This application relates to thermal management of an electromagnetic device, such as a transformer, and in particular to an electromagnetic device and a core assembly suitable for an electromagnetic device.
Electromagnetic devices such as transformers, including high power high frequency (HPHF) transformers, inherently experience losses which result in heat production in the transformer core and windings. Advancements in the field have helped to reduce these losses. For example, Murata's pdqb winding technology (UK patent application GB2574481, the entire contents of which are incorporated herein by reference) makes it possible to achieve the theoretically minimum level of high frequency conductor losses in HPHF transformers. However, as the demand for power levels increase, the need for very high power levels in a compact structure is desired. Such high power levels result in very high loss densities in compact HPHF transformers.
Build-up of heat in the core and windings of a transformer can cause degradation of the magnetic properties of the core, degradation of the insulation properties of the winding insulator, and a reduction in the lifetime of the transformer. In extreme cases, severe damage through melting of components and electrical breakdown can result in catastrophic failure of the device.
Typically, the core and the dimensions of transformers have been increased in size as per the results of thermal models to maintain temperature rises at reasonable levels. Effective removal of heat from such transformers is therefore desired to allow operation with a lower temperature rise for a given size, to allow further miniaturization of transformers such as HPHF transformers.
It is desirable to provide an improved thermal management system for an electromagnetic device such as a transformer, to prevent internal temperature rises, and to aid further miniaturization of transformers such as HPHF transformers.
According to a first preferred embodiment of the present invention, an electromagnetic device is provided. The electromagnetic device includes one or more sets of windings and a core assembly. The core assembly includes one or more core layers, wherein each core layer includes two closed cores, and each closed core is constructed either from two U-shaped cores or from a U-shaped core and an I-shaped core. The core assembly further includes a thermally conductive plate that is disposed between the closed cores along the axial direction of the one or more sets of windings, so as to bisect the one or more core layers. Each set of windings passes through each of the closed cores, and the thermally conductive plate is in thermal contact with the closed cores to transfer heat away from the interior of the core assembly.
The preferred embodiments of the present invention facilitate efficient removal of heat from the center and interior of the core assembly of the electromagnetic device, as well as reduction of the hot spot temperature of the core. Furthermore, the preferred embodiments of the present invention result in a reduction in the amount of heat transferred to the windings from the heat generated by the core, therefore reducing an increase in the winding temperature. The improved thermal management allows a reduction in size of the electromagnetic device and components as effective removal of heat allows operation with a lower temperature rise for a given size. Therefore, use of the thermally conductive plates allows further miniaturization of transformers, such as HPHF transformers, due to reduced temperature related constraints. Moreover, the improved thermal management can prolong the lifetime of the device and prevent determination of the magnetic properties of the core.
The electromagnetic device may further include, in the case of a plurality of core layers, one or more secondary thermally conductive plates disposed between the core layers. The one or more secondary thermally conductive plates may be disposed in a plane parallel or substantially parallel within manufacturing and/or measurement tolerances to the axial direction of the one or more sets of windings and orthogonal or substantially orthogonal within manufacturing and/or measurement tolerances to the plane of the thermally conductive plate. These secondary thermally conductive plates can increase the efficiency of the extraction of heat from the core assembly, by increasing the area of contact between the thermally conductive plates and the U-shaped cores and I-shaped cores.
The one or more secondary thermally conductive plates may be adjacent to and in thermal contact with the thermally conductive plate that is disposed between the closed cores. The secondary thermally conductive plates being in thermal contact with the thermally conductive plate that is disposed between the closed cores allows heat extracted by the secondary thermally conductive plates to flow into the (primary) thermally conductive plate, which can increase thermal efficiency.
The electromagnetic device may further include a thermally conductive housing including a frame and an outer casing. The thermally conductive housing may be in thermal contact with at least the thermally conductive plate of the core assembly. Removal of heat from the core assembly can be achieved via the thermally conductive housing to improve the thermal management of the device. Moreover, the thermally conductive housing provides mechanical protection for the electromagnetic device.
The frame may include gaps which prevent a low resistance electrical path being created via the frame through the electromagnetic device parallel or substantially parallel within manufacturing and/or measurement tolerances to the axial direction of the one or more sets of windings. This prevents any circulating currents from forming that would reduce efficiency and generate additional losses.
The frame of the thermally conductive housing may include corner portions which extend orthogonally or substantially orthogonally within manufacturing and/or measurement tolerances to the plane of the thermally conductive plate and parallel or substantially parallel within manufacturing and/or measurement tolerances to the core layers. The thermally conductive plate may have a first end and a second end. The thermally conductive plate may include cut-out portions at the first end, which prevent electrical contact with the corner portions at the first end of the thermally conductive plate, so as to prevent a low resistance electrical path being created via the thermally conductive plate through the electromagnetic device parallel or substantially parallel within manufacturing and/or measurement tolerances to the axial direction of the one or more sets of windings. Again, this can prevent electrical shorting from occurring.
The thermally conductive plate may be in thermal contact with the corner portions towards the second end of the thermally conductive plate. This allows heat to be transferred from the thermally conductive plate to the thermally conductive housing, thus improving the thermal management of the device.
The thermally conductive plate may be in thermal contact with the outer casing of the thermally conductive housing at the second end of the thermally conductive plate. A gap may be formed between the outer casing and the first end of the thermally conductive plate, so as to prevent a low resistance electrical path being created via the thermally conductive plate through the electromagnetic device parallel or substantially parallel within manufacturing and/or measurement tolerances to the axial direction of the one or more sets of windings.
Connecting the outer casing in this fashion provides strong thermal conductivity to remove heat extracted by the thermally conductive plates, while prevent shorting through the center of the device from occurring.
The one or more secondary thermally conductive plates may be in contact with the outer casing at one end of each of the one or more secondary thermally conductive plates. A gap may be included between the outer casing and the other end of each of the one or more secondary thermally conductive plates, so as to prevent a low resistance electrical path being created via the one or more secondary thermally conductive plates through the electromagnetic device parallel or substantially parallel within manufacturing and/or measurement tolerances to the axial direction of the one or more sets of windings.
Connecting the outer casing to the secondary thermally conductive plates can allow heat to be removed from the secondary thermally conductive plates directly, which helps improve the thermal management of the device. The gaps prevent a short occurring through the center of the device.
The frame of the thermally conductive housing may be in thermal contact with the peripheral core layers. This allows heat to be transferred from the U-shaped cores directly to the thermally conductive housing, improving the thermal management of the device.
The electromagnetic device may further include one or more thermally conductive blocks disposed adjacent to the one or more sets of windings and extending orthogonally or substantially orthogonally within manufacturing and/or measurement tolerances to the axial direction of the one or more sets of windings. The thermally conductive blocks may be in thermal contact with the one or more sets of windings to transfer heat away from the one or more sets of windings. The one or more thermally conductive blocks may be in thermal contact with the thermally conductive housing.
The thermally conductive blocks allow heat removal from the windings of the electromagnetic device, therefore providing further improvement in the thermal management of the device.
A gap may be formed between one end of each of the one or more thermally conductive blocks and the thermally conductive housing to prevent a low resistance electrical path being created through the electromagnetic device via the one or more thermally conductive blocks. This prevents any circulating currents being formed through the thermally conductive blocks due to induced voltages from the main magnetic field. The electromagnetic device includes two thermally conductive blocks, and the two thermally conductive blocks are positioned on opposite sides of the one or more sets of windings and are rotationally symmetric about the winding axis of the one or more sets of windings. Such a configuration allows heat to be extracted evenly from both sides of the device, while preventing a low resistance electrical path from being formed through the device.
The thermally conductive plate may be in thermal contact with a cooling structure either directly or indirectly via the thermally conductive housing. The one or more thermally conductive blocks may also be in thermal contact with a cooling structure either directly, or indirectly via the thermally conductive housing. The cooling structure may include one or more cooling plates and/or one or more radiating elements.
The cooling structure allows removal of the heat extracted from the interior of the core assembly by the thermally conductive plates, allowing a reduction in the core temperature of the electromagnetic device.
One or more radiating elements may be mounted on and thermally connected to the exterior of the outer casing to aid effective heat removal.
The one or more sets of windings may be formed from flat wire. The one or more sets of windings may be formed from square turns or substantially square turns within manufacturing and/or measurement tolerances. The one or more sets of windings may include input and output terminals that extend orthogonally or substantially orthogonally within manufacturing and/or measurement tolerances to the one or more core layers. The windings may be Murata's pdqb type windings, for example. The disk nature of flat wire windings such as pdqb windings helps to facilitate the improved thermal management approach.
At least one of the thermally conductive plates, the one or more secondary thermally conductive plates, the one or more thermally conductive blocks, and the thermally conductive housing may be made of aluminum or copper. These materials have a high thermally conductivity, while being non-magnetic so as to not disrupt the magnetic properties of the transformer. Aluminum can be substituted with copper in space critical applications for the further improvement of the efficacy.
The electromagnetic device may be transformer.
According to a first preferred embodiment of the present invention, a core assembly suitable for an electromagnetic device is provided. The core assembly includes one or more core layers. Each core layer includes two closed cores, and each closed core is constructed either from two U-shaped cores or from a U-shaped core and an I-shaped core. A thermally conductive plate that is disposed between the closed cores so as to bisect the one or more core layers. The thermally conductive plate is configured to transfer heat away from the interior of the core assembly.
The preferred embodiments of the present invention facilitate efficient removal of heat from the center and interior of the core assembly, as well as reduction of the hot spot temperature of the core.
The preferred embodiments of the present invention provide a thermal management system for an electromagnetic device such as a transformer, including but not limited to HPHF transformers. The thermal management system can be applied in particular to pdqb winding transformers; however. the preferred embodiments of the present invention are not limited to pdqb type transformers.
The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.
An electromagnetic device with improved thermal management is disclosed. The electromagnetic device includes a core assembly and one or more sets of windings wrapped around the core assembly. The core assembly is constructed from a plurality of U-shaped cores, or from a plurality of U-shaped cores and I-shaped cores in combination. Various arrangements of thermally conductive plates disposed within the core assembly are disclosed. The thermally conductive plates transfer heat away from the core assembly to improve the thermal characteristics of the electromagnetic device.
An electromagnetic device includes any device that stores or transfers energy via a magnetic field, such as a transformer, inductor, or choke. The preferred embodiments of the present invention can be applied in any such electromagnetic device. This description focuses on the case of a transformer as the electromagnetic device.
The core assembly 102 of
The core assembly 102 further includes a primary thermally conductive plate 110 and may optionally include one or more secondary thermally conductive plates 112. The primary and secondary thermally conductive plates 110, 112 can be made from a material with a high thermal conductivity that will not disrupt the magnetic properties of the transformer. For example, a non-magnetic metal could be used, such as aluminum or copper.
The primary thermally conductive plate 110 is disposed between adjacent U-shaped cores 108, so as to pass through the center of the windings 104 along the axial direction of the windings and bisect the core layers created by the sets of four U-shaped cores 108. The one or more secondary thermally conductive plates 112 are disposed between adjacent U-shaped cores, between the core layers, in a plane orthogonal or substantially orthogonal within manufacturing and/or measurement tolerances to the plane of the primary thermally conductive plate 110 and parallel or substantially parallel within manufacturing and/or measurement tolerances the axial direction of the windings. Multiple core layers and therefore at least eight U-shaped cores 108 can be used in the case where secondary thermally conductive plates 112 are included. The primary and secondary thermally conductive plates 110, 112 are positioned in planes which are parallel or substantially parallel within manufacturing and/or measurement tolerances to the magnetic field inside the core, so as to have no effect or substantially reduced effect on the magnetic circuit.
The primary and secondary thermally conductive plates 110, 112 transfer heat away from the interior of the core assembly 102 via conduction. The heat can be transferred away from the device via various cooling structures, as will be further detailed below. In this preferred embodiment, the primary and secondary thermally conductive plates 110, 112 transfer the extracted heat to the base 106, which can be mounted on a cooling plate, for example. Alternatively, various radiating structures can be used. For example, the thermally conductive plates may provide a path for the heat generated in the core to flow to one or more radiation surfaces.
A primary thermally conductive plate 110 may be used alone without the secondary thermally conductive plates 112. Alternatively, secondary thermally conductive plates 112 may be included both adjacent to the primary thermally conductive plate 110 and adjacent to the outer edge of the core assembly 102. In some preferred embodiments, only some of the secondary thermally conductive plates 112 may be included, for example, only the secondary thermally conductive plates 112 adjacent to the primary thermally conductive plate 110 may be included, and the secondary thermally conductive plates 112 adjacent to the outer edge of the core assembly 102 may be omitted, or vice versa. In some preferred embodiments, the secondary thermally conductive plates 112 may be thinner than the primary thermally conductive plate 110. Addition of the secondary conductive plates 112 can increase the amount of heat extracted from the core compared to the primary thermally conductive plate 110 alone, due to the increased contact area with the U-shaped cores.
Aluminum is typically used for the thermally conductive plates; however, aluminum plates can be substituted with copper plates in space critical applications for the further improvement of the efficacy. Aluminum typically has a thermal conductivity of over fifty times that of the core material, and copper typically has a thermal conductivity nearly 100 times larger than the core material. A combination of various different materials may be used for the primary and secondary thermally conductive plates 110, 112 in a single core assembly 102.
The introduction of the primary and secondary thermally conductive plates 110, 112 improves the effectiveness of the thermal management of the transformer device significantly. For example, the hot spot temperature of the core can be reduced by more than 20° C. by the primary and secondary thermally conductive plates 110, 112. Removing heat produced in the core assembly 102 can prevent heat being transferred from the core to the windings, and therefore can also prevent the winding temperature increasing. The improved thermal management of the core assembly 102 can prevent failure of the device and allow further miniaturization of the device, as well as preventing degradation of the magnetic properties of the core.
In the case of a multiphase transformer, multiple primary thermally conductive plates 110 could be used. Each core layer would include more than four U-shaped cores, increasing by two U-shaped cores with each extra phase, and the primary thermally conductive plates 110 would pass through each core layer a number of times, between each pair of closed cores. A multitude of secondary thermally conductive plates 112 could be disposed between the core layers.
A number of different winding arrangements could be used for the windings 104. For example, round wire windings or flat wire windings may be used. The windings may be formed from square turns or substantially square turns within manufacturing and/or measurement tolerances. The windings 104 include input and output terminals extending orthogonally or substantially orthogonally within manufacturing and/or measurement tolerances to the one or more core layers (not shown). The windings may be Murata's pdqb type windings, as detailed in UK patent application GB2574481, the entire contents of which are incorporated herein by reference.
Alternatively other winding arrangements could be used. More than one set of windings may be used as the windings 104, and each set of windings may contain a number of different coils, for example, primary and secondary coils, or may instead contain a single coil. The windings 104 may be insulated through various arrangements or structures such a coating on the windings or encasing the windings in a cast resin or the like. The windings could also be insulated through the use of Kapton® tape or the like.
The utilization of the various thermally conductive plate arrangements used in conjunction with the U-shaped cores provides effective removal of heat from the interior of the transformer device. This allows the correct temperature levels to be maintained inside the transformer device, which prevents damage or failure of the device occurring. Moreover, effective removal of heat from transformers with high loss densities allows operation with a lower temperature rise for a given size transformer. Therefore, use of the thermally conductive plates allows further miniaturization of transformers, such as HPHF transformers, due to reduced temperature related constraints.
The core assembly and winding arrangements of
The preferred embodiment of
The thermally conductive housing 650 is in thermal contact with the primary thermally conductive plate 610 to allow the thermally conductive housing to transfer the heat removed from the interior of the core by the thermally conductive plates 610, 612. In particular, the thermally conductive plate 610 is in thermal contact with the corner beams 652 towards the end of the thermally conductive plate 610 without cut-out portions. The frame of the thermally conductive housing 650 is in thermal contact with the peripheral core layers to allow further heat extraction from the core assembly 602. The exact placement of the components of the thermally conductive housing 650 and the contact points with the primary thermally conductive plate 610 and core assembly 602 will be discussed further below. The thermally conductive housing 650 can transfer the extracted heat to various cooling structures or arrangements, such as one or more cooling plates to remove heat via conduction and convection, or radiating elements to radiate the heat away. An airflow or flow of coolant over the surface of the thermally conductive housing 650 may be used to remove heat from the device. The corner beams 652 in the preferred embodiment of
The frame includes gaps which prevent a low resistance electrical path being created through the electromagnetic device via the frame in a direction parallel or substantially parallel within manufacturing and/or measurement tolerances to the axial direction of the windings. In other words, the edge beams 654 of the thermally conductive housing 650 are each connected to only one of the corner beams 652. In the preferred embodiment of
The core assembly 602, windings 604, and thermally conductive housing 650 may be attached together by various structures or arrangements. Typically, the core assembly 602 is held together through adhesive, a thermally conductive cement, through use of insulation tape, or the like. The core assembly 602 and windings 604 are then secured inside thermally conductive housing 650, which provides additional support. Additional adhesive, resin, insulating tape, or the like can be used throughout the structure to provide additional insulation between the components.
In one preferred embodiment, the dimensions of the primary thermally conductive plate 610 are approximately 150 mm by approximately 90 mm within manufacturing and/or measurement tolerances, the cut-out portions are approximately 30 mm by approximately 5 mm within manufacturing and/or measurement tolerances, and the plate is approximately 5 mm to approximately 10 mm thick within manufacturing and/or measurement tolerances. The cut-out portions therefore provide an approximately 5 mm spacing within manufacturing and/or measurement tolerances between the primary thermally conductive plate 610 and the corner beams 652. The dimensions of the primary thermally conductive plate 610 are carefully selected to maximize the contact area with the U-shaped cores 608, to maximize heat removal, while avoiding the possibility of shorting. The gaps between the corner beams 652 and edge beams 654 may also be approximately 5 mm to approximately 10 mm within manufacturing and/or measurement tolerances in some preferred embodiments.
Ensuring that no low resistance electrically conducting path is created through the primary thermally conductive plate 610 or edge beams 654 prevents any electrical shorts from occurring. However, the thermal contact between the primary thermally conductive plate 610 and corner beams 652 at the end of the primary thermally conductive plate 610 without cut-out potions allows heat to be removed from the interior of the core assembly via the primary thermally conductive plate. Moreover, the corner beams 652 and edge beams 654 are in thermal contact with the U-shaped cores 608 in the peripheral core layers to allow further heat to be removed from the core assembly. The thermally conductive plates 610, 612 and corner and edge beams 652, 654 are therefore able to transfer heat away from the core assembly 602, without creating an electrical conduction path through the transformer device 600. If an electrical conduction path was created, induced voltages due to any leakage magnetic fields from the core could cause circulating currents to flow through the device, which would reduce efficiency and generate additional losses.
The outer casing 656 is also connected so as to prevent any electrical shorts occurring through the center of the device, as can be seen from
As shown in
Each of the secondary thermally conductive plates 612 may also contact the outer casing 656 at one end of each of the secondary thermally conductive plates (not shown), to allow heat to be transferred from the secondary thermally conductive plates directly to the outer casing 656. In this case, a gap is formed between the outer casing 656 and the other end of each of the secondary thermally conductive plates 612, so as to prevent a low resistance electrical path being created via the one or more secondary thermally conductive plates through the device parallel or substantially parallel within manufacturing and/or measurement tolerances to the axial direction of the one or more sets of windings. In the case where the secondary thermally conductive plates 612 are adjacent to and in contact with the primary thermally conductive plate 610, the secondary thermally conductive plates 612 can contact the outer casing 656 on the same side as the primary thermally conductive plate 610 in order to avoid a low resistance electrical path through the device. When the secondary thermally conductive plates 612 are not in contact with the primary thermally conductive plate 610, for example, when the secondary thermally conductive plates 612 are positioned towards the outer edge of the core assembly 602, the secondary thermally conductive plates 612 may contact the outer casing 656 on the opposite side of the device to the primary thermally conductive plate 610, provided only one end of each of the secondary thermally conductive plates 612 is in contact with the outer casing 656.
It can be further seen from
In the preferred embodiment shown in
However, referring back to
In preferred embodiments of the present invention, the thermally conductive plates 610, 612 and the frame of the thermally conductive housing 652, 654 mean that conductive portions are brought closer to the core than typical in transformers. The configuration described above therefore seeks to prevent any low resistance paths being formed in these portions, where the leakage voltages are large enough to cause significant circulating currents. The only low resistance paths that remain through the thermally conductive housing 650 are via the outer casing 656, which are not significant compared to potential paths through the center of the device.
The transformer device 600 of the present preferred embodiment allows excellent management of generated heat. Heat generated can be extracted and removed via the thermally conductive plates 610, 612 and the thermally conductive housing 650, preventing overheating of the device and allowing miniaturization. Moreover, the configuration of the cut-out portions 614 and thermally conductive housing 650 prevents any low resistance electrical paths being formed through the center of the device, thus preventing any short circuits from being formed, leading to circulating currents and additional losses.
A pair of thermally conductive blocks 716 are disposed between the two sets of windings 704, adjacent to and in thermal contact with the windings 704. Alternatively, only one set of windings may be used, with the thermally conductive blocks 716 positioned adjacent to one side of the windings, or placed within the windings between two turns. The thermally conductive blocks 716 extend orthogonally or substantially orthogonally within manufacturing and/or measurement tolerances to the axial direction of the windings. The thermally conductive blocks 716 are in thermal contact with the windings 704 to transfer heat away from the windings.
The preferred embodiment of
The preferred embodiment of
The thermally conductive blocks 716 may thermally contact the thermally conductive housing 650 at one end of each of the thermally conductive blocks only, to prevent an electrical path being created through the thermally conductive blocks 716. This prevents any circulating currents being formed through the thermally conductive blocks due to induced voltages from the main magnetic field. The dimensions of the thermally conductive blocks 716 are carefully selected to maximize the contact area with the windings 704 in order to maximize heat removal, while avoiding the possibility of shorting. In one preferred embodiment, the gap between the thermally conductive blocks 716 and the thermally conductive housing 650 is approximately 10 mm within manufacturing and/or measurement tolerances. When this gap is larger, less heat is extracted, but the gap should be large enough to prevent any shorting.
As seen in
Other arrangements could be used, as would be understood by the skilled person. For example, four thermally conductive blocks 716 all extending perpendicular or substantially perpendicular within manufacturing and/or measurement tolerances to each other could be used. In other words, an additional two thermally conductive blocks could be included in the preferred embodiment of
The wires in the windings 704 are insulated from the thermally conductive blocks 716. Various insulation structures or arrangements can be used, such as coating the windings or thermally conductive blocks in an insulator, or encasing the windings and thermally conductive blocks in a cast resin or the like. The windings could also be insulated through the use of Kapton® tape or the like. The thermally conductive blocks can be used in combination with Murata's pdqb type windings, to further utilize the advantages of pdqb windings.
As well as the heat removed from the core assembly 702 due to the primary thermally conductive plate 710, and secondary thermally conductive plates if these are present, the thermally conductive blocks 716 remove additional heat from the windings. This can further assist with temperature control of the transformer device, preventing overheating and allowing miniaturization.
In the preferred embodiments of
The heat extracted by the thermally conductive blocks 716 and transferred to the thermally conductive housing 650 can be removed by various cooling structures, such as mounting on a cooling plate, use of an airflow or flow of coolant over the surface of the thermally conductive housing 650, radiating elements, or the like. For example,
The various concepts and structures described in the preferred embodiments contribute to the optimization of the thermal performance of the transformer device. Improved thermal management can extend the lifetime of the device, as well as allowing miniaturization of the device. This concept can be used in any electromagnetic device that is constructed with a UU type or UI core assembly that provides a middle separation in the magnetic path parallel or substantially parallel within manufacturing and/or measurement tolerances to the direction of the flow of the magnetic flux. The principle can be used in any transformer, such as a HPHF transformer, or any high power inductor application where the magnetic core is constructed with an assembly of UU cores or UI cores.
While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
Number | Date | Country | Kind |
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2011747.9 | Jul 2020 | GB | national |
This application claims the benefit of priority to United Kingdom Patent Application No. 2011747.9 filed on Jul. 29, 2020 and is a Continuation Application of PCT Application No. PCT/GB2021/051945 filed on Jul. 28, 2021. The entire contents of each application are hereby incorporated herein by reference.
Number | Date | Country | |
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Parent | PCT/GB2021/051945 | Jul 2021 | US |
Child | 18119726 | US |