Exemplary embodiments pertain to the art of thermal management and, in particular, to thermal management of an inductor on a cold plate.
A liquid cold plate is a platform for mounting power electronic components. The cold plate provides localized cooling to the components by transferring heat from the components mounted on one or both surfaces to the liquid flowing within. One of the components that may be placed on a cold plate is an inductor. An inductor is a passive two-terminal electrical component that stores energy in a magnetic field when current flows through it. Generally, in inductor includes an insulated wire wound around a core as a coil.
In one embodiment, a cold plate includes a first side with a first surface, and a second side, opposite the first side, with a second surface opposite the first surface. The cold plate also includes a flow channel formed between the first side and the second side, and a cavity integrally machined into the first surface of the first side. The cavity seats an inductor and is defined by an outer wall and a base with thicker sections and thinner sections such that even the thicker sections of the base are thinner than a thickness of the first surface.
Additionally or alternatively, in this or other embodiments, the cold plate also includes an inlet to channel coolant into the flow channel.
Additionally or alternatively, in this or other embodiments, the cold plate also includes an outlet to channel the coolant out of the flow channel.
Additionally or alternatively, in this or other embodiments, a thickness of the first side is greater than a thickness of the second side.
Additionally or alternatively, in this or other embodiments, the cavity includes first portions, second portions, and a center plate.
Additionally or alternatively, in this or other embodiments, the first portions have the base with the thicker sections and each of the thicker sections supports a core of the inductor.
Additionally or alternatively, in this or other embodiments, the outer wall corresponding with each of the first portions is curved.
Additionally or alternatively, in this or other embodiments, the first portions are on opposite ends of the center plate such that the outer wall corresponding with each of the first portions is perpendicular to the center plate.
Additionally or alternatively, in this or other embodiments, the second portions have the base with the thinner sections and each of the thinner sections supports windings of the inductor.
Additionally or alternatively, in this or other embodiments, the outer wall corresponding with each of the second portions is straight.
Additionally or alternatively, in this or other embodiments, the second portions are on opposite sides of the center plate such that the outer wall corresponding with each of the second portions is parallel with the center plate.
Additionally or alternatively, in this or other embodiments, the cold plate also includes one or more additional ones of the cavity to seat one or more additional ones of the inductor.
Additionally or alternatively, in this or other embodiments, the outer wall of at least one of the one or more additional ones of the cavity is part of the outer wall of the cavity.
In another embodiment, a method of fabricating a cold plate includes machining a flow channel between a first side with a first surface and a second side, opposite the first side, with a second surface opposite the first surface. The method also includes machining a cavity into the first surface of the first side. The cavity seats an inductor and is defined by an outer wall and a base with thicker sections and thinner sections such that even the thicker sections of the base are thinner than a thickness of the first surface.
Additionally or alternatively, in this or other embodiments, the method also includes forming an inlet to channel coolant into the flow channel, forming an outlet to channel the coolant out of the flow channel, and positioning the flow channel such that a thickness of the first side is greater than a thickness of the second side.
Additionally or alternatively, in this or other embodiments, the machining the cavity includes machining first portions, second portions, and a center plate.
Additionally or alternatively, in this or other embodiments, the machining the first portions includes forming the first portions with the base with the thicker sections. Each of the thicker sections supports a core of the inductor. The machining the second portions includes forming the second portions with the base with the thinner sections. Each of the thinner sections supports windings of the inductor.
Additionally or alternatively, in this or other embodiments, the method also includes machining the outer wall of each of the first portions to be curved and machining the outer wall of each of the second portions to be straight.
Additionally or alternatively, in this or other embodiments, the machining the cavity includes machining the first portions to be on opposite ends of the center plate such that the outer wall of each of the first portions is perpendicular to the center plate, and machining the second portions to be on opposite sides of the center plate such that the outer wall of each of the second portions is parallel to the center plate.
Additionally or alternatively, in this or other embodiments, the method also includes machining one or more additional ones of the cavity to seat one or more additional ones of the inductor. The machining includes the outer wall of at least one of the one or more additional ones of the cavity being part of the outer wall of the cavity.
The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:
A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.
As previously noted, a cold plate can support and cool electronic components. Embodiments of the systems and methods detailed herein relate to thermal management of an inductor on a cold plate. Specifically, a cavity is machined as an integral part of the cold plate to accommodate the inductor. As also detailed, more than one cavity may be machined to accommodate more than one inductor on the cold plate. The base of the cavity transfers heat from the inductor to a coolant flowing within the body of the cold plate in a flow channel.
The cavity 140 of the cold plate 130 that seats the inductor 110 is further detailed with reference to
An inlet 150 facilitates an inflow of coolant 170 through a flow channel 610 (
The center plate 220 defines first or core portions 240 of the cavity on either end of the center plate 220. The center plate 220 also defines second or winding portions 250 on either side of the center plate 220. The core portions 240 of the cavity 140, which are perpendicular to the center plate 220, support the parts of the core 105 of the inductor 110 that do not include the bobbins 117 and windings 115. The outer wall 210 corresponding with the core portions 240 is curved. The winding portions 250 of the cavity 140, which are parallel to the center plate 220, support the bobbins 117 and windings 115 of the inductor 110. The outer wall 210 corresponding with the winding portions 250 is straight.
The floor or base 230 of the cavity 140 ultimately conducts the heat dissipated by the inductor 110, the heat source, to the coolant 170, the heat sink. The base 230 has a different thickness in the core portions 240 than in the winding portions 250, as discussed with reference to
As previously noted, the cavity 140 is machined to be an integral part of the cold plate 130. Thus, the outer wall 210 and center plate 220 are machined from the material of the cold plate 130. As a result, thermal interface resistances are eliminated between different aspects of the cavity 140. The absence of thermal interface resistance maximizes heat dissipation from the source (i.e., the inductor 110). As previously noted, the base 230 of the cavity 140 ultimately conducts the heat from the cavity 140 to the heat sink, the coolant 170. The thickness Bt of even the thickest part of this base 230 is minimized, with consideration to structural integrity, to maximize heat transfer from the base 230 to the coolant 170 flowing through the flow channel 610. The base 230 actually includes two thicknesses. This is indicated in
The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof.
While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.
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