Patent Application
20190394898
The present invention relates generally to thermal interface materials.
Power electronic devices employ high power switches or power electronic modules which are able to switch high currents and withstand high voltages. The switched high currents generate heat losses inside the component or module, and these losses are led to a base plate of the component or module. A cooling device is further thermally connected to the base plate for transferring the heat from the component to the surroundings. A typical example of a cooling device is a heatsink which has a surface that can be thermally connected to the surface of the base plate. Some modules are manufacture without a base plate, but they still have a surface from which the heat is removed. The heat from the component is transferred to the heatsink which further transfers the generated heat to a cooling medium such as air or liquid to keep the temperature of the power electronic module in allowable values.
To test a performance of a cooling device, such as a heatsink, in connection with a power electronic module, information about module's chip temperature Tj is required. The chip temperature refers to temperature of the semiconductor junction of the power electronic switch. It is challenging to measure the chip temperature directly and in practice it is estimated using a temperature reading from the module's baseplate directly under the chip of interest. This temperature is generally referred to as case temperature Tc. When the case temperature and the heat loss values are known, the chip temperature can be calculated using junction-to-case thermal resistance which is given by the component manufacturer. As a power electronic module has multiple of switch components, it is often required that the case temperature is measured in multiple of positions to obtain the temperature values of desired chips.
The existing methods for the measurement of the case temperature are laborious and expensive to arrange. In practice the known methods are suitable for maximum of only few (one to four) points' temperature monitoring although there may be over ten topical chips to monitor in a power electronic module. Therefore the existing methods are not feasible to apply into each manufactured product.
It is known to drill holes to the heatsink and to the base plate for placing a thermocouple in contact with the base plate. This approach may, however, damage the power electronic module. Further, the electrical wires may affect the module's electrical operation. This method is also not suitable with power electronic modules that do not have a base plate.
Another approach to measure case temperature is to use spring loaded thermocouples. These thermocouples are easy to use with air cooled heatsinks where through-holes are easy to drill to the heatsink. However their application becomes difficult with liquid and two-phase coolers where the coolant channel is often designed to run below the hottest chips i.e. where the sensor should be placed. The placement of the sensor is challenging into water cooled cold plates, base-to-air Cothex heat exchangers and heat pipe heatsinks. In such cooling devices some compromises need to be made over the sensor location in regard to the chip temperature of interest. The spring-loaded thermocouples provide accurate readings if the thermocouple is in direct contact with the base plate of the module. Thus when a thermal interface material is used between the heat generating component and the heatsink, the material should be paste or grease. If solid thermal interface materials are employed, the material should be removed from the places where measurement is made. Otherwise the thermal interface material affects the measurement.
Another issue with power electronic modules baseplate is the warping and bending of the baseplate during installation and use of the power electronic module. Especially if the use of the module or the device in which the module is situated is cyclic, the base plate may get out of its original shape. When the base plate is warped or bent, the transfer of heat from the module to the heatsink can be reduced such that the chip temperatures may rise to values which are not tolerable. The base plate's deviation from flatness may exceed 0.1 mm over the length of 50 mm during the use of the power electronic module. The deformation is mainly due to power cycling, temperature gradients and differences between thermal expansion coefficients. This dynamic behaviour causes complex deformation scenario to the thermal interface between the power electronic module and the heatsink. This deformation further may stress the thermal interface material between the power electronic module and the heatsink and may destroy the thermal interface material's capability to carry out the heat conduction function. In addition to the dynamic changes of the shape of the base plate, power electronic modules may also experience permanent deformation during operation. However, the bending and deformation of the base plate cannot be determined during use of the power electronic module.
The above described problems relating to monitoring of temperature and deformation of the base plate may lead in destruction of the power electronic module as the chip temperatures may rise to levels which are not tolerable.
An object of the present invention is thus to provide a structure and a method of manufacturing the structure so as to overcome the above problems. The objects of the invention are achieved by a thermal interface material sheet and a method of manufacturing such sheet which are characterized by what is stated in the independent claims. The preferred embodiments of the invention are disclosed in the dependent claims.
The invention is based on the idea of providing thin film sensors in the structure of thermal interface material sheet. Thermal interface materials are placed between the heat generating component and the cooling device to enhance the transfer of heat from the component to the cooling device. Once a sensor is disposed in the thermal interface material sheet and the thermal interface material is between the heat generating component and the cooling device, it can be used to measure accurately a property, such as temperature or pressure, of the assembly.
The thin film sensor is preferably a physical vapour deposition (PVD) grown thin film sensor and the thermal interface material (TIM) sheet is preferably a carbon based sheet. The TIM sheet is partially coated with an electrically insulating layer to facilitate sensor manufacturing using PVD method.
The thin film sensor is preferably a resistor based temperature sensor, piezo resistive strain gauge to measure pressure or a piezo resistive sensor for sensing both the temperature and pressure.
The TIM-sheet of the present disclosure operates as a thermal interface material sheet for electronic components, such as power electronic modules, and at the same time is able to produce measurement data from the interconnection between the electronic component and the cooling element without affecting the transfer of heat.
In the following the invention will be described in greater detail by means of preferred embodiments with reference to the accompanying drawings, in which
The electrical conductors needed for the sensor are also manufactured on the insulating layer with the same technology as the sensor. The sensor is an electrical component and the electrical properties of the component are changed due to change of temperature or pressure depending on the type of sensor. When the sensor is connected as a part of an electrical circuit using the electrical conductors, the information obtained with the sensors is readily available in other circuits. For example, the temperature and pressure information can be used in real time when the device employing the structure of the invention is used. Based on the temperature and the pressure information the condition of the cooling of the device may be monitored. If the measurements show that a measured temperature is rising above a set limit, an alarm may be given and the device may be turned off in a controlled manner. Similarly the strain sensor in the thermal interface material layer may be used for providing indication of changed conditions. If the pressure between the cooling device and the base of the power electronic module decreases, it is an indication of a change that will affect the cooling properties.
In the shown embodiments only one sensor is disposed on one layer. However, multiple of sensors can be manufactured on the same electrically insulating layer. The sensors may be of the same or different type. This, for example, enables to measure temperature in different locations under the base of the power electronic module. Further, multiple of sensors in one layer enables to simplify the construction as the number of different layers is minimized.
The thermal interface material layer of the invention acts as a normal thermal interface and can be used in connection with any type of cooling device. The cooling device does not need any modifications for measurement of temperature or pressure. The thermal interface material layer is preferably made of 70 to 200 μm thick carbon layer and the insulating layer on top of the carbon layer is, for example 10 μm thick PET film or PVD ceramics layer.
The PVD manufacturing method is known as such, and the manufacturing of the sensors using PVD method is not specifically described here. In the above the PVD method is used as an example of a suitable method for producing thin film sensors. Included in the PVD technologies, the low temperature PVD technology is the most suitable for growing thin film sensors and conductors on an electrically insulating polyimide films. Other suitable method or technologies include chemical vapour deposition (CVD) and ink-jet technology.
In the above the thermal interface material is described to be carbon based material, such as graphite. Although graphite may be a preferred material, the material can also be a thin metal sheet, multilayer thermally conducting silicone rubber or aluminium sheet structure. Generally the requirement for the thermal interface material is that it is solid enough to support the thin film structure disposed in the thermal interface material sheet of the invention.
In the drawings the structure of the invention is shown as separate layers. However, it is clear that a single sheet is formed of the separate layers. Further the sensors are illustrated as separate layers in the attached drawings. The sensors are however grown of the insulating layer and are therefore one single structure.
The invention relates also to an electrical device, such as an inverter or a frequency converter, which comprises one or more power electronic modules. The electronic device of the invention comprises a cooling device, such as a heat sink thermally connected to a power electronic module. A thermal interface material sheet of the invention is disposed between the cooling device and the power electronic module. Further, the electrical connectors of the thermal interface material layer are electrically connected to the electrical circuitry of the electronic device for obtaining information relating to the operation of the cooling device.
It will be obvious to a person skilled in the art that, as the technology advances, the inventive concept can be implemented in various ways. The invention and its embodiments are not limited to the examples described above but may vary within the scope of the claims.
