Claims
- 1. An overmold for a disc drive actuator assembly to encapsulate and support an actuator coil made from an overmold material comprising:
a base resin; and a ceramic filler compound blended with the resin.
- 2. The overmold of claim 1 wherein the ceramic filler compound is chosen from a group of ceramic filler compounds consisting of boron nitride, alumina, aluminum nitride, magnesium oxide, zinc oxide, silicon carbide, beryllium oxide and chromium oxide.
- 3. The overmold of claim 1 further comprising glass mixed with the resin and the ceramic filler compound.
- 4. The overmold of claim 1 wherein the ceramic filler compound is a mixture of ceramic filler compounds chosen from a group of ceramic filler compounds consisting of boron nitride, alumina, aluminum nitride, magnesium oxide, zinc oxide, silicon carbide, beryllium oxide and chromium oxide.
- 5. The overmold of claim 1 wherein the ceramic filler compound is present in the overmold material in a mass concentration of 25% to 90%.
- 6. The overmold of claim 1 wherein the base resin is a liquid crystal polymer.
- 7. The overmold of claim 1 wherein the base resin is chosen from a class of base resins consisting of polyethylene naphthalate, polyethylene terephthalate, polybutylene terephthalate, polyamide, polyphthalamide, polypheneline sulfide, polycarbonates, polyetheretheketones and polyphenyline oxide.
- 8. The overmold of claim 1 wherein the base resin is present in the overmold material in a mass concentration of 10% to 75%.
- 9. The overmold of claim 1 wherein the overmold material further comprises a coupling agent.
- 10. The overmold of claim 9 wherein the coupling agent is present in the overmold material in a mass concentration of 0.1% to 5%.
- 11. The overmold of claim 9 wherein the coupling agent is chosen from a class of coupling agents consisting of neoalkoxy titanate or monoalkoxy titanate.
- 12. The overmold of claim 1 wherein the overmold material has a thermal conductivity of at least 0.40 W/m-°K.
- 13. A disc drive, comprising:
a rotatable disc; an actuator assembly comprising a read/write head adjacent the disc; and an overmold which encapsulates and supports an actuator coil, the overmold formed from a base resin blended with a ceramic filler compound and configured to have a rate of thermal expansion that minimizes popping of the overmold during heating of the actuator coil due to the application of currents to the actuator coil.
- 14. The disc drive of claim 13 wherein the ceramic filler compound is chosen from a group of ceramic filler compounds consisting of boron nitride, alumina, aluminum nitride, magnesium oxide, zinc oxide, silicon carbide, beryllium oxide and chromium oxide.
- 15. The disc drive of claim 13 wherein the ceramic filler compound is present in the overmold in a mass concentration of 25% to 90%.
- 16. The disc drive of claim 13 wherein the base resin of the overmold is chosen from a class of base resins consisting of a polyethylene naphthalate, polyethylene terephthalate, polybutylene terephthalate, polyamide, polyphthalamide, polypheneline sulfide, polycarbonates, polyetheretheketones and polyphenyline oxide.
- 17. The disc drive of claim 13 wherein the base resin is present in the overmold in a mass concentration of 10% to 75%.
- 18. The disc drive of claim 13 wherein the overmold further comprises a coupling agent.
- 19. The disc drive of claim 13 wherein the overmold has a thermal conductivity of at least 0.40 W/m-°K.
- 20. A disc drive, comprising:
a rotatable disc; an actuator assembly comprising a read/write head supported adjacent the disc and an actuator coil to which current is applied to rotate the actuator assembly; and first means for encapsulating and supporting the actuator coil to reduce head position errors due to thermal expansion and contraction of the actuator coil.
- 21. The disc drive of claim 20 wherein the first means comprises an overmold formed from a base resin and a ceramic filler compound blended with the resin.
- 22. The disc drive of claim 21 wherein the ceramic filler compound is chosen from a group of ceramic filler compounds consisting of boron nitride, alumina, aluminum nitride, magnesium oxide, zinc oxide, silicon carbide, beryllium oxide and chromium oxide.
- 23. The disc drive of claim 21 further comprising glass mixed with the resin and the ceramic filler compound.
- 24. The disc drive of claim 21 wherein the ceramic filler compound is a mixture of ceramic filler compounds chosen from a group of ceramic filler compounds consisting of boron nitride, alumina, aluminum nitride, magnesium oxide, zinc oxide, silicon carbide, beryllium oxide and chromium oxide.
- 25. The disc drive of claim 21 wherein the ceramic filler compound is present in the overmold in a mass concentration of 25% to 90%.
- 26. The disc drive of claim 21 wherein the base resin is a liquid crystal polymer.
- 27. The disc drive of claim 21 wherein the base resin is chosen from a class of base resins consisting of polyethylene naphthalate, polyethylene terephthalate, polybutylene terephthalate, polyamide, polyphthalamide, polypheneline sulfide, polycarbonates, polyetheretheketones and polyphenyline oxide.
- 28. The disc drive of claim 21 wherein the base resin is present in the overmold material in a mass concentration of 10% to 75%.
- 29. The disc drive of claim 21 wherein the overmold material further comprises a coupling agent.
- 30. The disc drive of claim 21 wherein the overmold material has a thermal conductivity of at least 0.40 W/m-°K.
RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional Application No. 60/290,093 filed May 10, 2001.
Provisional Applications (1)
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Number |
Date |
Country |
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60290093 |
May 2001 |
US |