Claims
- 1. A thermally-conductive, biological assay tray comprising a platform having multiple test wells disposed therein, said platform comprising a polymer composition, said composition comprising: i) about 20% to about 80% by weight of a polymer matrix, and ii) about 20% to about 80% by weight of a non-metallic, thermally-conductive material.
- 2. The assay tray of claim 1, wherein the tray has a thermal conductivity of greater than 3 W/m°K.
- 3. The assay tray of claim 1, wherein the polymer matrix comprises a thermoplastic polymer.
- 4. The assay tray of claim 3, wherein the thermoplastic polymer is selected from the group consisting of polycarbonates, polyethylene, polypropylene, acrylics, vinyls, fluorocarbons, polyamides, polyesters, polyphenylene sulfide, and liquid crystal polymers.
- 5. The assay tray of claim 1, wherein the polymer matrix comprises a thermosetting polymer.
- 6. The assay tray of claim 1, wherein the thermally-conductive material is selected from the group consisting of ceramics, metal oxides, and carbon materials.
- 7. The assay tray of claim 6, wherein the thermally-conductive material is selected from the group consisting of silicon nitride, boron nitride, alumina, magnesium oxide, and carbon graphite.
- 8. The assay tray of claim 1, wherein the polymer composition further comprises: (iii) a reinforcing material.
- 9. The method of claim 8, wherein the reinforcing material is glass.
- 10. A method of making a net-shape molded, thermally-conductive biological assay tray, comprising the steps of:
a) providing a molten composition comprising: i) about 20% to about 80% by weight of a polymer matrix, and ii) about 20% to about 80% by weight of a non-metallic, thermally-conductive material; b) injecting the molten composition into a mold; c) removing the composition from the mold to form a net-shape molded, thermally-conductive biological assay tray comprising a platform having multiple test wells disposed therein.
- 11. The method of claim 10, wherein the assay tray has a thermal conductivity of greater than 3 W/m°K.
- 12. The method of claim 10, wherein the polymer matrix comprises a thermoplastic polymer.
- 13. The method of claim 11, wherein the thermoplastic polymer is selected from the group consisting of polycarbonates, polyethylene, polypropylene, acrylics, vinyls, fluorocarbons, polyamides, polyesters, polyphenylene sulfide, and liquid crystal polymers.
- 14. The method of claim 10, wherein the polymer matrix comprises a thermosetting polymer.
- 15. The method of claim 10, wherein the thermally-conductive material is selected from the group consisting of ceramics, metal oxides, and carbon materials.
- 16. The method of claim 15, wherein the thermally-conductive material is selected from the group consisting of silicon nitride, boron nitride, alumina, magnesium oxide, and carbon graphite.
- 17. The method of claim 10, wherein the composition further comprises reinforcing material.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The application claims the benefit of U.S. Provisional Application No. 60/373,014 having a filing date of Apr. 15, 2002.
Provisional Applications (1)
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Number |
Date |
Country |
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60373014 |
Apr 2002 |
US |