There are several factors or functions when designing thermal sinks. One function is to spread the heat to the environment. Another function is important in case hot spots exist. In such a situation, the concern is how to very quickly transfer the heat from the hot spot and diffuse it to the heat sink. Most high-power, high-speed electronic devices and systems require the high thermal diffusivity materials to modulate temperature and eliminate the “hot spots.” The physical term that represents this property is referred to as thermal diffusivity, which is the ratio of thermal conductivity to volumetric heat capacity. Materials with high thermal diffusivity conduct heat quickly in comparison to their volumetric heat capacity (thermal bulk), meaning that the temperature wave moves quickly from the hot spot to the surroundings. In addition, from a practical standpoint, heat sink materials need to be light weight, easily and simply manufactured, and be inexpensive.
In summary, for material selection, the following criteria are considered:
(1) High Thermal Conductivity and High Thermal Diffusivity. A high thermal diffusivity will allow rapid diffusion of heat from the point of creation to a dissipative heat sink.
(2) Low Mass Density. Light weight is very important for electronic device heat sink applications. If the material is too heavy, it is hard to be used.
(3) Low cost.
(4) Feasibility for Mechanical Processing.
For practical applications, the heat sink material is machined and packaged into a specific size and shape. Ease of processing is desirable.
The elements on the periodic table that satisfy the above criteria are very limited. Table 1 lists several candidates with their feasibility remarked.
In addition to the above criteria, a material's CTE (coefficient of thermal expansion) also may be considered. Usually, pure metals have high CTE values, and as a result they may cause high thermal stresses. Comparably, the composite materials are more preferable. As seen in Table 1, graphite aluminum composites are considered to possess advantages over the other materials.
The following describes manufacturing of composite materials according to embodiments of the present invention. In general, it is known that carbon materials and aluminum have poor wettability and affinity to one another; it is difficult to densely integrate them together. In other words, the C/Al (carbon aluminum) composite materials formed in typical ways, such as a conventional casting approach, include a large number of voids and slits, which result in a loss of contact between the carbon and aluminum materials, and poor mechanical/thermal properties.
Generally, previous manufacturing methods utilized impregnation of molten aluminum under very high pressure in a porous carbonaceous matrix. Such a process required very high pressure (approximately 100 MPa), a first step to melt the aluminum and then a second step to transport it in a liquid form to the impregnation site; in many cases, because the impregnation was not complete, the pre-manufacturing of the carbonaceous matrix took a very long time and was energy consuming. Another important issue is that after the C/Al composite is manufactured, the surface of this composite is electrically conductive due to the nature of the materials involved. Furthermore, the surface may be brittle and have pits. In many applications, the surfaces of these composites may require a very flat and smooth area, and particularly in some instances may require electrically insulating properties.
In embodiments of the present invention, pressure casting methods are utilized to overcome the foregoing problems. Furthermore, in the embodiments described herein, graphitic needle cokes are utilized, though other graphitic particles may be substituted, including, but not limited to, carbon nanotubes.
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In another embodiment of the present invention, the aforementioned manufacturing process of
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In order to obtain an electrically insulative surface for the C/Al composite as described above, there are a number of approaches, but one needs to consider the insulative properties and also the influence of this layer on the thermal properties of the final material. In some cases, a simple coating with electrically insulative properties may be sufficient, such as liquid Si, siloxanes, polyimides, SiO2, Si3N4, B3N4, SiONx, etc.; some applications may call for ceramic materials or any other combinations thereof In these cases, the thermal contact requirement between the C/Al composite and the extra layer is to be considered. Furthermore, it may be important that the thermal conductivity properties are good and compatible with the C/Al composite and its ultimate application.
Embodiments of the present invention may insert a ceramic layer in contact with the top and/or bottom surfaces of the C/Al mixed material before casting and thermal treatment as described in the foregoing embodiments. In such a way, a suitable thermal and mechanical contact is achieved, securing excellent and tailored insulative properties of the surface of the final C/Al-ceramic composite.
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The present application claims priority to U.S. Provisional Patent Application Ser. No. 61/347,627, which is hereby incorporated by reference herein.
Number | Date | Country | |
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61347627 | May 2010 | US |