Patent Application
20240239088
The present invention relates to a heat-sealable laminated film in which a heat-sealable layer (hereinafter, sometimes referred to as a “layer B”) is provided on each of both surfaces of a substrate layer (hereinafter, sometimes referred to as a “layer A”), and a roll obtained by rolling the heat-sealable laminated film.
A heat-sealable film or sheet is a laminated body in which a heat-sealable layer is provided on the outermost surface of at least one side of a substrate, and is used for various applications for purposes of packaging and reinforcing and the like in a method in which a heat-sealable layer is bonded to an adherend made of a resin or a metal. The substrate is selected according to the purposes, but a resin substrate is often used, and an appropriate resin is selected according to required characteristics.
In order to obtain an excellent adhesion force to the adherend, not only an adhesion force between the adherend and the heat-sealable layer but also a high adhesion force between the substrate and the heat-sealable layer is required. This is because a region having the weakest adhesion would be broken or peeled off against an external stress.
In general, in order to obtain an excellent adhesion force between a substrate and a functional layer such as a heat-sealable layer, a method is known, in which the surface of the substrate is activated by a corona treatment or a plasma treatment or the like, an easily adhesive layer is provided on the surface of the substrate, or an intermediate layer is provided between the substrate and the heat-sealable layer (Patent Documents 1 and 2).
When adhesion between a heat-sealable layer and a substrate is high, a method is known, in which resins constituting both the heat-sealable layer and the substrate are co-extruded to produce a laminated body in which both the heat-sealable layer and the substrate are laminated so as to be in direct contact with each other (Patent Documents 3 and 4).
Furthermore, there is also known a heat-sealable laminated film in which a 4-methyl-1-pentene-based polymer or a 4-methyl-1-pentene-based copolymer is used for a substrate layer for the purpose of enhancing the heat resistance of the substrate layer, and other resin component is contained in the substrate layer in order to enhance the adhesion force of the substrate layer.
For example, Patent Document 5 proposes a battery member film including a substrate layer composed of a resin composition (X) between two sealable layers composed of a modified polyolefin. The resin composition (X) contains a 4-methyl-1-pentene-based polymer (A) and polypropylene (C), and the content of the polymer (A) is 0.5% by mass or more and 50% by mass or less.
Patent Document 6 proposes a laminated film for tab lead in which a heat-resistant resin layer (C) is provided between a heat-sealable resin layer (A) containing a modified polypropylene-based resin or the like and a similar heat-sealable resin layer (B), and the heat-resistant resin layer (C) contains a copolymer of 4-methyl-1-pentene and α-olefin and an α-olefin-based resin (1) having a melting point of 30° C. to 110° C. The content of the copolymer is 40 parts by weight or more and 90 parts by weight or less.
However, in the invention of Patent Document 5, it is necessary to set the content of the polypropylene (C) contained in the substrate layer to a certain value or more from the viewpoint of the necessity of securing the adhesion force between the substrate layer and the heat-sealable layer, and therefore the heat resistance and mechanical properties of the substrate layer cannot be said to be sufficient when heat sealing is performed.
In the invention of Patent Document 6, the resin composition of the heat-sealable resin layer is general, and therefore when a 4-methyl-1-pentene-based copolymer having a melting point of 230° C. or higher is used for the substrate layer, and a 4-methyl-1-pentene-based copolymer having a melting point of 200° C. or lower is not used in combination (HR-4,5 used in Examples), the adhesive strength (adhesion force) is insufficient as in Comparative Example 2 using HR-8. That is, it is difficult to simultaneously improve the heat resistance, mechanical properties, and adhesion force of the substrate layer.
Therefore, an object of the present invention is to provide a heat-sealable laminated film which has a high adhesion force at a laminated interface and has a good bonded state when being heat-sealed, and a roll obtained by rolling the heat-sealable laminated film.
As a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved by co-extruding a substrate layer containing a polymethylpentene resin and a heat-sealable layer containing a heat-sealable polyolefin and a copolymer of 4-methyl-1-pentene and other α-olefin, and have completed the present invention.
That is, the present invention includes the following contents.
2≤tA/tB≤5 (1).
According to the present invention, it is possible to provide a heat-sealable laminated film which has a high adhesion force at a laminated interface and has a good bonded state when being heat-sealed, and a roll obtained by rolling the heat-sealable laminated film.
Details of the reason are unknown, but it is considered as follows. When the layer A mainly composed of the polymer A1 mainly composed of a constitutional unit derived from 4-methyl-1-pentene is a film solidified once, the degree of crystallinity of the layer A tends to be high, and therefore the layer A has low surface energy, which makes it difficult to sufficiently wet the heat-sealable resin layer and to diffuse the heat-sealable layer B into the layer A, resulting in difficult adhesion.
However, when the layer A and the layer B are in a molten state, the components having high affinity and contained in the layer A and the layer B can be diffused with each other at the interface to form close contact. Therefore, by co-extruding the layer A and the layer B and laminating the layer A and the layer B in a molten state, a high adhesion force can be developed between the respective layers. Furthermore, the heat-sealable layer B exhibits a good adhesion force when being bonded to a metal or the like, and therefore the durability of the laminated film in the initial stage and under a moist-heat environment can be enhanced. Since the polymer A1 has a small amount of copolymerization components, the degree of crystallinity of the layer A can be increased, and therefore the mechanical properties of the layer A can be improved even in an un-stretched form. When the heat-sealable layer B is heat-sealed, the film thickness deformation rate of the layer A can be reduced. In addition, the layer A is not stretched, and therefore the in-plane thermal deformation rate of the layer A can also be reduced. As a result, the bonded state of the heat-sealable laminated film and an adherend becomes favorable.
Hereinafter, the present invention will be described in detail. For convenience of description, the formation direction of a film may be referred to as a mechanical axis direction, a vertical direction, a machine direction or an MD direction, and a direction perpendicular to the film formation direction and a thickness direction may be referred to as a transverse direction, a lateral direction, or a TD direction. Various physical properties and the like described in the present specification are specifically measured by methods described in Examples.
A heat-sealable laminated film of the present invention is a heat-sealable laminated film including a layer B, a layer A, and a layer B laminated by co-extrusion in this order. That is, the heat-sealable laminated film may include the layer A as a substrate layer and the layer B as a heat-sealable layer in the order of layer B, the layer A, and the layer B.
For this reason, the heat-sealable laminated film may include other layers. For example, a protective film, a release film, or a cover film or the like may be provided on the surface side of the layer B, or an adherend may be thermally bonded to one surface in advance.
In the heat-sealable laminated film, the layer B, the layer A, and the layer B may be directly laminated by co-extrusion, but a state where components contained in the layers are diffused with each other and a state where a concentration gradient occurs in components contained in the layer B are also assumed as the states of the layers. In particular, even when the amount of a copolymer B2 contained in the layer B is relatively small, an effect of improving an adhesion force is large, and therefore a concentration gradient is presumed to occur so that the concentration of the copolymer B2 increases on the layer A side.
The specification of “laminated by co-extrusion” in the present invention specifies the structure of an object by a producing method, but it is impossible or substantially impractical to directly specify the object by its structure or characteristics as follows.
It is apparent that adhesion at a laminated interface in the case of producing a three-layer laminated film by co-extrusion is different from that in the case of thermally laminating other two layers on a previously produced substrate film, and thus the three-layer laminated film has a microstructural difference. That is, when molecules at the laminated interfaces are microstructurally viewed, it is considered that different states where components of the layers are diffused and infiltrated from each other are present, and thus the laminated interfaces have different adhesions. However, since the difference between the diffusion states is a degree difference, it is difficult to structurally specify the difference between the states.
Therefore, it is not possible to find words specifying a structure or characteristics relating to a difference from the conventional technique, and it is also impossible or impractical to analyze and specify such a structure or characteristics on the basis of measurement. Therefore, in the present invention, it is impossible or substantially impractical to directly specify the object by its structure or characteristics at the time of filing.
Hereinafter, the configuration of the heat-sealable laminated film of the present invention will be described.
A thermoplastic resin contained in a resin composition constituting the layer A as the substrate layer can be selected according to characteristics required for the substrate layer in the intended application, but in order to have the durability of the substrate layer itself in a severe moist-heat environment, it is preferable that the thermoplastic resin does not have a functional group that serves as a reaction point of water molecules, and has a high melting point for withstanding heat during bonding and heat due to the environment.
In the present invention, from such a viewpoint, a polymer A1 containing 90 mol % or more and 100 mol % or less of a constitutional unit derived from 4-methyl-1-pentene with respect to all constitutional units is contained as a main component of the resin composition constituting the layer A.
The layer A may contain 100 to 70% by mass of the polymer A1, but from the viewpoint of reducing the film thickness deformation rate and in-plane thermal deformation rate of the layer A, the layer A preferably contains 100 to 80% by mass of the polymer A1, more preferably 100 to 90% by mass, and most preferably 100% by mass. That is, the layer A may contain 0 to 30% by mass of other resin A2, but for the same reason, the layer A preferably contains 0 to 20% by mass of the resin A2, and more preferably 0 to 10% by mass. It is most preferable that the other resin A2 is not contained in the layer A. When the content is within such a range, an effect of improving heat resistance by a 4-methyl-1-pentene-based polymer is easily obtained, and a hard film utilizing a high crystallization rate is easily obtained.
Meanwhile, when the affinity of the layer A itself as the substrate layer for the heat-sealable layer is enhanced, an adhesion force between both the layers can be further enhanced. From such a viewpoint, the content of the polymer A1 is preferably 95 to 75% by mass, and more preferably 90 to 80% by mass. That is, the layer A may contain 0 to 30% by mass of the other resin A2, but for the same reason, the layer A preferably contains 5 to 25% by mass of the resin A2, and more preferably 10 to 20% by mass. When the content is within such a range, an adhesion force between the layer A and the heat-sealable layer can be further enhanced while an effect of improving heat resistance by the polymer A1 is maintained to some extent. That is, from the relationship of the volume ratio between the polymer A1 and the other resin A2, it is easy to secure sufficient adhesion using the polymer A1 as a matrix.
When the melting point of the substrate layer is taken as TmS and the melting point of a resin constituting a heat-sealable layer described later is taken as TmHS, and a difference therebetween is defined as ΔT (=TmS−TmHS), TmS and TmHS are combined so that ΔT is preferably in a range of 0 to 120° C., and more preferably 10 to 100° C. By setting ΔT to 0° C. or higher, for example, the substrate layer can be prevented from being first melted by heat applied during bonding. By setting ΔT to 120° C. or lower, it is possible to suppress the occurrence of lamination mottle to perform stable production without excessively increasing the difference in melt viscosity during melting by an extruder and laminating in the thickness direction. From such a viewpoint, ΔT is more preferably 20° C. to 90° C., and particularly preferably 40° C. to 80° C. The melting point TmS can also be regarded as the melting point TmA1 of the polymer A1 which is the main component of the layer A.
In order to obtain strength required as the substrate layer in providing the heat-sealable layer, the thickness of the layer A may be 20 μm or more, and is preferably 25 μm or more, more preferably 35 μm or more, and still more preferably 45 μm or more. The thickness of the layer A is preferably 300 μm or less, more preferably 270 μm or less, and still more preferably 250 μm or less. In addition, the thickness of the layer A may be 150 μm or less or 130 μm or less.
The polymer A1 contains 90 mol % or more and 100 mol % or less of a constitutional unit derived from 4-methyl-1-pentene with respect to all constitutional units. The polymer A1 preferably contains 92 mol % or more and 100 mol % or less of the constitutional unit, and more preferably contains 95 mol % or more and 100 mol % or less of the constitutional unit.
The polymer A1 may further contain 0 mol % or more and 10 mol % or less of a constitutional unit derived from an α-olefin other than 4-methyl-1-pentene with respect to all the constitutional units. The polymer A1 preferably contains 0 mol % or more and 8 mol % or less, and more preferably 0 mol % or more and 5 mol % or less of the constitutional unit.
That is, examples of the polymer A1 include, in addition to a homopolymer obtained by polymerizing 4-methyl-1-pentene as a monomer, a copolymer obtained by copolymerizing 90 mol % or more of 4-methyl-1-pentene as a monomer and 10 mol % or less of an α-olefin other than 4-methyl-1-pentene as a monomer.
When the polymer A1 is the copolymer, the monomer to be copolymerized is preferably an α-olefin having 2 or more and 20 or less carbon atoms. Examples of the α-olefin to be copolymerized include one or more of ethylene, propylene, 1-butene, 1-hexene, 1-octene, 1-decene, 1-tetradecene, and 1-octadecene and the like.
The melting point TmA1 of the polymer A1 is preferably 230° C. or higher. When a 4-methyl-1-pentene-based copolymer having a high copolymerization ratio of other monomer is used, the melting point decreases, but in this case, the crystallization rate decreases, and the rigidity of the substrate layer decreases, and therefore the film thickness deformation rate of the layer A during metal bonding at a temperature equal to or higher than the melting point of the heat-sealable layer described later increases. From such a viewpoint, TmA1 is preferably 231° C. or higher, more preferably 232° C. or higher, and still more preferably 233° C. or higher. The upper limit of TmA1 is not limited, but is preferably 250° C. or lower, and more preferably 245° C. or lower because a methyl-1-pentene-based polymer or a 4-methyl-1-pentene-based copolymer having a lower copolymerization ratio is used, or the melting point TmA1 can be increased by controlling tacticity.
In the case of the substrate layer using the polymer A1, TmS is improved as compared with general polypropylene, and therefore it is easy to secure ΔT. However, the substrate layer has low surface energy and a high crystallization rate, and therefore the substrate layer has low affinity with the heat-sealable layer, which makes it difficult to increase an adhesion force. Therefore, it is particularly effective to provide a heat-sealable layer containing a copolymer B2 containing 60 mol % or more and 89 mol % or less of a constitutional unit derived from 4-methyl-1-pentene by co-extrusion. It is preferable to mix a polyolefin or the like as the other resin A2 in the layer A.
The layer A may contain other resin A2 other than the polymer A1. The other resin A2 may have appropriate compatibility and dispersibility with the polymer A1, and examples thereof include polyolefins (including modified polyolefins) and copolymers of 4-methyl-1-pentene and α-olefin other than the polymer A1 (including the copolymer B2), and polyolefins are preferred. The polyolefin is excellent in that it does not have a functional group that serves as a reaction point of water molecules, and the dispersibility of the resin A2 in the polymer A1 is improved by using the polyolefin.
Examples of the polyolefin resin include the following polyolefin resins or modified polyolefin resins. In the present specification, the term “modified” refers to one containing a constitutional unit different from a constitutional unit such as a polyolefin in the same molecule.
Examples of the polyolefin resin include polyolefin resins such as high density polyethylene, low density polyethylene, ultra-high molecular weight polyethylene, linear low density polyethylene, polypropylene, and poly(1-butene). Other examples thereof include a blend of these polyolefin-based resins or a copolymer containing these polyolefin-based resins as a constituent component. Among these polyolefin-based resins, polypropylene is particularly preferable.
In particular, the same polyolefin resin or modified polyolefin resin can be used when mixed with the 4-methyl-1-pentene-based polymer (polymer A1) by melt kneading, but it is preferable to use a polypropylene resin obtained by copolymerizing 4-methyl-1-pentene or a maleic acid-modified polypropylene resin from the viewpoint of compatibility and the like. As a modification method, graft modification or copolymerization can be used.
Specific examples of the modified polyolefin resin include maleic acid anhydride-modified polyethylene, maleic acid anhydride-modified polypropylene, an ethylene/acrylic acid copolymer, an ethylene/methacrylic acid copolymer, ones wherein a part of or all of the carboxylic acid moiety/moieties in the above copolymer is/are made into a salt with sodium, lithium, potassium, zinc or calcium, an ethylene/methyl acrylate copolymer, an ethylene/ethyl acrylate copolymer, an ethylene/methyl methacrylate copolymer, an ethylene/ethyl methacrylate copolymer, an ethylene/ethyl acrylate-g-maleic acid anhydride copolymer (here, “-g-” stands for graft; hereinafter, it stands for the same), an ethylene/methyl methacrylate-g-maleic acid anhydride copolymer, an ethylene/propylene-g-maleic acid anhydride copolymer, an ethylene/butene-1-g-maleic acid anhydride copolymer, an ethylene/propylene/1,4-hexadiene-g-maleic acid anhydride copolymer, an ethylene/propylene/dicyclopentadiene-g-maleic acid anhydride copolymer, an ethylene/propylene/2,5-norbornadiene-g-maleic acid anhydride copolymer, a hydrogenated styrene/butadiene/styrene-g-maleic acid anhydride copolymer, and a hydrogenated styrene/isoprene/styrene-g-maleic acid anhydride copolymer. Among them, maleic acid-modified polypropylene or an ethylene-propylene copolymer or the like is particularly preferable.
Examples of the copolymer of 4-methyl-1-pentene and α-olefin other than the polymer A1 (including the copolymer B2) include a copolymer containing 10 mol % or more and 89 mol % or less of a constitutional unit derived from 4-methyl-1-pentene and 11 mol % or more and 90 mol % or less of a constitutional unit derived from an α-olefin other than 4-methyl-1-pentene.
The α-olefin as the constituent component of the copolymer is preferably an α-olefin having 2 or more and 20 or less carbon atoms, and examples thereof include ethylene, propylene, 1-butene, 1-hexene, 1-octene, 1-decene, 1-tetradecene, and 1-octadecene. The α-olefins may be used alone or in combination of two or more thereof.
The layer A can contain an appropriate filler as necessary for the purpose of improving lubricity, and the like as long as the object of the present invention is not impaired. As the filler, those conventionally known as a lubricity imparting agent for a film or a sheet can be used. Examples thereof include calcium carbonate, calcium oxide, aluminum oxide, kaolin, silicon oxide, zinc oxide, carbon black, silicon carbide, tin oxide, crosslinked acrylic resin particles, crosslinked polystyrene resin particles, melamine resin particles, and crosslinked silicon resin particles. Furthermore, a coloring agent, an anti-static agent, an antioxidant, an organic lubricant, and a catalyst and the like can also be appropriately added to the layer A. In particular, in consideration of use in a moist-heat environment, an additive having low elutability can be preferably used.
Examples of the other optional components include various additives conventionally used for the 4-methyl-1-pentene-based polymer and the like. Examples of the additives include a stabilizer, an impact improver, a flame retardant, a release agent, a sliding improver, a coloring agent, a plasticizer, and a crystal nucleating agent.
The other optional component can be used in an amount of, for example, 0.001 to 10% by mass in the layer A.
The layer B which is the heat-sealable layer contains 99 to 30% by mass of a heat-sealable polyolefin B1, and from the viewpoint of moist-heat durability and the balance between a bonding force to an adherend and an interlayer adhesion force, the layer B preferably contains 98 to 35% by mass, more preferably 95 to 40% by mass, and still more preferably 90 to 45% by mass of the heat-sealable polyolefin B1. In the present specification, the term “heat-sealable” refers to a property of being sealable to an adherend by heating, and preferably refers to a property of being sealable to SUS316 which is a metal by heating.
The layer B contains 1 to 70% by mass of a copolymer B2 containing 60 mol % or more and 89 mol % or less of a constitutional unit derived from 4-methyl-1-pentene and 11 mol % or more and 40 mol % or less of a constitutional unit derived from an α-olefin having 2 or more and 20 or less carbon atoms other than 4-methyl-1-pentene. From the viewpoint of moist-heat durability and the balance between a bonding force to an adherend and an interlayer adhesion force, the layer B preferably contains 2 to 65% by mass, more preferably 5 to 60% by mass, and still more preferably 10 to 55% by mass of the copolymer B2.
The layer B may contain other resin B3. In this case, the layer B preferably contains 0 to 10% by mass of the resin B3, and more preferably 0 to 5% by mass of the resin B3. It is most preferable that the layer B does not contain the resin B3.
The layers B provided on both surfaces of the layer A may have the same composition or different compositions, but for example, when adherends made of the same material are thermally bonded to each other, it is preferable to provide the heat-sealable layers having the same composition on both the surfaces. The thicknesses of the heat-sealable layers may be the same or different from each other, but in the case as described above, it is preferable to provide the heat-sealable layers having the same thickness on both outermost surfaces.
The thickness of the layer B is preferably 100 μm or less. As for the adhesion between the heat-sealable layer and the substrate layer provided by co-extrusion, a strong adhesion force can be obtained, but for example, in the case of using an acid-modified polyolefin resin, an acid-modified portion has a functional group affected by moisture, and therefore when the thickness of the layer B is unnecessarily increased, the heat-sealable layer tends to be brittle and broken in a severe moist-heat environment. From such a viewpoint, the thickness of the layer B is preferably 90 μm or less, more preferably 80 μm or less, still more preferably 75 μm or less, and particularly preferably 60 μm or less. Since a mechanical relaxation function in the thickness direction is weakened as the heat-sealable layer even if the heat-sealable layer is too thin, the thickness of the heat-sealable layer is preferably, for example, 10 μm or more, more preferably 15 μm or more, and particularly preferably 20 μm or more.
The layers B are provided on both the surfaces of the substrate layer by co-extrusion, and therefore the states of the laminated interfaces of both the surfaces of the substrate layer can be the same. Such states are more preferable from the viewpoint of enhancing the adhesion of the laminated interfaces of both the surfaces.
As a heat-sealable polyolefin B1, an unmodified polyolefin-based resin can be used, but a modified polyolefin is preferable, and a modified polyolefin containing polypropylene is particularly preferable.
Examples of the unmodified polyolefin-based resin include homopolymers and copolymers of an olefin having 2 to 8 carbon atoms, and copolymers of an olefin having 2 to 8 carbon atoms and other monomers. Specifically, for example, polyethylenes such as high density polyethylene (HDPE), low density polyethylene (LDPE), and a linear low density polyethylene resin, polypropylene, polyisobutylene, poly(1-butene), polyvinylcyclohexane, polystyrene, poly(p-methylstyrene), poly(α-methylstyrene), an ethylene-propylene block copolymer, an ethylene-propylene random copolymer, an ethylene-butene-1 copolymer, an ethylene-4-methyl-1-pentene copolymer, an ethylene-butene-propylene terpolymer, an ethylene-propylene diene rubber, an α-olefin copolymer such as an ethylene-hexene copolymer, an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid copolymer, an ethylene-methyl methacrylate copolymer, an ethylene-vinyl acetate-methyl methacrylate copolymer, a polybutadiene-styrene copolymer, a polybutadiene-maleic anhydride copolymer and an ionomer resin. Furthermore, chlorinated polyolefins obtained by chlorinating these polyolefins can also be used.
As described above, it is possible to use various types of heat-sealable polyolefin resins B1, and it is particularly preferable to use a modified polyolefin resin obtained by introducing various functional groups (for example, a carboxyl group and a hydroxyl group and the like) into a polyolefin resin.
Furthermore, among these modified polyolefin resins, a modified polyolefin resin having an acid value of 1 to 200 mgKOH/g (also referred to as an acid-modified polyolefin resin) and/or a modified polyolefin resin having a hydroxyl value of 1 to 200 mgKOH/g (also referred to as a hydroxyl group-modified polyolefin resin) can be used because adhesion to a metal layer is further improved and electrolyte resistance is excellent.
An acid-modified polyolefin resin is a polyolefin resin having a carboxyl group or a carboxylic anhydride group in the molecule, and is synthesized by modifying a polyolefin with an unsaturated carboxylic acid or a derivative thereof. As this modification method, graft modification or copolymerization can be used.
The acid-modified polyolefin resin is a graft-modified polyolefin obtained by graft-modifying or copolymerizing at least one polymerizable ethylenically unsaturated carboxylic acid or a derivative thereof with a pre-modification polyolefin resin.
Examples of the pre-modification polyolefin resin include the above-mentioned polyolefin resins, and among them, a homopolymer of propylene, a copolymer of propylene and α-olefin, a homopolymer of ethylene, and a copolymer of ethylene and α-olefin, and the like are preferable. These can be used alone or in combination of two or more.
Examples of the acid-modified polyolefin resin include maleic anhydride-modified polypropylene, an ethylene-(meth)acrylic acid copolymer, an ethylene-acrylic acid ester-maleic anhydride terpolymer, or an ethylene-methacrylic acid ester-maleic anhydride terpolymer. Specifically, the acid-modified polyolefin resin is commercially available as “MODIC” manufactured by Mitsubishi Chemical Corporation, “ADMER” and “UNISTOLE” manufactured by Mitsui Chemicals, Inc., “HARDLEN” manufactured by Toyobo Co., Ltd., “UMEX” manufactured by Sanyo Chemical, Ltd., “REXPEARL EEA” and “REXPEARL ET” manufactured by Japan Polyethylene Corporation, “PRIMACOL” manufactured by Dow Chemical, “NUCLEL” manufactured by Du Pont Mitsui Polychemicals Co., Ltd., and “BONDINE” manufactured by Arkema.
A hydroxyl group-modified polyolefin resin is a polyolefin resin having a hydroxyl group in the molecule, and is synthesized by graft-modifying or copolymerizing a polyolefin with a hydroxyl group-containing (meth)acrylic acid ester or a hydroxyl group-containing vinyl ether described later. Examples of the hydroxyl group-containing (meth)acrylic acid ester include hydroxyethyl (meth)acrylate; hydroxypropyl (meth)acrylate, glycerol (meth)acrylate; lactone-modified hydroxyethyl (meth)acrylate, polyethylene glycol (meth)acrylate, and polypropylene glycol (meth)acrylate, and examples of the hydroxyl group-containing vinyl ether include 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, and 4-hydroxybutyl vinyl ether.
A particularly preferable heat-sealable polyolefin resin is a polyolefin in which the heat-sealable polyolefin B1 contains a modified product modified with an acid anhydride, has an acid anhydride content of 0.1 to 3% by mass, and has an extraction amount of a low molecular weight component having a number average molecular weight of 1000 or less with acetone of less than 1% by mass.
When the anhydride content is 0.1% by mass or more, sufficient adhesion to a metal is easily obtained, and when the anhydride content is 3% by mass or less, sufficient mechanical properties such as rigidity and strength are easily obtained. When the extraction amount of the low molecular weight component is less than 1% by mass, the low molecular weight component is less likely to bleed out to the surface of the heat-sealable layer, and therefore the adhesion is less likely to be inhibited.
The copolymer B2 contains 60 mol % or more and 89 mol % or less of a constitutional unit derived from 4-methyl-1-pentene, and 11 mol % or more and 40 mol % or less of a constitutional unit derived from an α-olefin having 2 or more and 20 or less carbon atoms other than 4-methyl-1-pentene.
From the viewpoint of enhancing the adhesion force between the layer A and the layer B, as compared with the polymer A1, the mole percent of the constitutional unit derived from 4-methyl-1-pentene constituting the copolymer B2 is preferably lower, more preferably lower by 10 mol % or more, and still more preferably lower by 20 mol % or more.
Examples of the α-olefin having 2 or more and 20 or less carbon atoms as the constituent component of the copolymer B2 include ethylene, propylene, 1-butene, 1-hexene, 1-octene, 1-decene, 1-tetradecene, and 1-octadecene. The α-olefin is preferably ethylene, propylene, 1-butene, 1-hexene, 1-octene, or 1-decene, more preferably ethylene, propylene, 1-butene, 1-hexene, or 1-octene, and still more preferably ethylene, propylene, 1-butene, or 1-hexene. The α-olefins may be used alone or in combination of two or more thereof.
In the copolymer B2, the amount of the constitutional unit derived from 4-methyl-1-pentene is 60 mol % or more and 89 mol % or less, preferably 63 mol % or more and 88 mol % or less, more preferably 65 mol % or more and 87 mol % or less, still more preferably 65 mol % or more and 86 mol % or less, and particularly preferably 65 mol % or more and 85 mol % or less. The amount of the constitutional unit derived from the α-olefin having 2 or more and 20 or less carbon atoms other than 4-methyl-1-pentene is 11 mol % or more and 40 mol % or less, preferably 12 mol % or more and 37 mol % or less, more preferably 13 mol % or more and 35 mol % or less, still more preferably 14 mol % or more and 35 mol % or less, and particularly preferably 15 mol % or more and 35 mol % or less. When the amount of the constitutional unit is within the above range, the adhesion force between the layer A and the layer B is more excellent.
The copolymer B2 may be an amorphous copolymer having no melting point, but a melting point TmB2, which is a melting peak temperature measured by a differential scanning calorimeter (DSC), is preferably 199° C. or lower, more preferably 100 to 160° C., and still more preferably 110 to 150° C.
As the copolymer B2, it is particularly preferable to use ABSORTOMERS EP1013 and EP1001 manufactured by Mitsui Chemicals, Inc., and the like.
The layer B may contain 0 to 10% by mass of other resin B3 other than the heat-sealable polyolefin B1 and the copolymer B2. That is, the heat-sealable layer can contain the other resin B3 having appropriate compatibility or dispersibility with the heat-sealable polyolefin B1 and the copolymer B2 as long as the object of the present invention is not impaired.
However, when the amount of the other resin B3 is too large, an effect of the heat-sealable polyolefin B1 and the copolymer B2 is easily reduced. From such a viewpoint, the upper limit of the amount of the resin B3 contained in the heat-sealable layer is preferably 10% by mass, more preferably 5% by mass, and most preferably 0% by mass.
Examples of the resin B3 include polyamide, polyester, polyurethane, a 4-methyl-1-pentene-based polymer (polymer A1), polyolefins other than the polymer A1 and the copolymer B2, an ethylene propylene diene rubber, a fluororubber, and a silicone rubber.
The layer B can be composed of only a resin, but a stabilizer such as a tackifier, an anti-static agent, an antioxidant, a metal deactivator, a dehydrating agent, or an antacid adsorbent, or an additive such as a cross-linking agent, a chain transfer agent, a nucleating agent, a lubricant, a plasticizer, a filler, a reinforcing material, a pigment, a dye, or a flame retardant may be added to the layer B as long as the effect of the present invention is not impaired.
In the heat-sealable laminated film of the present invention, it is preferable that, when a melting peak temperature measured by DSC for the heat-sealable polyolefin B1 (a median value between a minimum value and a maximum value when the heat-sealable polyolefin B1 has a plurality of melting peak temperatures) is taken as a melting point TmB1, the film thickness deformation rate of the layer A when a load of 3 MPa is applied at a temperature of TmB1+30° C. for 10 minutes is 5% or less. When the film thickness deformation rate is 5% or less, the amount of change in dimension in a thickness direction is small due to bonding during thermal bonding, and the volume of shrinkage in the film thickness direction is less likely act in a direction of expanding the inside of the plane, and therefore the change in dimension in the plane tends to be also small. From such a viewpoint, the film thickness deformation rate of the layer A is preferably 3% or less, and more preferably 2% or less. The film thickness deformation rate is preferably as small as possible. The lower limit of the film thickness deformation rate is most preferably 0%, but 1% or more is still usable.
As described above, the volume change of the shrinkage in the film thickness direction acts in the direction of expanding the inside of the plane. However, from the method for producing a heat-sealable laminated film, a film solidified in a state of having a residual stress in the in-plane direction is generally formed, and therefore a shrinkage behavior is generally caused in the in-plane direction. Therefore, the heat-sealable laminated film preferably has an in-plane deformation rate of 4% or less at a temperature of the melting point TmB1+30° C. From such a viewpoint, the in-plane deformation rate is more preferably 3% or less, and particularly preferably 2% or less. The in-plane deformation rate is preferably as small as possible. The lower limit value of the in-plane deformation rate is most preferably 0%, but 1% or more is still usable.
In the heat-sealable laminated film of the present invention, it is preferable that, when the film thickness of the layer A is taken as tA and the film thickness of the layer B is taken as tB, the following formula (1) is satisfied as the ratio of the thicknesses of the layers.
When tA/tB is 5 or less, the total thickness does not become too large, and the sheet is easily cooled during co-extrusion film formation described later, and is easily wound into a roll. When tA/tB is 2 or more, and the heat-sealable layer is melted and bonded to other member, heat is less likely to reach the substrate layer, and the substrate layer is less likely to be affected during bonding. From such a viewpoint, the upper limit of tA/tB is preferably 4.5 or less, more preferably 4.0 or less, and particularly preferably 3.5 or less. The lower limit of tA/tB is preferably 2.2 or more, more preferably 2.4 or more, and particularly preferably 2.5 or more.
Hereinafter, a case where a 4-methyl-1-pentene-based polymer (polymer A1) having a melting point TmA1 of 230° C. or higher is used as a main component of a resin constituting a layer A as a substrate layer will be described in detail as an example.
The heat-sealable laminated film of the present invention can be produced by, for example, kneading of materials constituting layers, co-extrusion of the kneaded product, molding of an un-stretched laminated body, and a heat treatment thereof as necessary, and the like.
A method for mixing and kneading the 4-methyl-1-pentene-based polymer (polymer A1), the resin composed of other polyolefin (other resin A2), and other optional components for forming the layer A is not particularly limited, and for example, a single screw extruder, a twin screw extruder, a pressure kneader, and a Banbury mixer and the like can be used. Among these, a twin screw extruder is particularly preferably used. The operating conditions and the like of the twin screw extruder are different depending on various factors such as the type of the resin containing the polymer A1 and the type and amount of each contained component, and cannot be uniquely determined. For example, the operating temperature may be set to around +40° C. with respect to the melting point. In the screw configuration of the extruder, kneading discs having excellent kneading are preferably incorporated at several positions.
A method for mixing and kneading the heat-sealable polyolefin B1 and the copolymer B2 for forming the layer B is also the same as the kneading method for forming the layer A, but the operating temperature of the extruder may be set to around +100° C. with respect to the melting point of the heat-sealable polyolefin B1.
The resin composition constituting the substrate layer can be melt-extruded into a sheet by co-extrusion together with the heat-sealable layer, and solidified by cooling with a casting drum or the like to obtain a heat-sealable laminated film.
A cooling temperature may be a temperature at which all the layers are sufficiently solidified, but is preferably 20 to 120° C., and more preferably 30 to 100° C., from the viewpoint that excessive cooling causes sheet-like resin floating or the like, which makes efficient cooling difficult.
A heat treatment is performed at TmA1-100 to TmA1-5° C. for 1 to 60 seconds after solidification by cooling as necessary, and therefore the in-plane deformation rate of the heat-sealable laminated film is easily controlled within a predetermined range. As a method for the heat treatment, a roll conveyance type or a floating type may be used, but a floating type is preferable from the viewpoint of allowing relaxation in the in-plane direction and preventing the sticking of the heat-sealable layers on both the surfaces.
The heat-sealable laminated film of the present invention is characterized in that the heat-sealable layer is formed by co-extrusion together with the substrate layer. In the conventional method, the heat-sealable layer may be formed by a method other than the co-extrusion, and in that case, the adhesion force between the heat-sealable layer and the substrate layer becomes insufficient.
In the conventional method, the heat-sealable layer is provided by a dry lamination method or a wet lamination method or the like as a lamination method, and by an extrusion resin coating method, a molten resin coating method, or a coating liquid coating method or the like as a coating method. However, in these methods, it is necessary to laminate the heat-sealable layer in accordance with the substrate layer having a specific width in the transverse direction. Therefore, it is necessary to provide the heat-sealable layer in a separate step after producing the substrate layer once, and furthermore, due to width restriction, there are many restrictions on an area that can be produced per unit time. Therefore, even in consideration of the production process, it is preferable to form the heat-sealable layer together with the substrate layer by co-extrusion.
In the present invention, when the heat-sealable layer is co-extruded, it is preferable to melt and extrude the resin by appropriately adjusting the melting temperature in accordance with the viscosity of the substrate layer. It is preferable to select the type and molecular weight of the heat-sealable polyolefin B1, the type and molecular weight of the copolymer B2, and the other resin B3 so that the melt viscosity of the heat-sealable layer becomes appropriate.
The operating temperature (melting temperature) of the extruder for the heat-sealable layer is preferably TmB1+20° C. to TmB1+120° C., and more preferably TmB1+50° C. to TmB1+100° C., with respect to the melting point TmB1 of the heat-sealable polyolefin B1.
The discharge amount of the melt of the heat-sealable layer from the extruder is appropriately determined according to the thickness ratio with respect to the substrate layer, the thickness of the laminated body, and the line speed and the like.
A roll of the present invention is obtained by winding the heat-sealable laminated film as described above in the machine direction. That is, preferably, the heat-sealable laminated film of the present invention is continuously produced.
The heat-sealable laminated film of the present invention can be used for thermally bonding various adherends. Examples of the adherend include various metals, various resins, fiber-reinforced resins including glass fibers and the like, and ceramics. Examples of the shape of the adherend include a sheet, a film, a flat plate, and a three-dimensional shape having a flat portion and a curved surface portion obtained by bending a flat surface.
Thermal bonding due to the heat-sealable laminated film is performed at a temperature equal to or higher than a temperature at which the heat-sealable layer is softened. In the case of thermal bonding at a temperature at which the substrate layer is thermally deformed, the film can be thermally bonded to an adherend having a more complicated surface shape.
The present invention will be more specifically described by reference to Examples and Comparative Examples. In the present invention, physical properties and the like were measured or evaluated by the following methods. Hereinafter, unless otherwise specified, “part” means “part by mass”, and “%” means “% by mass”.
A film was cut at a low temperature using an ice-embedded microtome to obtain a cross section perpendicular to the surface of the film. The cross section of the film was observed with a stereomicroscope, and a photograph was taken at an appropriate magnification at which the total thickness of the film was one field of view. From this image, the thickness of each layer was measured using a scale. Three cross-section samples prepared independently were measured, and the average value thereof was taken as the layer thickness of a laminated film. A layer thickness constituent ratio tA/tB was calculated with the layer thickness.
10 mg of a resin sample was collected, and subjected to DSC measurement at a temperature rising rate of 10° C./min using a DSC apparatus (Q100 manufactured by TA Instruments). From the obtained chart, the peak top of an endothermic peak was defined as a melting point, and calculated.
A melting peak temperature measured by DSC for a heat-sealable polyolefin B1 in the same manner as in the above (2-1) was taken as a melting point TmB1. However, when the heat-sealable polyolefin B1 had a plurality of melting peak temperatures, a median value between a minimum value and a maximum value was taken as the melting point.
The obtained heat-sealable laminated film was cut into a size of 10 mm×10 mm, and 30 laminated films were installed in a laminated state in a compression creep tester (CP6-L-250 manufactured by A & D Co., Ltd.). A load application treatment was performed in a film thickness direction for 10 minutes under the conditions of 3 MPa and 160° C. (melting point TmB1 (130° C.)+30° C.). At this time, after completion of conditioning to environmental conditions, a time for finally loading a weight equivalent to 3 MPa was set to 0 minute, and measurement was performed for 10 minutes. The thickness of a layer A of the sample on which the load application treatment has been completed was measured by the method described in (1) above, and an amount of displacement from an initial film thickness was calculated. The film thickness deformation rate of the layer A was calculated using the following formula.
A sample was sampled in a size of 200 mm×200 mm in parallel to a machine direction (MD) and a transverse direction (TD) to prepare gauge marks (distance between gauge marks: 100 mm) in the machine direction (MD) and the transverse direction (TD). Thereafter, a treatment was performed for 30 seconds in a thermostatic bath at 160° C. (melting point TmB1 (130° C.)+30° C.) in a state where no tension was applied. The distance between gauge marks was measured, and thermal deformation rates (%) at 160° C. in the machine direction (MD) and the transverse direction (TD) were calculated from a change in the distance between gauge marks based on the distance between gauge marks before a heat treatment.
Adhesion was evaluated using SUS316 as an adherend. For the production of a sample piece, the obtained heat-sealable laminated film was sandwiched between two sheets of SUS316 having a thickness of 0.1 mm and cut into a size of 150 mm×150 mm with a press machine, followed by pressing at 160° C. and a pressure of 5 MPa for 1 minute to perform bonding. The molded sample was cut to a width of 10 mm and a length of 100 mm to obtain a sample piece. From this sample piece, an end portion of an adherend SUS316 of which adhesion was measured was held, and 180º peeling was performed at a peeling rate of 100 mm/min according to JIS-C2151 using a tensile tester (Tensilon UCT-100 manufactured by Orientec Co., Ltd.). Five measurements were performed, and the average value of the maximum values of the respective measurements was evaluated as a peel force according to the following criteria.
In the case of the evaluation results of B and C, peeling occurred between the layer A and a layer B.
The same procedures as in the above (5-1) were carried out except that the SUS316 adherend sample piece (width: 10 mm, length: 100 mm) prepared in the above (5-1) was immersed in water at 121° C. for 48 hours, then left at room temperature for 24 hours, and dried, and evaluation was performed according to the following criteria.
In the case of the evaluation results of B and C, peeling occurred between the layer A and a layer B.
Using acetone evaporated and cooled in a warm water bath at 90° C., Soxhlet extraction was performed for 2 hours to extract a dissolved component, and using the obtained solution, a low molecular weight component having a number average molecular weight of 1000 or less was confirmed by an apparatus (e2695 manufactured by Waters). The extracted amount (% by mass) of the low molecular weight component was determined from the mass of the sample.
A homopolymer PMP of 4-methyl-1-pentene (melting point: 242° C.) was produced as follows.
Into a polymerization container having an internal volume of 1 L and sufficiently purged with nitrogen, 400 ml of 4-methyl-1 pentene, 300 ml of hydrogen, 0.5 mmol of triethylaluminum, and 1.0 mmol of titanium (III) chloride were added and charged, and the inside of the polymerization container was maintained at 60° C. After polymerization for 1 hour, the powder was taken out from the polymerization container, filtered, then washed with hexane, and dried overnight at 80° C. under reduced pressure to obtain a polymer having a yield of 113.9 g.
As a polymer A1 for forming a layer A as a substrate layer, a polymer containing 100% by mass of polymethylpentene (TPX) (DX845 manufactured by Mitsui Chemicals, Inc., 4-methyl-1-pentene copolymer obtained by copolymerizing several mol % of an α-olefin having 10 carbon atoms, melting point: 233° C.) was used, charged into an extruder, and melt-kneaded at a melting temperature of 280° C. 80% by mass of a modified polyolefin resin (HARDLEN M100 manufactured by Toyobo Co., Ltd., melting peak temperatures: 110° C., 130° C., and 150° C., melting point TmB1: 130° C., acid anhydride content: 1% by mass, extraction amount of low molecular weight component: 0.3% by mass) as a heat-sealable polyolefin B1 for forming a layer B as a heat-sealable layer, and 20% by mass of a 4-methyl-1-pentene-based copolymer (EP1013, 4-methyl-1-pentene: 85 mol %, α-olefin having 10 carbon atoms: 15 mol %, manufactured by Mitsui Chemicals, Inc.) as a copolymer B2 were blended in a pellet state. Then, the blend was charged into an extruder, and melt-kneaded at a melting temperature of 230° C.
Each die slit was disposed so as to provide a layer configuration of layer B/layer A/layer B, and co-extrusion was performed so that the layers were in direct contact with each other. Solidification was performed by cooling on a casting drum set at a surface temperature of 60° C. to prepare an un-stretched film. At this time, co-extrusion was performed with the discharge amounts controlled so that the thickness constituent ratio of the un-stretched film was 35:95:35.
The un-stretched film was wound into a roll to obtain a roll of a heat-sealable laminated film. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 1 except that the ratios of a heat-sealable polyolefin B1 and a copolymer B2 for forming a layer B were changed in Example 1 to set each ratio to 50% by mass. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 1 except that a polymer containing 80% by mass of polymethylpentene (DX845 manufactured by Mitsui Chemicals, Inc.) as a polymer A1 for forming a layer A and 20% by mass of a 4-methyl-1-pentene-based copolymer (EP1013 manufactured by Mitsui Chemicals, Inc.) as other resin A2 was used, blended in a pellet state, and then introduced into an extruder in Example 1. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 1 except that the heat-sealable laminated film having a thickness of 268 μm was obtained by changing the discharge amounts of layers B, A, and B in Example 1. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 1 except that a polymer containing 100% by mass of a homopolymer PMP of polymethylpentene (melting point: 242° C.) obtained in Production Example 1 was used as a polymer A1 for forming a layer A in Example 1. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 1 except that a polymer containing 75% by mass of a homopolymer PMP of polymethylpentene (melting point: 242° C.) obtained in Production Example 1 and 25% by mass of a modified polyolefin resin (HARDLEN M100 manufactured by Toyobo Co., Ltd.) as other resin A2 was used as a polymer A1 for forming a layer A in Example 1, blended in a pellet state, and then introduced into an extruder. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 1 except that a polymer containing 80% by mass of a modified polyolefin resin (HARDLEN M100 manufactured by Toyobo Co., Ltd.) as a heat-sealable polyolefin B1 for forming a layer B, and 20% by mass of a 4-methyl-1-pentene-based copolymer (EP1001 manufactured by Mitsui Chemicals, Inc., 4-methyl-1-pentene: 72 mol %, α-olefin: 28 mol %, melting point: none) as a copolymer B2 in Example 1 was used. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 5 except that the ratios of a heat-sealable polyolefin B1 and a copolymer B2 for forming the layer B were changed to set the ratios to 95% by mass and 5% by mass in Example 5, and the discharge amounts of layers B, A, and B were changed to obtain the heat-sealable laminated film having a thickness of 268 μm. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 1 except that, without using a copolymer B2 for forming a layer B in Example 1, a polymer containing 100% by mass of a modified polyolefin resin (HARDLEN M100 manufactured by Toyobo Co., Ltd.) was used as a heat-sealable polyolefin B1, a polymer containing 30% by mass of polymethylpentene (DX845 manufactured by Mitsui Chemicals, Inc.) was used as a polymer A1 for forming a layer A, and a polymer containing 70% by mass of a polypropylene resin (FS2011DG3 manufactured by Sumitomo Chemical Co., Ltd.) was used as other resin A2, and the polymers were blended in a pellet state, and then charged into an extruder. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1. Since an in-plane deformation rate was extremely large, the in-plane deformation rate could not be measured.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 1 except that, without using a copolymer B2 for forming a layer B, a polymer containing 100% by mass of a modified polyolefin resin (HARDLEN M100 manufactured by Toyobo Co., Ltd.) was used as the heat-sealable polyolefin B1 in Example 1. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1. When durable adhesion under a moist-heat environment was measured, peeling occurred between the layer B and a layer A, and therefore the durable adhesion could not be measured.
A roll of a heat-sealable laminated film was obtained in the same manner as in Example 1 except that a polymer containing 80% by mass of a modified polyolefin resin (HARDLEN M100 manufactured by Toyobo Co., Ltd.) and 20% by mass of polymethylpentene (TPX) (DX845 manufactured by Mitsui Chemicals, Inc.) in place of a copolymer B2 was used as a heat-sealable polyolefin B1 for forming a layer B in Example 1. The characteristics of the obtained heat-sealable laminated film were summarized in Table 1. When durable adhesion under a moist-heat environment was measured, peeling occurred between the layer B and a layer A, and therefore the durable adhesion could not be measured.
A film for a substrate layer composed of a layer A and a film for a heat-sealable layer composed of a layer B were separately produced. That is, a polymer containing 100% by mass of polymethylpentene (TPX) (DX845 manufactured by Mitsui Chemicals, Inc.) was used as a polymer A1 for forming the layer A as the substrate layer, charged into an extruder, and melt-kneaded at a melting temperature of 280° C. This was extruded through a die slit, and solidified by cooling on a casting drum set at a surface temperature of 60° C. to obtain a 95 μm-thick un-stretched film, which was wound into a roll to obtain a roll of the substrate layer film.
50% by mass of a modified polyolefin resin (HARDLEN M100 manufactured by Toyobo Co., Ltd.) as a heat-sealable polyolefin B1 for forming the layer B as a heat-sealable layer and 50% by mass of a 4-methyl-1-pentene-based copolymer (EP1013 manufactured by Mitsui Chemicals, Inc.) as a copolymer B2 were blended in a pellet state. Then, the blend was charged into an extruder, and melt-kneaded at a melting temperature of 230° C. This was extruded through a die slit, and solidified by cooling on a casting drum set at a surface temperature of 60° C. to obtain a 35 μm-thick un-stretched film, which was wound into a roll to obtain a roll of the heat-sealable layer film.
The roll of the substrate layer film was unwound, and the roll of the heat-sealable layer film was unwound on each of both surfaces thereof. A heating roll around which a Teflon tube was wound was set to 180° C., and lamination was performed while nipping to obtain a roll of a heat-sealable laminated film composed of the layer B, the layer A, and the layer B. The characteristics of the heat-sealable laminated film obtained by this method were summarized in Table 1. Peeling occurred between the layer B and the layer A, and therefore initial adhesion and durable adhesion could not be measured.
As is apparent from Table 1, in Examples 1 to 8, the heat-sealable laminated film having a high adhesion force at a laminated interface in the initial stage and under a moist-heat environment and having a good bonded state when being heat-sealed could be obtained.
Meanwhile, in Comparative Example 1 in which the content of the 4-methyl-1-pentene-based polymer in the substrate layer was small, the film thickness deformation rate of the substrate layer was extremely large, the in-plane deformation rate of the heat-sealable laminated film was also large, and the bonded state when being heat-sealed deteriorated. In Comparative Example 1, the substrate layer contained a large amount of the polypropylene resin, and therefore the adhesion force of the substrate layer with the heat-sealable layer was improved.
In Comparative Example 2 in which the heat-sealable layer did not contain a 4-methyl-1-pentene copolymer and Comparative Example 3 in which the copolymer having a too high mole percent of 4-methyl-1-pentene was used, the adhesion force at the laminated interface in the initial stage and under the moist-heat environment was reduced. Furthermore, in Comparative Example 4 in which the substrate layer and the heat-sealable layer were thermally laminated, the adhesion force at the laminated interface in the initial stage and under the moist-heat environment was significantly reduced.
The heat-sealable laminated film of the present invention is highly industrially applicable because the heat-sealable laminated film does not cause peeling between layers with respect to various planar or film-shaped adherends such as a metal, glass, and a resin regardless of being reinforced with a fiber, has an excellent bonding force, has strong durability even in severe durability evaluation, and can suppress bonding failure by keeping the film thickness deformation rate of the substrate layer that can withstand heat during bonding molding small.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2021-115030 | Jul 2021 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2022/022442 | 6/2/2022 | WO |
