This invention generally relates to diamond bonded materials and, more specifically, diamond bonded materials and inserts formed therefrom that are specifically designed to provide improved thermal stability when compared to conventional polycrystalline diamond materials.
U.S. Pat. No. 263,328 to Middlemiss, which is herein incorporated by U.S. Patent Application Publication No. 2005/0263328 to Middlemiss, which is herein incorporated by reference for all it contains, discloses a thermally stable region having a microstructure comprising a plurality of diamond grains bonded together by a reaction with a reactant material. The PCD region extends from the thermally stable region and has a microstructure of bonded together diamond grains and a metal solvent catalyst disposed interstitially between the bonded diamond grains. The compact is formed by subjecting the diamond grains, reactant material, and metal solvent catalyst to a first temperature and pressure condition to form the thermally stable region, and then to a second higher temperature condition to form both the PCD region and bond the body to a desired substrate.
U.S. Patent Application Publication No. 2006/0266559 to Keshavan et al., which is herein incorporated by reference for all that it contains, discloses a diamond body having bonded diamond crystals and interstitial regions disposed among the crystals. The diamond body is formed from diamond grains and a catalyst material at high-pressure/high-temperature conditions. The diamond grains have an average particle size of about 0.03 mm or greater. At least a portion of the diamond body has a high diamond volume content of greater than about 93 percent by volume. The entire diamond body can comprise the high volume content diamond or a region of the diamond body can comprise the high volume content diamond. The diamond body includes a working surface, a first region substantially free of the catalyst material. At least a portion of the first region extends from the working surface to depth of from about 0.01 to about 0.1 mm.
U.S. Pat. No. 7,473,287 to Belnap et al., which is herein incorporated by reference for all that it contains, discloses a thermally-stable polycrystalline diamond materials comprising a first phase including a plurality of bonded together diamond crystals, and a second phase including a reaction product formed between a binder/catalyst material and a material reactive with the binder/catalyst material. The reaction product is disposed within interstitial regions of the polycrystalline diamond material that exists between the bonded diamond crystals. The first and second phases are formed during a single high pressure/high temperature process condition. The reaction product has a coefficient of thermal expansion that is relatively closer to that of the bonded together diamond crystals than that of the binder/catalyst material, thereby providing an improved degree of thermal stability to the polycrystalline diamond material.
U.S. Pat. No. 6,562,462 to Griffin, which is herein incorporated by reference for all that it contains, discloses a polycrystalline diamond or diamond-like element with greatly improved wear resistance without loss of impact strength. These elements are formed with a binder-catalyzing material in a high-temperature/high-pressure (HTHP) process. The PCD element has a body with a plurality of bonded diamond or diamond-like crystals forming a continuous diamond matrix that has a diamond volume density greater than 85%. Interstices among the diamond crystals form a continuous interstitial matrix containing a catalyzing material. The diamond matrix table is formed and integrally bonded with a metallic substrate containing the catalyzing material during the HTHP process. The diamond matrix body has a working surface, where a portion of the interstitial matrix in the body adjacent to the working surface is substantially free of the catalyzing material, and the remaining interstitial matrix contains the catalyzing material. Typically, less than about 70% of the body of the diamond matrix table is free of the catalyzing material.
In one aspect of the invention, an insert comprises a sintered polycrystalline diamond body bonded to a cemented metal carbide substrate. The diamond body comprises a substantially conical shape with conical side wall terminating at an apex. The diamond body comprises a first region with a metallic catalyst dispersed through interstices between the diamond grains and a second region proximate the apex with the characteristic of higher thermal stability than the first region.
The second region may comprise a natural diamond. The natural diamond may form the apex. The natural diamond may be covered by a small layer of the diamond and metallic catalyst found in the first region. The metallic catalyst in the small layer may be mixed with the diamond grains prior to sintering. The metallic catalyst in the small layer may diffuse from the substrate during sintering. The second region may comprise a sintered natural diamond, a single crystal natural diamond, a single crystal synthetic diamond, or combinations thereof. The second region may comprise a coarse saw grade diamond. The second region may comprise cubic boron nitride. The second region may comprise an asymmetrical shape. The second region may comprise a non-metallic catalyst. The second region may be pre-sintered prior to being sintered with the first region. The second region may comprise fully dense diamond, which was processed in high enough pressure to not need a catalyst.
The pre-sintered second region may be leached prior to being re-sintered with the first region. The diamond body may be thicker than the substrate. The diamond body may comprise a conical side wall that forms a 40 to 50 degree angle with a central axis of the insert. The first region may separate the second region from the substrate. The second region may be substantially free of the metallic catalyst. The different portions of the polycrystalline diamond body may comprise different volumes of the metallic catalyst. The first and the second regions may be joined at a non-planar interface.
In another aspect of the invention, a method of forming an insert may comprise the steps of placing diamond powder in a conical metallic carbide can, compressing the carbide can under a high-pressure/high-temperature such that the powder forms a pointed sintered compact, removing the metallic catalyst from the sintered compact, and re-sintering the pointed sintered compact to another sintered diamond body such that the pointed sintered compact forms a tip.
a is a top orthogonal diagram of a carbide disk comprising a number of tip molds.
b is a cross-sectional diagram of an embodiment of a carbide disk.
c is a cross-sectional diagram of an embodiment of a cube for HPHT processing comprising a plurality of carbide disks.
d is an orthogonal diagram of an embodiment of a leaching process.
e is a cross-sectional diagram of an embodiment of a plurality of thermally stable diamond tips.
f is a cross-sectional diagram of another embodiment of an insert.
a is a cross-sectional diagram of another embodiment of a carbide disk.
b is a cross-sectional diagram of another embodiment of a plurality of thermally stable diamond tips.
c is a perspective diamond of another embodiment of an insert.
In a preferred embodiment, the diamond regions are thicker than the cemented metal carbide substrate 103a. The diamond regions also preferably comprise a greater volume than the cemented metal carbide substrate 103a. The apex 150 of the overall diamond structure may be rounded, with a 0.050 to 0.150 inch radius. Such a radius is sharp enough to penetrate the hard formations such as granite, while, with the combination of the angle of the conical side wall 110a, buttress the apex 150 under high loads. In many applications, the apex 150 will be subject to the most abuse, thus experiencing the highest wear and greatest temperatures.
Most attempts of the prior art to make diamond thermally stable have resulted in weakened impact strength. Some prior art references teach that their structure simply does not compromise the impact strength of their part (see Griffin cited in the background). The present invention, not only improves the thermal stability of the entire tool, but its shape actually increases its impact strength as well.
To achieve both the increased impact strength and thermal stability, the diamond of the first region 105a must be at least 0.100 inches, but no more than 0.275 inches, preferably about 0.150 inches from the apex 150 to the non-planar interface 114. This range is much thicker than what is typically commercial available at the time of this application's filing. It is believed that this critical range allows for the compressive forces to propagate through the diamond, and the radial expansion caused by that compression to be mostly accommodated in the cemented metal carbide substrate 103a below the first region 105a of diamond. This range solves a long standing problem in the art because generally parts enhanced with diamond have thin thicknesses, typically under 0.070 inches. In such cases with thin diamond, the point of impact on the diamond is supported by the carbide and will flex under high loads. The thick diamond on the other hand will not flex because its point of impact is supported by more diamond. However, under impacts not only does a section of a tool compress, but a section will also tend to expand radially as well. The critical range allows the radial expansion to occur in the carbide substrate which is much more flexible than the diamond. If the diamond were too thick, the diamond may be prone to cracking from the radial expansion forces because the diamond may be weaker in tension than the carbide.
Thus, the thermal stability near the apex 150 combined with the collective shape of the first region 105a and the second region 104a overcome a long standing need in the art by increasing both the thermal stability of the tool and increasing the impact strength.
Several molecular structures may be used to create the thermally stable characteristic of the second region 104a. The second region 104a may comprise a natural diamond 106a. The natural diamond 106a may form the apex 150 as in
Another molecular structure that may achieve the high thermally stable characteristic is sintered polycrystalline diamond void of metallic binder in its interstices. The tips of the first region may be leached to remove the binder and, thus, form the thermally stable second region. In other embodiments, the second region may be sintered separately, leached and then attached to the first region. The attachment may be achieved through sintering the regions together, brazing, or other bonding methods.
Other molecular structures that may achieve the higher thermal stability include single crystal natural diamond, a single crystal synthetic diamond, coarse saw grade diamond, or combinations thereof. The average size of natural diamond crystal is 2.5 mm or more.
The second region 104a may comprise a cubic boron nitride, which generally exhibits a greater thermal stability than polycrystalline diamond comprising the metallic binder. The second region 104a may also comprise fully dense PCD grains sintered at extremely high temperature and pressure where catalysts are not used to promote diamond to diamond bonding.
In other embodiments, a non-metallic catalyst may be used in the second region 104a to achieve higher thermal stability. Such non-metallic catalysts may include silicon, silicon carbide, boron, carbonates, hydroxide, hydride, hydrate, phosphorus-oxide, phosphoric acid, carbonate, lanthanide, actinide, phosphate hydrate, hydrogen phosphate, phosphorus carbonate, or combinations thereof. In some cases, a chemical may be doped into the second region 104a to react with a metallic catalyst such that the catalyst no longer exhibits such drastic difference in thermal expansion as the diamond.
The second region 104d may also comprise boron doped into the interstices to react with metallic binders. The melting temperature of boron is very high. The second region 104d may also comprise boron doped into interstices where the metallic binder has already been removed.
A method for manufacturing an embodiment of the invention is referred to in
a-c disclose steps in another embodiment of a method for forming a second region of an insert. Cavities 2300 of a disc 2310 are filled with a large single crystal of diamond 2320 and back filled with a diamond powder 2340. The single crystal diamond 2320 may be synthetic or natural. During sintering, the single crystal diamond 2320 and the diamond powder 2340 may bond to one another forming a pointed sintered compact 2360 as shown in
Whereas the present invention has been described in particular relation to the drawings attached hereto, it should be understood that other and further modifications apart from those shown or suggested herein, may be made within the scope and spirit of the present invention.
This application is a continuation-in-part of U.S. patent application Ser. No. 12/051,738 filed on Mar. 19, 2008 and that issued as U.S. Pat. No. 7,669,674 on Mar. 2, 2010, which is a continuation of U.S. patent application Ser. No. 12/051,689 filed on Mar. 19, 2008 and that issued as U.S. Pat. No. 7,963,617 on Jun. 11, 2011, which is a continuation of U.S. patent application Ser. No. 12/051,586 filed on Mar. 19, 2008 and that issued as U.S. Pat. No. 8,007,050 on Aug. 30, 2011, which is a continuation-in-part of U.S. patent application Ser. No. 12/021,051 filed on Jan. 28, 2008 now U.S. Pat. No. 8,123,302, which is a continuation-in-part of U.S. patent application Ser. No. 12/021,019 filed on Jan. 28, 2008, which was a continuation-in-part of U.S. patent application Ser. No. 11/971,965 filed on Jan. 10, 2008 and that issued as U.S. Pat. No. 7,648,210, which is a continuation of U.S. patent application Ser. No. 11/947,644 filed on Nov. 29, 2007 and that issued as U.S. Pat. No. 8,007,051 on Aug. 30, 2011, which is a continuation-in-part of U.S. patent application Ser. No. 11/844,586 filed on Aug. 24, 2007 and that issued as U.S. Pat. No. 7,600,823 on Oct. 13, 2009, which is a continuation-in-part of U.S. patent application Ser. No. 11/829,761 filed Jul. 27, 2007 and that issued as U.S. Pat. No. 7,722,127 on May 25, 2010, which is a continuation-in-part of U.S. patent application Ser. No. 11/773,271 filed on Jul. 3, 2007 and that issued as U.S. Pat. No. 7,997,661 on Aug. 16, 2011, which is a continuation-in-part of U.S. patent application Ser. No. 11/766,903 filed on Jun. 22, 2007, which is a continuation of U.S. patent application Ser. No. 11/766,865 filed on Jun. 22, 2007, which is a continuation-in-part of U.S. patent application Ser. No. 11/742,304 filed Apr. 30, 2007 and that issued as U.S. Pat. No. 7,475,948 on Jan. 13, 2008, which is a continuation of U.S. patent application Ser. No. 11/742,261 filed on Apr. 30, 2007 and that issued as U.S. Pat. No. 7,469,971, which is a continuation-in-part of U.S. patent application Ser. No. 11/464,008 filed on Aug. 11, 2006 and that issued as U.S. Pat. No. 7,338,135 on Mar. 8, 2008, which is a continuation-in-part of U.S. patent application Ser. No. 11/463,998 filed on Aug. 11, 2006 and that issued as U.S. Pat. No. 7,384,105 on Jun. 10, 2008, which is a continuation-in-part of U.S. patent application Ser. No. 11/463,990 filed on Aug. 11, 2006 and that issued as U.S. Pat. No. 7,320,505 on Jan. 22, 2008, which is a continuation-in-part of U.S. patent application Ser. No. 11/463,975 filed on Aug. 11, 2006 and that issued as U.S. Pat. No. 7,445,294 on Nov. 4, 2008, which is a continuation-in-part of U.S. patent application Ser. No. 11/463,962 filed on Aug. 11, 2006 and that issued as U.S. Pat. No. 7,413,256 on Aug. 19, 2008. This application is also a continuation-in-part of U.S. patent application Ser. No. 11/673,634 filed on Feb. 12, 2007, now U.S. Pat. No. 8,109,349. All of these applications are herein incorporated by reference for all that they contain.
Number | Name | Date | Kind |
---|---|---|---|
465103 | Wegner | Dec 1891 | A |
616118 | Kunhe | Dec 1898 | A |
946060 | Looker | Jan 1910 | A |
1116154 | Stowers | Nov 1914 | A |
1183630 | Bryson | May 1916 | A |
1189560 | Gondos | Jul 1916 | A |
1360908 | Everson | Nov 1920 | A |
1387733 | Midgett | Aug 1921 | A |
1460671 | Hebsacker | Jul 1923 | A |
1544757 | Hufford et al. | Jul 1925 | A |
1821474 | Mercer | Sep 1931 | A |
1879177 | Gault | Sep 1932 | A |
2004315 | Fean | Jun 1935 | A |
2054255 | Howard | Sep 1936 | A |
2064255 | Garfield | Dec 1936 | A |
2124438 | Struk et al. | Jul 1938 | A |
2169223 | Christian | Aug 1939 | A |
2218130 | Court | Oct 1940 | A |
2320136 | Kammerer | May 1943 | A |
2466991 | Kammerer | Apr 1949 | A |
2540464 | Stokes | Feb 1951 | A |
2544036 | Kammerer | Mar 1951 | A |
2755071 | Kammerer | Jul 1956 | A |
2776819 | Brown | Jan 1957 | A |
2819043 | Henderson | Jan 1958 | A |
2838284 | Austin | Jun 1958 | A |
2894722 | Buttolph | Jul 1959 | A |
2901223 | Scott | Aug 1959 | A |
2963102 | Smith | Dec 1960 | A |
3135341 | Ritter | Jun 1964 | A |
3254392 | Novkov | Jun 1966 | A |
3294186 | Buell | Dec 1966 | A |
3301339 | Pennebaker, Jr. | Jan 1967 | A |
3379264 | Cox | Apr 1968 | A |
3397012 | Krekeler | Aug 1968 | A |
3429390 | Bennett | Feb 1969 | A |
3493165 | Schonfeld | Feb 1970 | A |
3583504 | Aalund | Jun 1971 | A |
3626775 | Gentry | Dec 1971 | A |
3745396 | Quintal et al. | Jul 1973 | A |
3745623 | Wentorf, Jr. et al. | Jul 1973 | A |
3746396 | Radd | Jul 1973 | A |
3764493 | Rosar et al. | Oct 1973 | A |
3800891 | White et al. | Apr 1974 | A |
3807804 | Kniff | Apr 1974 | A |
3821993 | Kniff et al. | Jul 1974 | A |
3830321 | McKenry et al. | Aug 1974 | A |
3932952 | Helton | Jan 1976 | A |
3945681 | White | Mar 1976 | A |
3955635 | Skidmore | May 1976 | A |
3960223 | Kleine | Jun 1976 | A |
4005914 | Newman | Feb 1977 | A |
4006936 | Crabiel | Feb 1977 | A |
4081042 | Johnson et al. | Mar 1978 | A |
4096917 | Harris | Jun 1978 | A |
4098362 | Bonnice | Jul 1978 | A |
4106577 | Summers | Aug 1978 | A |
4109737 | Bovenkerk | Aug 1978 | A |
4140004 | Smith et al. | Feb 1979 | A |
4156329 | Daniels et al. | May 1979 | A |
4176723 | Arceneaux | Dec 1979 | A |
4199035 | Thompson | Apr 1980 | A |
4201421 | Den Besten | May 1980 | A |
4211508 | Dill et al. | Jul 1980 | A |
4224380 | Bovenkerk et al. | Sep 1980 | A |
4253533 | Baker, III | Mar 1981 | A |
4268089 | Spence et al. | May 1981 | A |
4277106 | Sahley | Jul 1981 | A |
4280573 | Sudnishnikov et al. | Jul 1981 | A |
4304312 | Larsson | Dec 1981 | A |
4307786 | Evans | Dec 1981 | A |
D264217 | Prause et al. | May 1982 | S |
4333902 | Hara | Jun 1982 | A |
4333986 | Tsuji et al. | Jun 1982 | A |
4337980 | Krekeler | Jul 1982 | A |
4390992 | Judd | Jun 1983 | A |
4397361 | Langford, Jr. | Aug 1983 | A |
4412980 | Tsuji et al. | Nov 1983 | A |
4416339 | Baker et al. | Nov 1983 | A |
4425315 | Tsuji et al. | Jan 1984 | A |
4439250 | Acharya et al. | Mar 1984 | A |
4445580 | Sahley | May 1984 | A |
4448269 | Ishikawa et al. | May 1984 | A |
4465221 | Schmidt | Aug 1984 | A |
4481016 | Campbell et al. | Nov 1984 | A |
4484644 | Cook et al. | Nov 1984 | A |
4484783 | Emmerich | Nov 1984 | A |
4489986 | Dziak | Dec 1984 | A |
4499795 | Radtke | Feb 1985 | A |
4525178 | Hall | Jun 1985 | A |
4531592 | Hayatdavoudi | Jul 1985 | A |
4535853 | Ippolito et al. | Aug 1985 | A |
4538691 | Dennis | Sep 1985 | A |
4566545 | Story et al. | Jan 1986 | A |
4574895 | Dolezal et al. | Mar 1986 | A |
4599731 | Ware et al. | Jul 1986 | A |
4604106 | Hall | Aug 1986 | A |
4627503 | Horton | Dec 1986 | A |
4636253 | Nakai et al. | Jan 1987 | A |
4636353 | Seon | Jan 1987 | A |
4640374 | Dennis | Feb 1987 | A |
4647111 | Bronder et al. | Mar 1987 | A |
4647546 | Hall, Jr. et al. | Mar 1987 | A |
4650776 | Cerceau et al. | Mar 1987 | A |
4662348 | Hall et al. | May 1987 | A |
4664705 | Horton et al. | May 1987 | A |
4678237 | Collin | Jul 1987 | A |
4682987 | Brady et al. | Jul 1987 | A |
4684176 | Den Besten et al. | Aug 1987 | A |
4688856 | Elfgen | Aug 1987 | A |
4690691 | Komanduri | Sep 1987 | A |
4694918 | Hall | Sep 1987 | A |
4725098 | Beach | Feb 1988 | A |
4726718 | Meskin et al. | Feb 1988 | A |
4729440 | Hall | Mar 1988 | A |
4729603 | Elfgen | Mar 1988 | A |
4765686 | Adams | Aug 1988 | A |
4765687 | Parrott | Aug 1988 | A |
4776862 | Wiand | Oct 1988 | A |
4852672 | Behrens | Aug 1989 | A |
4880154 | Tank | Nov 1989 | A |
4889017 | Fuller et al. | Dec 1989 | A |
D305871 | Geiger | Feb 1990 | S |
4932723 | Mills | Jun 1990 | A |
4940099 | Deane et al. | Jul 1990 | A |
4940288 | Stiffler et al. | Jul 1990 | A |
4944559 | Sionnet et al. | Jul 1990 | A |
4944772 | Cho | Jul 1990 | A |
4951762 | Lundell | Aug 1990 | A |
4956238 | Griffin | Sep 1990 | A |
4962822 | Pascale | Oct 1990 | A |
4981184 | Knowlton et al. | Jan 1991 | A |
5007685 | Beach et al. | Apr 1991 | A |
5009273 | Grabinski | Apr 1991 | A |
5011515 | Frushour | Apr 1991 | A |
5027914 | Wilson | Jul 1991 | A |
5038873 | Jurgens | Aug 1991 | A |
D324056 | Frazee | Feb 1992 | S |
D324226 | Frazee | Feb 1992 | S |
5088797 | O'Neill | Feb 1992 | A |
5112165 | Hedlund et al. | May 1992 | A |
5119714 | Scott et al. | Jun 1992 | A |
5119892 | Clegg et al. | Jun 1992 | A |
5141063 | Quesenbury | Aug 1992 | A |
5141289 | Stiffler | Aug 1992 | A |
D329809 | Bloomfield | Sep 1992 | S |
5154245 | Waldenstrom | Oct 1992 | A |
5186268 | Clegg | Feb 1993 | A |
5186892 | Pope | Feb 1993 | A |
5222566 | Taylor | Jun 1993 | A |
5248006 | Scott et al. | Sep 1993 | A |
5251964 | Ojanen | Oct 1993 | A |
5255749 | Bumpurs et al. | Oct 1993 | A |
5261499 | Grubb | Nov 1993 | A |
5265682 | Russell et al. | Nov 1993 | A |
D342268 | Meyer | Dec 1993 | S |
5303984 | Ojanen | Apr 1994 | A |
5304342 | Hall, Jr. et al. | Apr 1994 | A |
5332348 | Lemelson | Jul 1994 | A |
5351770 | Cawthorne et al. | Oct 1994 | A |
5361859 | Tibbitts | Nov 1994 | A |
5374319 | Stueber et al. | Dec 1994 | A |
D357485 | Mattsson et al. | Apr 1995 | S |
5410303 | Comeau et al. | Apr 1995 | A |
5417292 | Polakoff | May 1995 | A |
5417475 | Graham et al. | May 1995 | A |
5423389 | Warren et al. | Jun 1995 | A |
5447208 | Lund | Sep 1995 | A |
5494477 | Flood et al. | Feb 1996 | A |
5507357 | Hult et al. | Apr 1996 | A |
D371374 | Fischer et al. | Jul 1996 | S |
5533582 | Tibbitts | Jul 1996 | A |
5535839 | Brady | Jul 1996 | A |
5542993 | Rabinkin | Aug 1996 | A |
5544713 | Dennis | Aug 1996 | A |
5560440 | Tibbitts | Oct 1996 | A |
5568838 | Struthers et al. | Oct 1996 | A |
5653300 | Lund | Aug 1997 | A |
5655614 | Azar | Aug 1997 | A |
5662720 | O'Tigheamaigh | Sep 1997 | A |
5678644 | Fielder | Oct 1997 | A |
5709279 | Dennis | Jan 1998 | A |
5720528 | Ritchey | Feb 1998 | A |
5732784 | Nelson | Mar 1998 | A |
5738698 | Kapoor et al. | Apr 1998 | A |
5794728 | Palmberg | Aug 1998 | A |
5811944 | Sampayan et al. | Sep 1998 | A |
5823632 | Burkett | Oct 1998 | A |
5837071 | Andersson et al. | Nov 1998 | A |
5845547 | Sollami | Dec 1998 | A |
5848657 | Flood et al. | Dec 1998 | A |
5875862 | Jurewicz | Mar 1999 | A |
5884979 | Latham | Mar 1999 | A |
5890552 | Scott et al. | Apr 1999 | A |
5896938 | Moeny et al. | Apr 1999 | A |
5914055 | Roberts et al. | Jun 1999 | A |
5934542 | Nakamura et al. | Aug 1999 | A |
5935718 | Demo et al. | Aug 1999 | A |
5944129 | Jensen | Aug 1999 | A |
5947215 | Lundell | Sep 1999 | A |
5950743 | Cox | Sep 1999 | A |
5957223 | Doster et al. | Sep 1999 | A |
5957225 | Sinor | Sep 1999 | A |
5967247 | Pessier | Oct 1999 | A |
5967250 | Lund | Oct 1999 | A |
5979571 | Scott et al. | Nov 1999 | A |
5992405 | Sollami | Nov 1999 | A |
5992547 | Caraway et al. | Nov 1999 | A |
5992548 | Silva et al. | Nov 1999 | A |
6000483 | Jurewicz et al. | Dec 1999 | A |
6003623 | Miess | Dec 1999 | A |
6006846 | Tibbitts et al. | Dec 1999 | A |
6018729 | Zacharia et al. | Jan 2000 | A |
6019434 | Emmerich | Feb 2000 | A |
6021859 | Tibbitts et al. | Feb 2000 | A |
6039131 | Beaton | Mar 2000 | A |
6041875 | Rai et al. | Mar 2000 | A |
6044920 | Massa et al. | Apr 2000 | A |
6051079 | Andersson et al. | Apr 2000 | A |
6056911 | Griffin | May 2000 | A |
6065552 | Scott et al. | May 2000 | A |
6068913 | Cho et al. | May 2000 | A |
6098730 | Scott et al. | Aug 2000 | A |
6113195 | Mercier et al. | Sep 2000 | A |
6131675 | Anderson | Oct 2000 | A |
6150822 | Hong et al. | Nov 2000 | A |
6170917 | Heinrich et al. | Jan 2001 | B1 |
6186251 | Butcher | Feb 2001 | B1 |
6193770 | Sung | Feb 2001 | B1 |
6196340 | Jensen | Mar 2001 | B1 |
6196636 | Mills | Mar 2001 | B1 |
6196910 | Johnson | Mar 2001 | B1 |
6199645 | Anderson et al. | Mar 2001 | B1 |
6199956 | Kammerer | Mar 2001 | B1 |
6202761 | Forney | Mar 2001 | B1 |
6213226 | Eppink et al. | Apr 2001 | B1 |
6216805 | Lays et al. | Apr 2001 | B1 |
6220375 | Butcher et al. | Apr 2001 | B1 |
6220376 | Lundell | Apr 2001 | B1 |
6223824 | Moyes | May 2001 | B1 |
6223974 | Unde | May 2001 | B1 |
6257673 | Markham et al. | Jul 2001 | B1 |
6258139 | Jensen | Jul 2001 | B1 |
6260639 | Yong et al. | Jul 2001 | B1 |
6269893 | Beaton et al. | Aug 2001 | B1 |
6270165 | Peay | Aug 2001 | B1 |
6272748 | Smyth | Aug 2001 | B1 |
6290008 | Portwood et al. | Sep 2001 | B1 |
6296069 | Lamine et al. | Oct 2001 | B1 |
6302224 | Sherwood, Jr. | Oct 2001 | B1 |
6302225 | Yoshida et al. | Oct 2001 | B1 |
6315065 | Yong et al. | Nov 2001 | B1 |
6332503 | Pessier et al. | Dec 2001 | B1 |
6340064 | Fielder et al. | Jan 2002 | B2 |
6341823 | Sollami | Jan 2002 | B1 |
6354771 | Bauschulte et al. | Mar 2002 | B1 |
6364034 | Schoeffler | Apr 2002 | B1 |
6364420 | Sollami | Apr 2002 | B1 |
6371567 | Sollami | Apr 2002 | B1 |
6375272 | Ojanen | Apr 2002 | B1 |
6375706 | Kembaiyan et al. | Apr 2002 | B2 |
6394200 | Watson et al. | May 2002 | B1 |
6408052 | McGeoch | Jun 2002 | B1 |
6408959 | Bertagnolli et al. | Jun 2002 | B2 |
6419278 | Cunningham | Jul 2002 | B1 |
6429398 | Legoupil et al. | Aug 2002 | B1 |
6439326 | Huang et al. | Aug 2002 | B1 |
6460637 | Siracki et al. | Oct 2002 | B1 |
6468368 | Merrick et al. | Oct 2002 | B1 |
6474425 | Truax et al. | Nov 2002 | B1 |
6478383 | Ojanen et al. | Nov 2002 | B1 |
6481803 | Ritchey | Nov 2002 | B2 |
6484825 | Watson et al. | Nov 2002 | B2 |
6484826 | Anderson et al. | Nov 2002 | B1 |
6499547 | Scott et al. | Dec 2002 | B2 |
6508318 | Linden et al. | Jan 2003 | B1 |
6510906 | Richert et al. | Jan 2003 | B1 |
6513606 | Krueger | Feb 2003 | B1 |
6517902 | Drake et al. | Feb 2003 | B2 |
6533050 | Molloy | Mar 2003 | B2 |
6561293 | Minikus et al. | May 2003 | B2 |
6562462 | Griffin et al. | May 2003 | B2 |
D477225 | Pinnavaia | Jul 2003 | S |
6585326 | Sollami | Jul 2003 | B2 |
6592985 | Griffin et al. | Jul 2003 | B2 |
6594881 | Tibbitts | Jul 2003 | B2 |
6596225 | Pope et al. | Jul 2003 | B1 |
6601454 | Botnan | Aug 2003 | B1 |
6601662 | Matthias et al. | Aug 2003 | B2 |
6622803 | Harvey | Sep 2003 | B2 |
6668949 | Rives | Dec 2003 | B1 |
6672406 | Beuershausen | Jan 2004 | B2 |
6685273 | Sollami | Feb 2004 | B1 |
6692083 | Latham | Feb 2004 | B2 |
6702393 | Mercier | Mar 2004 | B2 |
6709065 | Peay et al. | Mar 2004 | B2 |
6711060 | Sakakibara | Mar 2004 | B2 |
6719074 | Tsuda et al. | Apr 2004 | B2 |
6729420 | Mensa-Wilmot | May 2004 | B2 |
6732817 | Dewey et al. | May 2004 | B2 |
6732914 | Cadden et al. | May 2004 | B2 |
6733087 | Hall et al. | May 2004 | B2 |
6739327 | Sollami | May 2004 | B2 |
6758530 | Sollami | Jul 2004 | B2 |
D494031 | Moore, Jr. | Aug 2004 | S |
D494064 | Hook | Aug 2004 | S |
6786557 | Montgomery, Jr. | Sep 2004 | B2 |
6802676 | Noggle | Oct 2004 | B2 |
6822579 | Goswami et al. | Nov 2004 | B2 |
6824225 | Stiffler | Nov 2004 | B2 |
6846045 | Sollami | Jan 2005 | B2 |
6851758 | Beach | Feb 2005 | B2 |
6854810 | Montgomery, Jr. | Feb 2005 | B2 |
6861137 | Griffin et al. | Mar 2005 | B2 |
6878447 | Griffin | Apr 2005 | B2 |
6880744 | Noro et al. | Apr 2005 | B2 |
6889890 | Yamazaki et al. | May 2005 | B2 |
6929076 | Fanuel et al. | Aug 2005 | B2 |
6933049 | Wan et al. | Aug 2005 | B2 |
6953096 | Gledhill et al. | Oct 2005 | B2 |
6959765 | Bell | Nov 2005 | B2 |
6962395 | Mouthaan | Nov 2005 | B2 |
6966611 | Sollami | Nov 2005 | B1 |
6994404 | Sollami | Feb 2006 | B1 |
7048081 | Smith et al. | May 2006 | B2 |
7204560 | Mercier et al. | Apr 2007 | B2 |
D547652 | Kerman et al. | Jul 2007 | S |
D560699 | Omi | Jan 2008 | S |
7380888 | Ojanen | Jun 2008 | B2 |
7396086 | Hall et al. | Jul 2008 | B1 |
7575425 | Hall et al. | Aug 2009 | B2 |
7592077 | Gates, Jr. et al. | Sep 2009 | B2 |
7665552 | Hall | Feb 2010 | B2 |
7730977 | Achilles | Jun 2010 | B2 |
7798258 | Singh et al. | Sep 2010 | B2 |
20010004946 | Jensen | Jun 2001 | A1 |
20020074851 | Montgomery, Jr. | Jun 2002 | A1 |
20020153175 | Ojanen | Oct 2002 | A1 |
20020175555 | Mercier | Nov 2002 | A1 |
20030079565 | Liang et al. | May 2003 | A1 |
20030141350 | Noro et al. | Jul 2003 | A1 |
20030209366 | McAlvain | Nov 2003 | A1 |
20030213621 | Britten | Nov 2003 | A1 |
20030217869 | Snyder et al. | Nov 2003 | A1 |
20030234280 | Cadden et al. | Dec 2003 | A1 |
20040026132 | Hall | Feb 2004 | A1 |
20040026983 | McAlvain | Feb 2004 | A1 |
20040065484 | McAlvain | Apr 2004 | A1 |
20040155096 | Zimmerman et al. | Aug 2004 | A1 |
20040238221 | Runia et al. | Dec 2004 | A1 |
20040256155 | Kriesels | Dec 2004 | A1 |
20040256442 | Gates, Jr. | Dec 2004 | A1 |
20050044800 | Hall | Mar 2005 | A1 |
20050159840 | Lin et al. | Jul 2005 | A1 |
20050173966 | Mouthaan | Aug 2005 | A1 |
20050263327 | Meiners et al. | Dec 2005 | A1 |
20060060391 | Eyre et al. | Mar 2006 | A1 |
20060086537 | Dennis | Apr 2006 | A1 |
20060086540 | Griffin et al. | Apr 2006 | A1 |
20060162969 | Belnap et al. | Jul 2006 | A1 |
20060180354 | Belnap et al. | Aug 2006 | A1 |
20060186724 | Stehney | Aug 2006 | A1 |
20060237236 | Sreshta et al. | Oct 2006 | A1 |
20070193782 | Fang | Aug 2007 | A1 |
20070278017 | Shen et al. | Dec 2007 | A1 |
20080006448 | Zhang et al. | Jan 2008 | A1 |
20080053710 | Moss | Mar 2008 | A1 |
20080073126 | Shen et al. | Mar 2008 | A1 |
20080073127 | Zhan et al. | Mar 2008 | A1 |
20080142276 | Griffo et al. | Jun 2008 | A1 |
20080156544 | Singh et al. | Jul 2008 | A1 |
20080206576 | Qian et al. | Aug 2008 | A1 |
Number | Date | Country |
---|---|---|
3 307 910 | Sep 1984 | DE |
3 500 261 | Jul 1986 | DE |
3 818 213 | Nov 1989 | DE |
4 039 217 | Jun 1992 | DE |
19 821 147 | Nov 1999 | DE |
10 163 717 | May 2003 | DE |
0 295 151 | Jun 1988 | EP |
0 412 287 | Feb 1991 | EP |
2 004 315 | Mar 1979 | GB |
2 037 223 | Jul 1980 | GB |
5 280 273 | Oct 1993 | JP |
Number | Date | Country | |
---|---|---|---|
20090133938 A1 | May 2009 | US |
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