Claims
- 1. A thermal-transfer recording process comprising the steps of:
- (1) placing a transfer material comprising a support film and an image forming layer provided thereon which contains a coloring material and an organic polymer on an image-receiving sheet comprising a substrate and a positive-type photosensitive thermal-adhesive layer in such a manner that the image forming layer and the photosensitive thermal-adhesive layer come into contact with each other, to form a composite;
- (2) imagewise heating the surface of the support film side of the composite using a thermal head to increase a bonding strength between the image forming layer and the photosensitive thermal-adhesive layer in the heated portion;
- (3) separating the transfer material from the image-receiving sheet leaving the image forming layer in the heated portion on the photosensitive thermal-adhesive layer to form a colored replica image on the image-receiving sheet;
- (4) exposing the whole surface of the photosensitive thermal-adhesive layer on the substrate to ultraviolet rays via the colored replica image; and
- (5) treating the exposed layer with a developing solution to remove the exposed layer in the area having no colored replica image thereon.
- 2. The thermal-transfer recording process as defined in claim 1, wherein the support film has a thickness of 2 to 50 .mu.m.
- 3. The thermal-transfer recording process as defined in claim 1, wherein the image forming layer has a thickness not more than 2.0 .mu.m and has a transmittance density of not less than 0.9 to a light of wavelength region of 330 to 450 nm.
- 4. The thermal-transfer recording process as defined in claim 1, wherein the positive-type photosensitive thermal-adhesive layer contains novolak-type phenol resin in the amount of 10 to 85 weight %.
- 5. The thermal-transfer recording process defined in claim 1, wherein the photosensitive thermal-adhesive layer contains a o-naphthoquinonediazide compound as a photosensitive material.
Priority Claims (2)
Number |
Date |
Country |
Kind |
4-301807 |
Oct 1992 |
JPX |
|
4-330927 |
Nov 1992 |
JPX |
|
Parent Case Info
This is a divisional of application Ser. No. 08/134,882 filed Oct. 13, 1993, now U.S. Pat. No. 5,534,905.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5061093 |
Yamaguchi et al. |
Oct 1991 |
|
Divisions (1)
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Number |
Date |
Country |
Parent |
134882 |
Oct 1993 |
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