Claims
- 1. A polyamide molding composition which has both improved flame resistance and heat stability comprising, in weight percent,(a) 20-78% polyamide, having a melting point of 280-340 C., (b) 10-60% inorganic filler, (c) 10-35% of a flame retardant having 50-70% bromine or chlorine, (d) 1-10% antimony compound, (e) 1-10% of one or more of magnesium oxide, calcium oxide, hydroxides, or salts of weak mineral acids, and combinations thereof, and (f) 0-2% of a heat stabilizer.
- 2. The composition of claim 1 wherein component (a) is a copolyamide of 20-80 mole of units derived from hexamethylene terephthalamide and 80-20 mole % of units derived from hexamethylene adipamide.
- 3. The composition of claim 1 where in the inorganic filler (b) is selected from the group consisting of glass fiber, carbon fiber, glass beads, talc, kaolin, wollastonite and mica.
- 4. The composition of claim 1 wherein the flame retardant (c) is selected from the group consisting of brominated polystyrene, polydibromostyrene, and bis(hexachlorocyclopentaieno)cyclooctane.
- 5. The composition of claim 1 where in the antimony compound (d) is selected from the group consisting of antimony trioxide, antimony tetraoxide, antimony pentoxide, and sodium antimonate.
- 6. The composition of claim 1 wherein the component (e) is selected from one or more of the group consisting of hydrotalcite, calcium carbonate, and zinc borate.
- 7. A composition of claim 1 wherein component (e) is 1-5%.
- 8. A process for improving the temperature stability and flame retardance of a polyamide resin, comprising the steps of:providing a molding composition of claim 1, and molding the molding composition to make a molded part.
- 9. A process for improving the temperature stability and flame retardance of a polyamide resin, comprising the steps of:providing a molding composition of claim 7, and molding the molding composition to make a molded part.
- 10. A molded part made from the process of claim 8.
- 11. A molded part made from the process of claim 9.
CROSS REFERENCE TO RELATED APPLICATION
This application claims the benefit of U.S. Provisional Application No. 60/078,504 filed Mar. 18, 1998.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5256718 |
Yamamoto et al. |
Oct 1993 |
A |
Foreign Referenced Citations (3)
Number |
Date |
Country |
63 150349 |
Jun 1988 |
JP |
07 292242 |
Nov 1995 |
JP |
WO 95-18178 |
Jul 1995 |
WO |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/078504 |
Mar 1998 |
US |