficiently, and, a compressive stress exerted upon the protective layer 225 can be relaxed by the first void 216.
Moreover, Since the first void 216 is shaped so that a longitudinal side thereof extends in the sub-scanning direction, it is possible to disperse, in the sub-scanning direction, a compressive stress developed by the pressing action of the platen roller 50 (refer to
For example, the protective layer 225 may be formed by the following procedure.
On the substrate 7 patterned with the various electrodes, the protective layer 225 is formed by sputtering technique. To begin with, the protective layer 25 is formed by non-bias sputtering technique. At this time, due to the stepped configuration defined by the connecting portion 19a of the discrete electrode 19, the first void 216 is created near the boundary between the first region 225a and the second region 225b.
Next, with use of a polishing apparatus, lapping operation is performed on a region wider than the stepped part created near the heat generating section 9. The region subjected to the lapping operation is substantially equal in area to the first void 216-bearing region, as seen in plan view. Subsequently, the protective layer 225 is formed using the non-bias sputtering technique, followed by lapping operation.
Lastly, the protective layer 225 is formed by bias sputtering technique. In the case of forming the protective layer 225 by the bias sputtering technique, a dense protective layer 225 can be formed on the first void 216. This makes it possible to form the first void 216 which is not in communication with the outside.
A thermal head X4 will be described with reference to
The cover layer 327 is located on a first region 325a, a second region 325b, and a third region 325c of a protective layer 325. The cover layer 327 may be formed of a resin material such as epoxy resin, polyimide resin, or silicone resin, and, a thickness thereof is preferably adjusted to 0.01 μm to 1 μm. The cover layer 327 does not necessarily have to be located on the first region 325a.
The first void 316 comprises a closed pore portion 316a and a seal portion 316b. The closed pore portion 316a is provided in the second region 325b, and constitutes the closed first void 316 in the protective layer 325. Hence, the first void 316 is configured to be lower in thermal conductivity than the second region 325b, and thus serves as a heat-insulating portion within the second region 325b.
The seal portion 316b is disposed in the second region 325b of the protective layer 325, and is constituted by the cover layer 327. The seal portion 316b is made continuous with the closed pore portion 316a so as to seal the closed pore portion 316a.
In the thermal head X4, the cover layer 327 is disposed so as to cover the protective layer 325, and part of the cover layer 327 located above the first void 316, and, air is contained in a lower part of the first void 316. Hence, the closed pore portion 316a can be formed simply by applying the cover layer 327 after the formation of the protective layer 325.
A thermal head X5 will be described with reference to
The protective layer 425 comprises a first protective layer 430 and a second protective layer 432. The first protective layer 430 is disposed so as to cover the common electrode 17 close to the heat generating section 9 (refer to
The second protective layer 432 is located on the first protective layer 430. The second protective layer 432 has a first region 432a, a second region 432b, and a third region 432c. The first region 432a is a region located above the heat generating section 9. The second region 432b is a region located above the connecting portion 19a. The third region 432c is a region located above the wiring portion 19b.
The first protective layer 430 has a closed first void 416a which is located above the connecting portion 19a and is provided therein. The first void 416a is provided only within the second region 430b, and is formed so as to perpendicularly extend with respect to the surface of the connecting portion 19a. Around the first void 416a, the second region 430b of the first protective layer 430 is provided, and the first void 416a is not exposed to the outside.
The second protective layer 432 has a closed second void 416b which is located above the connecting portion 19a and is provided therein. The second void 416b is provided only within the second region 432b, and is formed so as to perpendicularly extend with respect to the surface of the connecting portion 19a. Around the second void 416b, the second region 432b of the second protective layer 432 is provided, and the second void 416b is not exposed to the outside.
In the presence of the first void 416a and the second void 416b, the heat generated in the heat generating section 9 can be less likely to be dissipated, through the protective layer 425, toward the discrete electrode 19.
Since none of the first void 416a is in communication with the second void 416b, moisture, etc. is less likely to intrude into the first void 416a from the outside of the protective layer 425, and therefore the heat-insulating capabilities of the first void 416a and the second void 416b can be maintained. Moreover, moisture, etc. is less likely to intrude into the first void 416a and the second void 416b from the outside, and therefore the sealability of the protective layer 425 can be ensured, and thus corrosion is less likely to occur in the common electrode 17 and the discrete electrode 19.
That is, even if the second void 416b is brought into communication with the outside as the protective layer 425 wears down, the first void 416a can be maintained in an internally closed state without communication with the outside. Thus, in virtue of the first void 416a, the heat generated in the heat generating section 9 can less likely to be dissipated, through the protective layer 425, toward the discrete electrode 19.
Moreover, the second void 416b is located above the first void 416a, as seen in sectional view. Thus, the first void 416a and the second void 416b are located above the connecting portion 19a. This allows the second region 430b of the first protective layer 430 and the second region 432b of the second protective layer 432 to effect heat insulation, and thus a structure in which the heat generated in the heat generating section 9 is less likely to be dissipated can be achieved.
Moreover, the first void 416a is larger in cross-sectional area than the second void 416b, as seen in sectional view. Thus, the first void 416a having a larger cross-sectional area permits effective reduction in dissipation of the heat generated in the heat generating section 9, and also, a pressing force exerted by the platen roller 50 (refer to
That is, the first void 416a close to the heat generating section 9 can achieve effective heat insulation, and the second void 416b close to the platen roller 50 can achieve effective stress dispersion. In consequence, the thermal head X5 exhibits improved thermal responsiveness and resistance to damage.
A thermal head X6 will be described with reference to
The first protective layer 430 has a closed first void 516a which is located above the connecting portion 19a and is provided therein. The first void 516a is provided only within the second region 430b, and is formed so as to perpendicularly extend with respect to the surface of the connecting portion 19a. Around the first void 516a, the second region 430b of the first protective layer 430 is provided, and the first void 516a is not exposed to the outside.
The second protective layer 432 has a closed second void 516b which is located above the wiring portion 19b and is provided therein. The second void 516b is provided only within the third region 432c, and is formed so as to perpendicularly extend with respect to the surface of the connecting portion 19a. Around the second void 516b, the third region 432c of the second protective layer 432 is provided, and the second void 516b is not exposed to the outside.
With this arrangement, the second void 516b is deviated from above the first void 516a on the driving IC 11 side, as seen in sectional view. In consequence, the thermal head X6 is less likely to damaged by the pressing force exerted by the platen roller 50 (refer to
That is, if the second void 516b is positioned above the first void 516a, the strengths of the second regions 430b and 432b bearing the first void 516a and the second void 516b may be decreased. However, by placing the second void 516b so as to be deviated from the first void 516a, the strength of the protective layer 425 can be maintained at a high level. In consequence, the thermal head X6 becoming resistant to damage can be achieved.
While one embodiment of the invention has been described heretofore, it should be understood that the invention is not limited to the above-described embodiments, and that many modifications and variations may be possible without departing from the scope of the invention. For example, although the thermal printer Z1 employing the thermal head X1 according to the first embodiment has been shown herein, the invention is not limited to this, and thus, the thermal heads X2 to X6 may be adopted for use in the thermal printer Z1. Moreover, the thermal heads X1 to X6 according to a plurality of embodiments may be used in combination.
For example, although the thin-film head having the thin heat generating section 9 obtained by forming the electrical resistance layer 15 in thin-film form has been described as exemplification, the invention is not limited to this. The invention may be embodied as a thick-film head having a thick heat generating section 9 by forming the electrical resistance layer 15 in thick-film form.
Moreover, although a flat-type head in which the heat generating section 9 is formed on the first principal surface 7f of the substrate 7 has been described as exemplification, the invention may be embodied as an edge-type head in which the heat generating section 9 is disposed on an end face of the substrate 7.
Moreover, the heat storage layer 13 may be provided with an underlayer portion 13 which is located in other region than a region where the protuberance 13a is formed. The heat generating section 9 may be configured by forming the common electrode 17 and the discrete electrode 19 on the heat storage layer 13, and thereafter forming the electrical resistance layer 15 only in a region between the common electrode 17 and the discrete electrode 19.
The sealing member 12 and the hard coating 29 which covers the driving IC 11 may be formed of the same material. In this case, the hard coating 29 and the sealing member 12 may be concurrently formed by performing printing on a region where the sealing member 12 is to be formed when the hard coating 29 is printed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2015-150914 | Jul 2015 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2016/071884 | 7/26/2016 | WO | 00 |
