The present invention relates to a thermally emissive coating formed on a surface of a base material to promote heat release, a thermally emissive coating material composition included in the thermally emissive coating and a coating forming method therefor.
To form a thermally emissive coating on a surface of an apparatus to promote heat release from the apparatus is publicly known. Such a thermally emissive coating generally includes a main material comprised primarily of a resin such as acrylic resin, and a thermally emissive filler included in the main material, the filler being comprised primarily of inorganic particles such as carbon black held in the main material. See (Patent Document 1).
Patent Document 1: JP2006-281514A
A thermally emissive coating in the prior art includes a thermally emissive filler as an essential component. This means that it is necessary to select a thermally emissive filler suitable for a main material, prepare the thermally emissive fillers, and disperse the thermally emissive fillers in the main material, and other necessary processes. Some thermally emissive fillers inconveniently promote the deterioration of the main material. If any thermally emissive filler is not used, forming coating would become easier.
The present invention has been made in view of the aforementioned problems of the prior art, and a primary object of the present invention is to provide a thermally emissive coating material composition, a thermally emissive coating and a coating forming method without any thermally emissive filler.
In order to attain the above object, a first aspect of the present invention provides a thermally emissive coating material composition for forming a thermally emissive coating, wherein the thermally emissive coating material composition comprises a poly-α-olefin having a structure represented by the following chemical formula (1) and a silane coupling agent,
This aspect of the present invention makes it possible to provide a thermally emissive coating material composition without any thermally emissive filler. In the composition, a straight alkyl is flexible enough to be capable of having various conformations. Thus, molecular motions including rotational or vibrational motions of a straight alkyl side chain increase the energy consumption therein and also increase contacts between the side chain and external gas molecules and/or liquid molecules, thereby promoting and improving heat release of a thermally emissive coating.
In the above aspect, the thermally emissive coating material composition preferably contains the silane coupling agent in an amount of 1 to 10% by weight of a sum of the poly-α-olefin and the silane coupling agent.
This feature can increase the reaction rate between the poly-α-olefin and the silane coupling agent.
In the above aspect, R2 in the chemical formula (1) is preferably a straight alkyl with 10 to 15 carbon atoms.
This feature can improve the thermal emissivity of the thermally emissive coating.
Another aspect of the present invention provides a thermally emissive coating comprising the thermally emissive coating material composition of the above aspect, and formed on a surface of a base material.
This aspect of the present invention makes it possible to provide a thermally emissive coating without any thermally emissive filler.
In the above aspect, the thermally emissive coating preferably has a thickness of 15 to 50 μm.
This feature can improve the thermal emissivity of the thermally emissive coating. In the thermally emissive coating, most of the heat release occurs via the straight alkyl side chains located in a surface portion of the thermally emissive coating. Thus, the greater the ratio of the surface area to the volume of the thermally emissive coating has, the greater the thermal emissivity thereof becomes.
In the above aspect, the base material preferably includes aluminum.
This feature enables the thermally emissive coating to be adhered to the base material in a stable manner
In the above aspects, the thermally emissive coating preferably includes a thermally emissive filler formed of inorganic particles in an amount of 0.1% by weight or less. Also, preferably, the thermally emissive coating is free of any thermally emissive filler formed of inorganic particles.
This feature can improve the thermal emissivity of the thermally emissive coating. The thermally emissive fillers located in a surface portion can prevent molecular motions of the straight alkyl side chains, which leads to a decrease in the thermal emissivity of the thermally emissive coating.
Yet another aspect of the present invention provides a coating forming method for forming a thermally emissive coating on a base material comprising: a first step of applying a solution containing a poly-α-olefin having a structure represented by the following chemical formula (1) and a silane coupling agent; and a second step of heating the base material, on which the solution has been applied, at 100° C. to 150° C. subsequent to the first step,
As can be appreciated from the foregoing, the present invention can provide a thermally emissive coating material composition, a thermally emissive coating and a coating forming method without any thermally emissive filler.
Embodiments of a thermally emissive coating material composition, a thermally emissive coating and a coating forming method therefor according to the present invention are described in the following.
(Thermally Emissive Coating Material Composition)
A thermally emissive coating material composition is a composition included in a thermally emissive coating, and contains a poly-α-olefin having a structure represented by the following chemical formula (1) and a silane coupling agent,
The poly-α-olefin having the structure represented by the chemical formula (1) can be produced by the polymerization reaction of α-olefins having 7 to 22 carbon atoms. By using an a-olefin having a methyl group side chain at the β position, it is possible to produce a poly-α-olefin having a structure represented by the chemical formula (1) in which R1 is a methyl group.
The silane coupling agent has a structure represented by a general formula X—Si—Y3, where X is an organic group and Y is an alkoxy group with 1 to 3 carbon atoms. Examples of the organic group include a vinyl group, an epoxy group, a methacryl group, an acryl group, an amino group, and a mercapto group. Examples of the alkoxy group include a methoxy group, an ethoxy group, a dimethoxy group, and a diethoxy group. An alkylene group with 1 to 6 carbon atoms may be interposed between X and Si. In some cases, one alkoxy group in Y may be changed to a methyl group. Examples of the silane coupling agent includes vinyl trimethoxysilane, vinyl triethoxysilane, 2-(3,4-epoxycyclohexyl) ethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 3-mercaptopropyltrimethoxy silane.
The content of the silane coupling agent is 1 to 10% by weight, preferably 1 to 5% by weight of a sum of the poly-α-olefin and the silane coupling agent. In cases where the silane coupling agent was vinyltrimethoxysilane, R1 of the poly-α-olefin was hydrogen, and R2 was a linear alkyl group with 5 to 20 carbon atoms, when the content of the silane coupling agent was 5 to 10% by weight, the reaction rate between the poly-α-olefin and the silane coupling agent was 90% or more, and when the content of the silane coupling agent was 1 to 4% by weight, the reaction rate between the poly-α-olefin and the silane coupling agent was 98% or more.
(Thermally Emissive Coating Material)
A thermally emissive coating material includes the thermally emissive coating material composition containing a poly-α-olefin and a silane coupling agent as described above and a solvent which dissolves the thermally emissive coating material composition, and is prepared in a liquid form. The solvent is preferably a volatile organic solvent, and non-limiting examples of the solvent include: ketones such as acetone and methyl ethyl ketone; ester acetates such as methyl acetate, ethyl acetate, and propyl acetate; carbon hydrides such as n-hexane, cyclohexane, methylcyclohexane and n-heptane; aromatic hydrocarbons such as toluene, xylene, and benzene; and ethers such as ethyleneglycol monobutyl ether, ethylene glycol monophenyl ether, and ethylene glycol dimethyl ether. The thermally emissive coating material may further contain other ingredients such as pigments, pigment dispersants, leveling agents, antifoaming agents, and thickening agents.
(Thermally Emissive Coating)
A thermally emissive coating is a coating formed on a surface of a base material and includes the above-described thermally emissive coating material composition. The base material may be a housing, a tube or a core of a heat exchanger, for example. In this case, the heat exchanger may be, for example, an intercooler or a radiator of a vehicle. The base material is preferably formed of iron, aluminum, or alloys thereof.
In the thermally emissive coating, a poly-α-olefin having the structure represented by the chemical formula (1) is bonded to a base material via a silane coupling agent. The silane coupling agent is bonded to the base material through hydrolysis which changes its alkoxy group to a hydroxyl group, which, in turn, forms a hydrogen bond with a hydroxyl group on a surface of iron or aluminum. The silane coupling agent binds to the poly-α-olefin at its organic group. For example, the silane coupling agent is substituted for R2 in the chemical formula (1), and binds to a carbon in the main chain of the poly-α-olefin at its organic group. Preferably, the thermally emissive coating has a thickness of 15 μm to 50 μm.
The thermally emissive coating includes a thermally emissive filler formed of inorganic particles in an amount to 0.1% by weight or less. Preferably, the thermally emissive coating is free of any thermally emissive filler formed of inorganic particles. The thermally emissive filler may be formed of particles of a filler material such as carbon black, zinc oxide, aluminum nitride, silicon oxide, calcium fluoride, boron nitride, quartz, kaolin, aluminum hydroxide, bentonite, talc, salicide, forsterite, mica, cordierite, or boron nitride.
The poly-α-olefin forming the thermally emissive coating has a straight alkyl side chain, which is flexible enough to be capable of having various conformations. Thus, it is considered that molecular motions including rotational or vibrational motions of a side chain increase the energy consumption therein and also increase contacts between the side chain and external gas molecules and/or liquid molecules, thereby improving the thermal emissivity of a thermally emissive coating. The side chain is preferably a straight alkyl due to the ease of molecular motions. It is considered that, when a side change includes a polar group, a double bond, a triple bond or some other types of groups or bonds, molecular motions of the side chain are prevented, leading to a decrease in the thermal emissivity of a thermally emissive coating.
(Coating Forming Method)
A first coating forming method includes the first step of applying the above-described thermally emissive coating material to a surface of a base material. Methods of applying include spraying, dipping coating, brush coating, roller coating and any other suitable application technique. The first coating forming method further includes the next step of heating the base material with the thermally emissive coating material applied thereon at 100 to 150° C. for 20 to 40 minutes. This step causes the poly-α-olefin to be bonded to the surface of the base material via the silane coupling agent, and allows the solvent to volatilize. As a result, the thermally emissive coating is formed on the surface of base material.
Several thermally emissive coating material compositions were prepared where the compositions have the structure represented by the chemical formula (1) where R1 was hydrogen and R2 were alkyls with different numbers of carbon atoms. Vinyltrimethoxysilane was used as a silane coupling agent. Each poly-α-olefin and the silane coupling agent were diluted with ethyleneglycol monobutyl ether to produce a corresponding thermally emissive coating material. The content of the silane coupling agent was 5% by weight of a sum of each poly-α-olefin and the silane coupling agent. The sum concentration of each poly-α-olefin and the silane coupling agent was 5% by weight of the ethyleneglycol monobutyl ether. As a substrate (base material), an aluminum plate (A1050, 150 mm length, 70 mm width and 0 8 mm thickness) was used. Each thermally emissive coating material was applied to a major surface of the substrate by air-spraying a proper amount of the thermally emissive coating material onto the surface of the substrate. Then, in a heating oven, the substrate with the applied thermally emissive coating material was heated at 120° C. for 30 minutes. This heating step caused each poly-α-olefin to be bended to the surface of the substrate via the silane coupling agent, and also caused ethyleneglycol monobutyl ether to volatilize, thereby forming a thermally emissive coating on the surface of the substrate. The thickness of a thermally emissive coating measured after heating was determined as the thickness of the thermally emissive coating. The thickness of a thermally emissive coating can be adjusted by the quantity of thermally emissive coating material to be air-sprayed.
(Thermal Emissivity Testing)
The thermal emissivity of each thermally emissive coating was assessed by the following thermal emissivity testing. As shown in
(Effect of Coating Thickness on Thermal Emissivity)
Poly-α-olefins having the structure represented by the chemical formula (1) where R1 was hydrogen and R2 was alkyls with 13 carbon atoms was used to prepare several thermally emissive coatings having different thicknesses by spraying different quantities of the thermally emissive coating material onto substrates. The thicknesses of the formed thermally emissive coatings were 15 μm, 45 μm, and 78 μm. The thermal emissivity testing was conducted on each of the substrates with the respective thermally emissive coatings having their different thicknesses.
(Effect of Side Chain on Thermal Emissivity)
Poly-α-olefins having the structure represented by the chemical formula (1) where R1 was hydrogen and R2 was alkyls with 8, 13, and 17 carbon atoms were used to prepare respective thermally emissive coatings each having a thickness of 20 μm. The thermal emissivity testing was conducted on each of the substrates with the respective thermally emissive coatings.
(Effect of Thermally Emissive Filler on Thermal Emissivity of Thermally Emissive Coating)
A poly-α-olefin having the structure represented by the chemical formula (1) where R2 was alkyls with 13 carbon atoms was used to prepare a thermally emissive coating material of this example In addition, a thermally emissive coating material of a comparative example was prepared by suspending carbon black (particle size 3 μm) as a thermally emissive filler at a concentration of 0.5% by weight. The thermally emissive coating material of the comparative example was the same as the thermally emissive coating material of the example except that it included a thermally emissive filler. The thermally emissive coating materials of the example and the comparative example were used to prepare respective thermally emissive coatings both having a thickness of 20 μm. The thermal emissivity testing was conducted on each of the substrates with the thermally emissive coatings of the example and the comparative example, respectively.
The results of thermal emissivity testing confirmed that the thermally emissive coating (without any thermally emissive filler) of the example had a higher thermal emissivity than the thermally emissive coating (with the thermally emissive filler) of the comparative example. It is considered that the density of straight alkyl side chains in a surface portion of the thermally emissive coating decreased due to the exposure of the thermally emissive filler to the surface. It is also considered that the thermally emissive filler prevented molecular motions of side chains consisting of a straight alkyl in the surface portion of the thermally emissive coating. As a result, the thermally emissive coating without any thermally emissive filler exhibited the increased thermal emissivity compared to the thermally emissive coating including the thermally emissive filler.
Number | Date | Country | Kind |
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2017-203110 | Oct 2017 | JP | national |