Claims
- 1. An adhesive composition comprising: (a) a soluble polyimide resin; (b) a solvent for said polyimide resin; (c) an epoxy resin; (d) a cross-linking agent reactive with the polyimide solvent of (b); and (e) a catalyst which catalyzes the cross-linking reaction of (b) and (d).
- 2. A composition according to claim 1 wherein the soluble polyimide resin is a polyimide resin derived from phenylindane diamines and dianhydrides, polyamide acid or a partially imidized polyamide acid.
- 3. A composition according to claim 1 wherein said soluble polyimide resin comprises from about 1.5% to about 21% by weight of the reaction mixture.
- 4. A composition according to claim 1 wherein the solvent for the polyimide resin is an ethylenically unsaturated organic compound having one or more unsaturated sites.
- 5. A composition according to claim 4 wherein said polyimide solvent is N-vinyl pyrrolidinone.
- 6. A composition according to claim 1 wherein said solvent for the polyimide resin comprises from about 15% to about 60% by weight of the adhesive composition.
- 7. A composition according to claim 1 wherein said epoxy resin is a glycidyl polyether of a polyhydric phenol.
- 8. A composition according to claim 1 wherein said epoxy resin is a glycidyl ether of a polyhydric alcohol.
- 9. A composition according to claim 1 wherein said epoxy resin is a glycidyl ester of a polycarboxylic acid.
- 10. A composition according to claim 1 wherein said epoxy resin is a glycidyl polyether of a polyhydric alcohol.
- 11. A composition according to claim 1 wherein said epoxy resin comprises from about 3% to about 30% by weight of the adhesive composition.
- 12. A composition according to claim 1 furthe comprising a hardener for said epoxy resin selected from the group of aliphatic amines having at least three active amine hydrogen atoms per molecule.
- 13. A composition according to claim 12 wherein said hardener for said epoxy resin is an amidoamine obtained by reacting a polyamine with a fatty acid.
- 14. A composition according to claim 12 wherein said hardener for said epoxy resin is selected from the group consisting of mercaptans and isocyanates.
- 15. A composition according to claim 12 wherein said hardener for said epoxy resin is an anhydride curing agent.
- 16. A composition according to claim 15 wherein said hardeners for said epoxy resin are methyl-bicyclo (2.2.1)heptane-2,3 dicarboxylic anhydride isomers.
- 17. A composition according to claim 12 wherein said hardener for said epoxy resin is an aromatic amine.
- 18. A composition according to claim 1 comprising a hardener for said epoxy selected from the group consisting of non-heat reactive phenolic novolak hardeners.
- 19. A composition according to claim 1 comprising bis(4-hydroxyphenyl)-2,2-propane as a hardener for the epoxy resin.
- 20. A composition according to claim 12 wherein said hardener for said epoxy resin comprises from about 3% to about 15% by weight of the adhesive composition.
- 21. A composition according to claim 1 further comprising a catalyst accelerating the curing of said epoxy resin selected from the group consisting of alkyl or aryl substituted imidazole catalysts.
- 22. A composition according to claim 21 wherein said catalyst is 2-ethyl, 4-methyl imidazole.
- 23. A composition according to claim 21 wherein said catalyst comprises from about 0.3% to about 3% by weight of the adhesive composition.
- 24. A composition according to claim 1 wherein said cross-linking agent reactive with the solvent for the polyimide is a polyethylenically unsaturated organic compound.
- 25. A composition according to claim 24 wherein said cross-linking agent is triallyl-S-triazine-2,4,6 trione.
- 26. A composition according to claim 1 wherein said cross-linking agent comprises from about 15% to about 60% by weight of the adhesive composition.
- 27. A composition according to claim 1 wherein said catalyst catalyzing the cross-linking reaction of (b) and (d) is an organic catalyst having a half life, preferably, but not necessarily, of the same order as the cure time at the temperature chosen.
- 28. A composition according to claim 27 wherein said organic catalyst is an organic peroxide.
- 29. A composition according to claim 28 wherein said organic peroxide is di-tertiary butyl peroxide.
- 30. A composition according to claim 27 wherein said organic catalyst is a peroxyketal.
- 31. A composition according to claim 28 wherein said organic catalyst is a t-amyl peroxide.
- 32. A composition according to claim 1 wherein said catalyst catalyzing the cross-linking reaction between (b) and (d) is 1,1'-azobis(cyclohexanecarbonitrile).
- 33. A composition according to claim 1 wherein said catalyst catalyzing the cross-linking reaction between (b) and (d) comprises from about 1.5% to about 15% by weight of the adhesive composition.
- 34. A composition according to claim 1 further comprising filler material selected from the group consisting of glass or silica fillers.
- 35. A composition according to claim 34 wherein said filler is glass.
- 36. A composition according to claim 35 wherein said filler material comprises glass fillers of a size less than 10 microns and preferably of a melting point from about 350.degree. C. to about 500.degree. C.
- 37. A composition according to claim 34 wherein said filler is silica.
- 38. A composition according to claim 37 wherein said filler is silica of a size less than 1 micron.
- 39. A composition according to claim 34 wherein said filler material comprises from about 0.3% to about 15% by weight of the adhesive composition.
- 40. A composition according to claim 1, further comprising a conductive material.
- 41. A composition according to claim 40 wherein the conductive material is a noble metal.
- 42. A composition according to claim 41 wherein the noble metal is silver.
- 43. A composition according to claim 40 wherein the conductive material is a noble metal coated on a non-noble metal.
- 44. A composition according to claim 40 wherein the conductive material comprises from about 55% to about 70% by weight of the reaction mixture.
- 45. A composition according to claim 1 cured at about 90.degree. C. to about 120.degree. C. for a suitable period of time.
- 46. A composition according to claim 45 cured at about 90.degree. C. to about 120.degree. C. for about 45 minutes.
- 47. A composition according to claim 45 further cured at about 200.degree. C. to about 280.degree. C. for a suitable period of time.
- 48. A composition according to claim 47 further cured at about 200.degree. C. to about 280.degree. C. for about 30 minutes.
- 49. A composition according to claim 40 cured at about 90.degree. C. to about 120.degree. C. for a suitable period of time.
- 50. A composition according to claim 49 cured at about 90.degree. C. to about 120.degree. C. for about 45 minutes.
- 51. A composition according to claim 49 further cured at about 200.degree. C. to about 280.degree. C. for a suitable period of time.
- 52. A composition according to claim 51 further cured at about 200.degree. C. to about 280.degree. C. for about 30 minutes.
- 53. A composition according to claim 1 cured at about 50.degree. C. for about 10 to about 15 minutes.
Parent Case Info
This application is a continuation-in-part of application Ser. No. 660,593, filed Oct. 15, 1984, now U.S. Pat. No. 4,604,230, which issued on Aug. 5, 1986.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4401777 |
Tsuboi et al. |
Aug 1983 |
|
4557860 |
Disalvo et al. |
Dec 1985 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
660593 |
Oct 1984 |
|