The present invention relates to a thermionic electron emitter for emitting electrons by thermionic emission and an X-ray source including such thermionic electron emitter.
Future demands for high-end CT (computer tomography) and CV (cardio vascular) imaging regarding the X-ray source are higher power/tube current, shorter response-times regarding the tube current, especially when pulse modulation is desired, and smaller focus spots corresponding to the demands of future detector systems.
One key to reach higher power in smaller focus spots may be given by using a sophisticated electron-optical concept. But of the same importance may be the electron source itself and the starting conditions of the electrons. For a thermionic electron emitter for X-ray tubes it may be essential to heat up a metal surface to get electron emission currents of up to 1-2 A. These electron currents within the tube may be necessary for state-of-the-art medical applications. For today's high-end X-ray tubes, directly or indirectly heated thin flat emitters are usually used.
a and 1b show examples of conventional directly heated thin flat emitters 101, 201 having a rectangular or circular geometry, respectively. The flat electron emission surface 103, 203 is structured to define an electrical path and to obtain the required high electrical resistance. The thin emitter film is fixed at connection points 105, 205 to terminals 107, 207 through which an external voltage can be applied to the structured emission surface in order to induce a heating current for heating the emission surface to temperatures for thermionic electron emission.
As can be seen in
The exact position of the upper cathode cup surface 115 with respect to the emission surface 103 may be essential for a well-defined electron focusing behaviour of the cathode cup. However, the temperature of the electron source including the electron emitter and the cathode cup may influence the distance between the emission surface 103 and the cathode cup surface 115. During a medical investigation with a series of X-ray pulses, the temperatures of the terminals 107, 207 and of the cathode cup 111 may change differently. As a consequence, different thermo-mechanical expansions may occur and cause a change in the relative positions between emission surface 103 and upper cathode cup surface 115.
This is illustrated in
In other words, the thermal situation may change while doing several serial X-ray pulses. Therefore, the positions of emission surface 103 and cathode cup surface 115 may change which may lead to a different potential characteristics and a different optical situation. The focal spot on the electron beam on the anode may change which may cause a reduction in optical quality of an X-ray photograph.
In DE 10135995 A1, an electron emitter design as shown in
As can be seen in
However, practical use has revealed that also the electron emitter design described in DE 10135995 A1 may have problems concerning the distribution and homogeneity of an emitted electron beam.
There may be a need for an improved thermionic electron emitter and an X-ray source including same providing an improved electron emission characteristics allowing an improved electron emission homogeneity and/or a decreased temperature dependency.
This need may be met by the subject-matter according to the independent claims. Advantageous embodiments of the present invention are described in the dependent claims.
According to a first aspect of the present invention, a thermionic electron emitter is proposed comprising an inner part including a heatable flat emission surface, an outer part including a surrounding surface substantially enclosing the emission surface and a heating arrangement for heating the emission surface to a temperature for thermionic electron emission. Therein, the outer part is mechanically connected to the inner part in a connection region remote from the emission surface. Furthermore, the surrounding surface is thermally isolated from the emission surface in an isolation region remote from the connection region.
It has been found by the inventor of the present invention that in thermionic electron emitters similar to those disclosed in DE 10135995 A1 and shown in
The first aspect of the present invention may be seen as based on the idea to provide an outer emitter part which, during operation, is not actively heated and which surrounds or encloses the actual heated or heatable flat emission surface of an inner emitter part wherein the outer emitter part is mechanically connected to the inner emitter part remote from the heatable emission surface and therefore substantially has no direct thermal contact to a hot emission surface in operation.
For example, an intermediate region can be interposed between the emission surface actually heated by the heating arrangement to a temperature for thermionic electron emission, which may be more than 2.000° C., and the non-heated outer part including the surrounding surface. This intermediate region may act as a thermal barrier or insulator such that heat exchange between the emission surface of the inner part and the surrounding surface of the outer part is substantially prevented. However, apart from the lacking thermal contact, there may be electrical contact between the inner part and the outer part such that the emission surface and the surrounding surface may be on a similar electrical potential.
The gist of the thermionic electron emitter according to the first aspect of the present invention may be seen in the fact that the outer part including the surrounding surface is mechanically connected to the inner part including the emission surface in a manner such that substantially no influence to the temperature distribution within the emission surface occurs when the emission surface is heated by the heating arrangement whereas the outer part is not heated by the heating arrangement. Accordingly, the temperature distribution within the heated emission surface of the electron emitter according to the first aspect of the invention may be substantially equal to the temperature distribution of a heated emission surface of the same geometry of a conventional thermionic electron emitter having no additional outer parts.
In the following, possible features and advantages of the thermionic electron emitter according to the first aspect will be explained in detail.
Herein, a thermionic electron emitter may be interpreted as having an electron emission surface which, during operation, is heated by a heating arrangement to a very high temperature of for example more than 2.000° C. for thermionic electron emission such that electrons in the emission surface have such high kinetic energy as to emanate from the emission surface. The released electrons can then be accelerated within an electrical field and can be directed onto an anode in order to generate X-rays.
The emission surface of the inner part is generally flat which means that there are substantially no curvature or protrusions within the emission surface which might disturb or deviate the electrical potential applied between the electron emitter and an anode. However, the emission surface may be structured such as to define conduction paths of predetermined electrical resistance. By applying an external voltage to end terminals on these conduction paths, a current may be induced within the conduction paths for heating the emission surface.
The surrounding surface of the outer part substantially encloses the emission surface entirely. For example, the surrounding surface may be formed as a ring-like surface laterally around the rectangular or circular emission surface. In order to avoid electrical currents flowing through the outer part, the surrounding surface may be interrupted by small gaps in the order of less than 1 mm, preferably less than 400 μm. Such gaps may prevent any electrical current flowing through the outer part while, due to their small size, not substantially influencing the electrical potential between the electron emitter and an anode and while not substantially influencing a thermal characteristics of the surrounding surface.
The heating arrangement for heating the emission surface may be realized in different manners. In so-called directly heated thermionic electron emitters, the heating arrangement may be integrated into the inner part of the electron emitter. As mentioned before, terminals may be provided on the inner part and the inner part may be structured to have electrical conduction paths such that electrical current flowing through these paths heats the emission surface. Alternatively, in so-called indirectly heated electron emitters, an external heating arrangement can be provided. For example, accelerated electrons from an auxiliary electron source may be directed onto the emission surface of the electron emitter in order to heat it by electron bombardment. Alternatively, a source of intense light such as a laser may be directed onto the emission surface for heating same by light absorption.
The connection region in which the outer part is mechanically connected to the inner part should be sufficiently remote from the emission surface such that no substantial thermal contact between the outer surface and a hot emission surface is provided. The actual distance between the heated emission surface and the non-heated surrounding surface of the outer part may be selected depending on the thermal properties of the material of for example the inner part, the outer part and/or the connection region. Less than a few millimeters of distance between the outer part and the emission surface may be sufficient for practical purposes of thermal separation.
In order to prevent negative thermal influence of the surrounding surface to the hot emission surface in operation, the surrounding surface should be thermally isolated from the emission surface as good as possible. For this purpose, the surrounding surface should be isolated from the emission surface at least in the isolation region remote from the connection region where the outer part is connected to the inner part. In other words, the surrounding surface should be close to the emission surface and enclose the emission surface but there should not be significant thermal contact between the hot emission surface and the cold surrounding surface (except for the unavoidable thermal radiation contact).
According to an embodiment of the invention, the surrounding surface, in the isolation region, is laterally spaced apart from the emission surface by a gap. This gap may serve for thermal isolation. For example, this gap may have a width of less than 1 mm, preferably less than 0.4 mm and more preferably less than 0.2 mm. The smaller the gap the smaller disturbances of the electrical field may be. Preferably, the gap may have a constant width along its longitudinal extension in order to reduce inhomogeneities in electric field deviations and/or thermal properties.
According to a further embodiment, the heating arrangement comprises two emitter terminals arranged at the inner part at opposing positions with respect to the emission surface such that an electrical heating current can be induced in the emission surface by applying a voltage to the emitter terminals. In this embodiment, the emission surface can be directly heated. The location at which the emitter terminals contact the inner part of the electron emitter may define the lateral extremities of the heatable emission surface. Due to radiation losses, conduction losses and convection losses, these extremities may be the coldest areas of the heated emission surface. Accordingly, it may be advantageous to mechanically connect the unheated outer part to the inner part at proximity to these extremities.
According to a further embodiment, the outer part is mechanically connected to the inner part in a connection region opposite to the emission surface with respect to an emitter terminal. In other words, in a directly heated electron emitter, the region between two emitter terminals serves as heatable emission surface whereas the opposite region outside the emission surface may serve as connection region in which the outer part can be mechanically connected to the inner part.
In a further embodiment of the inventive electron emitter, the heating arrangement comprises a laser beam source or an electron beam source directed to the emission surface. In this embodiment, the emission surface can be heated indirectly by light absorption of the laser beam or by electron bombardment. The shape and size of the beam defines the actually heated emission surface. Accordingly, knowing these properties of the laser beam or the electron beam it can be determined which regions of the inner part will be heated during operation and which parts remain relatively cold such that the outer part can be mechanically connected to these non-heated regions of the inner part.
According to a further embodiment of the electron emitter the inner part and the outer part are integrally formed from the same material such as for example a metal, a metal alloy or a metal sandwich combination. Suitable materials can be for example tungsten, tantalum and tungsten rhenium alloy. Forming the inner part and the outer part integrally from a common substrate may at the same time improve producibility and mechanical stability of the electron emitter. Furthermore, as the entire electron emitter is formed from an electrically conductive material, the inner part and the outer part are in electrical connection. Furthermore, being of the same material, all parts of the electron emitter have the same coefficient of expansion which may be advantageous in high temperature environments.
According to a further embodiment of the electron emitter, the inner part and the outer part are realized as separate devices wherein the outer part is attached to the inner part distant from the emission surface. For example, the inner part can be made from a first high temperature resistant material and may comprise the emission surface to be heated in operation in the centre and a border region not to be heated. The outer part can comprise a different material which is not necessarily high temperature resistant and can be attached to the border region of the inner part.
According to a further embodiment, the emission surface of the inner part and the surrounding surface of the outer part are arranged in a same plane. In such arrangement, the electron emitter can be fabricated for example from a simple flat film or sheet substrate wherein the surrounding surface is separated from the heatable emission surface only by small slits or gaps which may be fabricated for example by lasering or wire erosion. The thickness of such sheet may be for example in the range of a few hundred micrometers. Having a completely flat surface including the emission surface and the surrounding surface, an electron emitter according to this embodiment may be advantageous in order to obtain an undistorted electrical field between the emission surface and a remote anode.
According to a further embodiment, the surrounding surface extends out of the plane of the emission surface. For example, the surrounding surface can be laterally continuous to the emission surface in a region directly adjacent to the emission surface but then bent out of the plane of the emission surface. Alternatively, the outer part including the surrounding surface can for example be attached on top of the border region of the inner part such that the surrounding surface extends in a plane parallel to the plane of the emission surface. Such different geometries of the surrounding surface may allow different electron-optical behaviours of the electron emitter.
According to a second aspect of the invention, an X-ray source including a thermionic electron emitter as described above is provided. Due to the advantageous properties of the thermionic electron emitter such as homogeneous electron emission, the X-ray source may reveal superior properties with respect to X-ray beam homogeneity, achievable tube current, achievable minimal focal spot size and achievable minimal response time. Apart from the inventive electron emitter, the X-ray source may comprise an anode to establish an electrical field between the electron emitter serving as a cathode and a target for generating the X-ray beam. Furthermore, electron optics may be provided.
It has to be noted that embodiments of the invention are described with reference to different subject matters. In particular, some embodiments are described with reference to the electron emitter whereas other embodiments are described with reference to the X-ray source. However, a person skilled in the art will gather from the above and the following description that, unless other notified, in addition to any combination of features belonging to one type of subject matter also any combination between features relating to different subject matters is considered to be disclosed with this application.
The aspects defined above and further aspects, features and advantages of the present invention can be derived from the examples of embodiments to be described hereinafter and are explained with reference to the examples of embodiment. The invention will be described in more detail hereinafter with reference to examples of embodiment but to which the invention is not limited.
a, 1b show prior art thermionic electron emitters.
a, 3b illustrate the change in an electrical field above the arrangement of
a, 5b illustrate different configurations of the electrical field for different states of thermal expansion of a terminal supporting the electron emitter shown in
The illustration in the drawings is schematically only. It is noted that in different figures, similar or identical elements are provided with the same reference signs or with reference signs which are different from the corresponding reference signs only within the first digit.
In the drawing, the emission surface 3 is shown with different hatchings wherein a dense hatching indicates a higher temperature during operation when a current is flowing through the emission surface whereas a less dense hatching indicates a lower temperature during operation. It can be seen that at the centre between the two connection points 5 there is the highest temperature whereas in the border regions the temperature remains lower.
Accordingly, the terminals connected to the connection points 5 and the structured emission surface in between the connection points 5 serve as a heating arrangement 20 for heating the emission surface 3 to a temperature for thermionic electron emission. The connection points 5 itself define the border of the emission surface. Between the two connection points 5 the surface of the inner part 2 is actively heated by inducing electrical heating current within the emission surface which is structured to small conduction paths. Outside this emission surface, i.e. at a region opposite to the emission surface with respect to the connection points 5, the inner part 2 is not actively heated and is therefore significantly cooler than within the emission surface. This cooler region outside and remote from the emission surface 3 can be used as connection region 10 for mechanically connecting the outer part 4 to the inner part 2.
In the embodiment of
In order to prevent an electrical current to flow from a left side connection point 5 via the outer part 4 to a right side connection point, the outer part 5 is separated by a gap 12 in its middle section. This gap may have a width of about 0.5 mm. Furthermore, in order to prevent both a short circuit between the emission surface 3 and the surrounding surface 6 of the outer part 4 and to prevent thermal contact between the emission surface and the surrounding surface, a narrow slit is formed within the electron emitter partly separating the emission surface 3 from the surrounding surface 6 by a gap 14.
In the embodiment shown in
In a non-limiting attempt to recapitulate the above-described embodiments of the present invention one could state: the core of the invention may be seen in substituting those parts of the cathode cup which are relevant for the emission and focusing behaviour of the emitting flat emitter parts and which are influenced from different thermal expansion of the cup body and terminals by thin metal sheets which may be fixed to the same terminals as the emitting flat emitter part but kept on a lower, non-emitting temperature. All temperature changes within such a cathode setup lead to the same shift of the emitting part and the additional part and the well-defined relative position of both parts which significantly influences the electron emitter and the optical characteristics, maintains.
It should be noted that the term “comprising” does not exclude other elements or steps and the “a” or “an” does not exclude a plurality. Also elements described in association with different embodiments may be combined. It should also be noted that reference signs in the claims should not be construed as limiting the scope of the claims.
Number | Date | Country | Kind |
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07113050 | Jul 2007 | EP | regional |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/IB2008/052868 | 7/17/2008 | WO | 00 | 1/22/2010 |
Publishing Document | Publishing Date | Country | Kind |
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WO2009/013677 | 1/29/2009 | WO | A |
Number | Name | Date | Kind |
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6426587 | Hell et al. | Jul 2002 | B1 |
6464551 | Lipkin et al. | Oct 2002 | B1 |
6646366 | Hell et al. | Nov 2003 | B2 |
20030025429 | Hell et al. | Feb 2003 | A1 |
20060233307 | Dinsmore | Oct 2006 | A1 |
Number | Date | Country |
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1211725 | Mar 1966 | DE |
10135995 | Feb 2003 | DE |
Number | Date | Country | |
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20100195797 A1 | Aug 2010 | US |