Patent Application
20130000870
The present invention relates to a thermal module, and more particularly to a thermal module enabling effectively reduced thermal resistance, increased heat transfer efficiency, and lowered manufacturing cost. The present invention also relates to a method of manufacturing the above-described thermal module.
The progress in semiconductor technology enables various integrated circuits (ICs) to have gradually reduced volume. For the purpose of processing more data, the number of electronic components provided on the presently available ICs is several times higher than that on the conventional ICs of the same volume. When the number of electronic components on the ICs increases, the heat generated by the electronic components during the operation thereof also increases. For example, the heat generated by a central processing unit (CPU) at full-load condition is high enough to burn out the whole CPU. Such heat must be timely removed, lest the electronic components should become disordered or damaged, such as burnt out. Thus, it is always a very important issue in the computer-related fields to properly provide a thermal module for ICs.
The conventional thermal modules usually remove the heat generated by the CPU through heat transfer.
The heat pipe 12 has a heat-absorption section 121 and a heat-dissipation section 123. The heat-absorption section 121 is also the end of the heat pipe 12 received in the through hole 103 of the base 10. The heat-absorption section 121 can be welded to the base 10 to thereby form an integral part of the base 10. The heat-dissipation section 123 is connected to the radiating fin assembly 14. The heat generated by the heat-generating element 16 is absorbed by the second side 102 of the base 10 and then transferred to the heat-absorption section 121 of the heat pipe 12 received in the through hole 103. The heat-absorption section 121 further transfers the heat from the base 10 to the radiating fin assembly 14 connected to the heat-dissipation section 123 of the heat pipe 12 to thereby achieve the purpose of dissipating heat into ambient air.
However, while the above-structured thermal module is able to dissipate the heat generated by the heat-generating element 16, it provides only relatively low heat dissipation effect. This is because, according to the above-described structure of the conventional thermal module, the heat from the heat-generating element 16 must be first transferred to the base 10 before it is further transferred to the radiating fin assembly 14 on the heat pipe 12. Thus, the conventional thermal module defines a relatively long heat transfer path and thermal resistance tends to occur in the long course of heat transfer, bringing the thermal module to have poor overall heat transfer efficiency and accordingly, poor heat dissipation effect.
Moreover, in manufacturing the conventional thermal module, a large quantity of tin material must be used to fixedly weld the heat pipe 12 to the base 10. The tin material and the welding inevitably increase the time, labor and material costs of the conventional thermal module. To lower the overall manufacturing cost of the conventional thermal module, some of the manufacturers change the copper base to an aluminum base and coat a layer of metal material on the aluminum base by way of electric plating. The heat pipe is then welded to the metal-coated aluminum base. The low-cost aluminum base has a serious problem of largely reduced heat absorption effect compared to the copper base. As a result, the thermal module with an aluminum base has reduced overall heat dissipation effect.
In brief, the conventional thermal module has the following disadvantages: (1) poor heat transfer efficiency; (2) increased labor, time and material costs; and (3) poor heat dissipation effect.
It is therefore tried by the inventor to develop an improved thermal module to overcome the problems in the prior art thermal module.
A primary object of the present invention is to provide a thermal module that includes a first and a second linking member, a mounting member, and a heat pipe connected to one another to form an integral unit, so as to enable effectively increased heat transfer efficiency.
Another object of the present invention is to provide a thermal module that can be manufactured at reduced costs.
A further object of the present invention is to provide a method of manufacturing a thermal module with reduced thermal resistance and increased heat transfer efficiency.
A still further object of the present invention is to provide a method of manufacturing a thermal module at reduced costs.
To achieve the above and other objects, the thermal module according to the present invention includes a heat pipe, at least one first linking member, at least one second linking member, and a mounting member. The heat pipe has a heat-absorption section and a heat-dissipation section outward extended from the heat-absorption section. The first and second linking members have a first and a second recess, respectively, for correspondingly receiving and connecting to two opposite lateral sides of the heat-absorption section of the heat pipe.
The first linking member is provided at locations close to the first recess with a plurality of first engaging sections, and the second linking member is provided at locations close to the second recess with a plurality of second engaging sections. The mounting member is arranged on top of the heat-absorption section and the first and second linking members, and is provided with a plurality of stopping sections for connecting with corresponding first and second engaging sections, so that the first and second linking members, the mounting member, and the heat pipe are connected to one another to form an integral unit. With the above arrangements, the thermal module of the present invention can have effectively reduced thermal resistance, increased heat transfer efficiency, and lowered manufacturing costs.
To achieve the above and other objects, the thermal module manufacturing method according to the present invention includes the following steps: (1) providing a heat pipe, at least one first linking member, at least one second linking member, and a mounting member; the first linking member having a first recess and a plurality of first engaging sections located close to the first recess, the second linking member having a second recess and a plurality of second engaging sections located close to the second recess; and (2) disposing the first and second linking members at two opposite lateral sides of a heat-absorption end of the heat pipe, and correspondingly arranging the mounting member on top of the first and second linking members and the heat-absorption end of the heat pipe; and simultaneously pressing the first and second linking members and the mounting member against the heat pipe, so that the two lateral sides of the heat-absorption section of the heat pipe are tightly received in and connected to the first and the second recess, and the stopping sections are connected to corresponding first and second engaging sections, bringing the first and second linking members, the mounting member and the heat pipe to form an integral unit. With the above method, a thermal module can be manufactured at effectively reduced labor and time costs while achieving excellent heat dissipation effect.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to
The first linking member 3 is provided at a predetermined position with a first recess 31 and at positions close to the first recess 31 with a plurality of first engaging sections 32. The first linking member 3 externally defines around its outer side four surfaces, namely, a first, a second, a third, and a fourth surface 331, 332, 333, and 334. The first surface 331 is located opposite to the second surface 332 and is flush with the first heat-absorption surface 211 of the heat pipe 2, and the fourth surface 334 is located opposite to the third surface 333. The first recess 31 is formed on and along the fourth surface 334 of the first linking member 3 for fitly receiving the second heat-absorption surface 212 of the heat pipe 2 therein. The first engaging sections 32 in the first preferred embodiment are in the form of posts upward projected from the second surface 332 of the first linking member 3.
The second linking member 4 is provided at a predetermined position with a second recess 41 and at positions close to the second recess 41 with a plurality of second engaging sections 42. The second linking member 4 externally defines around its outer side four surfaces, namely, a fifth, a sixth, a seventh, and an eighth surface 431, 432, 433, and 434. The fifth surface 431 is located opposite to the sixth surface 432 and is flush with the first heat-absorption surface 211 of the heat pipe 2 as well as the first surface 331 of the first linking member 3, and the eighth surface 434 is located opposite to the seventh surface 433. The second recess 41 is formed on and along the eighth surface 434 of the second linking member 4 for fitly receiving the fourth heat-absorption surface 214 of the heat pipe 2 therein. In brief, the heat-absorption section 21 has two surfaces, i.e., the second and the fourth heat-absorption surface 212, 214, received in and connected to the first and the second recess 31, 41, respectively.
As can be seen in
It is understood the first and the second linking member 3, 4 and the mounting member 5 can be connected to one another through insertion or snap fitting without being limited thereto. For example, in implementing the present invention, the first and second linking members 3, 4 may also be welded or bonded to the mounting member 5 to ensure tight and secured connection therebetween.
The mounting member 5 may be implemented in two different configurations. In the first preferred embodiment of the present invention as shown in
In a variant of the first preferred embodiment of the present invention as shown in
With the present invention, the first and the second linking member 3, 4 and the mounting member 5 are connected to the heat pipe 2 to form an integral unit, and heat is directly absorbed and transferred by the heat-absorption section 21 of the heat pipe 2 to the radiating fin assembly 6 mounted to the heat-dissipation section 22, as shown in
The present invention also provides a method of manufacturing a thermal module.
In the step 200, the manufacturing method is started.
In the step 201, a heat pipe, at least one first linking member having a first recess and a plurality of first engaging sections, at least one second linking member having a second recess and a plurality of second engaging sections, and a mounting member having a plurality of stopping sections are provided.
More specifically, a heat pipe 2, at least one first linking member 3 having a first recess 31 and a plurality of first engaging sections 32, at least one second linking member 4 having a second recess 41 and a plurality of second engaging sections 42, and a mounting member 5 having a plurality of stopping sections 51 are provided. The first and second linking members 3, 4 and the mounting member 5 are made of a metal material, such as copper, gold, aluminum, silver or alloys thereof. The first and second engaging sections 32, 42 are in the form of posts upwardly projected from surfaces of the first and second linking members 3, 4 facing toward the mounting member 5. That is, the first and second engaging sections 32, 42 are axially upward projected from the above-mentioned second surface 332 and the sixth surface 432.
The first recess 31 is formed on one side surface of the first linking member 3, i.e., on the above-mentioned fourth surface 334, and the first engaging sections 32 are provided close to and along the fourth surface 334. The second recess 41 is formed on one side surface of the second linking member 4, i.e., on the above-mentioned eighth surface 434, and the second engaging sections 42 are provided close to and along the eighth surface 434. The stopping sections 51 are in the form of through holes penetrating through the mounting member 5, i.e., extending from the above-mentioned first side 511 to the second side 512 of the mounting member 5, and are located corresponding to the first and second engaging sections 32, 42. In implementing the manufacturing method, the first and the second engaging sections 32, 42 may be otherwise configured as sunken holes while the stopping sections 51 may be otherwise configured as downward projected posts, depending on the convenience and actual need in manufacturing and assembling the thermal module.
In the step 202, the first and second linking members are separately disposed at two opposite lateral sides of an end of the heat pipe, and the mounting member is correspondingly disposed on top of the heat pipe and the first and second linking members; the first and second linking members as well as the mounting member are then simultaneously pressed against the heat pipe, so that the two opposite lateral sides at one end of the heat pipe are tightly received in the first and the second recess and the first and second engaging sections are correspondingly connected to the stopping sections, bringing the first and second linking members, the mounting member, and the heat pipe to connect to one another and form an integral unit.
More specifically, a mold (not shown) is provided, so that the first and second linking members 3, 4 can be positioned with the first and second recesses 31, 41 facing toward the two opposite lateral sides of an end, i.e., the above-mentioned heat-absorption section 21, of the heat pipe 2, and the mounting member 5 is correspondingly disposed on top of the first and second linking members 3, 4 and the heat-absorption section 21 of the heat pipe 2. That is, the first side 511 of the mounting member 5 is located on the above-mentioned third heat-absorption surface 213 of the heat pipe 2 and the second and sixth surfaces 332, 432 of the first and second linking members 3, 4, respectively. Then, via the mold, the first and second linking members 3, 4 as well as the mounting member 5 are simultaneously pressed against the heat pipe 2.
Thereafter, the two opposite lateral sides, i.e., the above-mentioned second and fourth heat-absorption surfaces 212, 214, at the heat-absorption section 21 of the heat pipe 2 are tightly received in and pressed against the first and the second recess 31, 41, and the first and second engaging sections 32, 42 are correspondingly connected to the stopping sections 51, bringing the first and second linking members 3, 4, the mounting member 5, and the heat pipe 2 to connect to one another and form an integral unit.
With the method of the present invention, it is possible to manufacture a thermal module with effectively reduced time and labor costs. When the thermal module manufactured using the method of the present invention is used to carry away heat from the heat-generating element 7, the occurrence of thermal resistance can be effectively avoided to enable increased overall heat transfer efficiency and excellent heat dissipation effect.
Please refer to
In conclusion, the thermal module manufactured using the method of the present invention has the following advantages: (1) providing good heat transfer efficiency; (2) providing good heat dissipation effect; and (3) being manufactured with reduced time and labor costs.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
