Claims
- 1. A thermal printhead consisting essentially of:
- a substrate,
- a plurality of conductors formed on one surface of the substrate, and
- a line of separate heating elements each comprising a monolithic semiconductor chip having circuit means for heating the respective element when energized and having beam leads extending beyond the periphery of said chip parallel to the face of said chip,
- the heating elements being fastened on said one surface of the substrate with said beam leads adjacent said one surface of said substrate and with each said beam lead of each element bonded to a conductor on the substrate at locations outside the peripheries of said chips.
- 2. The thermal printhead of claim 1 wherein:
- the circuit means of each heating element is a transistor having collector, base and emitter regions,
- the beam leads formed on the circuit means include collector, base and emitter leads electrically connected to the collector, base and emitter regions, and
- at least two of the corresponding collector, base and emitter leads of the heater elements are electrically common with the corresponding leads of the other heater element and the other lead of each element is individually controllable.
- 3. The thermal printhead of claim 1 wherein there are only five heating elements aligned in a straight line.
- 4. The thermal printhead of claim 1 wherein:
- each circuit means is a transistor having collector, base and emitter regions,
- each heating element has collector, base and emitter leads electrically connected to the respective regions, forming said beam leads and extending beyond the edge of the element,
- the collector lead of each heating element is bonded to a common conductor on a substrate,
- the emitter lead of each heating element is bonded to another common conductor on the substrate, and
- the base lead of each heating element is bonded to a separate conductor on the substrate whereby each transistor is individually controllable by current applied to the base.
Parent Case Info
This is a division of application Ser. No. 254,668, filed May 18, 1972, now U.S. Pat. No. 3,944,724 dated Mar. 16, 1976.
US Referenced Citations (6)
Divisions (1)
|
Number |
Date |
Country |
Parent |
254668 |
May 1972 |
|