THERMOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING THE SAME

Abstract

There is provided a thermoelectric conversion module comprising a first insulated substrate, a plurality of columnar p-type and n-type semiconductor thermoelectric transducers alternately arranged on the first insulated substrate, a second insulated substrate arranged so as to face the first insulation with interposition of the semiconductor thermoelectric transducers, first electrodes arranged between the first insulated substrate and the respective semiconductor thermoelectric transducers, and second electrodes arranged between the second insulated substrate and the respective semiconductor thermoelectric transducers, the first and second electrodes electrically connecting the p-type and n-type semiconductor thermoelectric transducers in series, and a glass film coated on the exposed surface of each first electrode at the first insulated substrate side and on a part of the exposed surfaces of the p-type and n-type semiconductor thermoelectric transducers directed from the first electrode to the second electrode.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a perspective view showing a thermoelectric conversion module according to an embodiment of the invention;

FIG. 2 is a cross section taken along the line II-II in FIG. 1; and

FIG. 3 is an exploded perspective view for describing a method of manufacturing the thermoelectric conversion module according to the embodiment.

Claims

1. A thermoelectric conversion module comprising: a first insulated substrate;plural columnar p-type and n-type semiconductor thermoelectric transducers alternately arranged on the first insulated substrate;a second insulated substrate arranged so as to face the first insulated substrate with interposition of the semiconductor thermoelectric transducers;first electrodes arranged between the first insulated substrate and the respective semiconductor thermoelectric transducers, and second electrodes arranged between the second insulated substrate and the respective semiconductor thermoelectric transducers, the first and second electrodes electrically connecting the p-type and n-type semiconductor thermoelectric transducers in series; anda glass film which covers the exposed surface of each first electrode at the first insulated substrate side and a part of the exposed surfaces of the p-type and n-type semiconductor thermoelectric transducers directed from the first electrode to the second electrode.

2. The thermoelectric conversion module according to claim 1, wherein the first and second insulated substrates are made of silicon nitride ceramics or aluminum nitride ceramics.

3. The thermoelectric conversion module according to claim 1, wherein at least one of the p-type and n-type semiconductor thermoelectric transducers is made of a filled skutterudite base material.

4. The thermoelectric conversion module according to claim 1, wherein at least one of the p-type and n-type semiconductor thermoelectric transducers is made of a half-Heusler base material.

5. The thermoelectric conversion module according to claim 1, wherein at least one of the p-type and n-type semiconductor thermoelectric transducers is made of an iron-silicide base material.

6. The thermoelectric conversion module according to claim 1, wherein the glass is a lead-free glass.

7. The thermoelectric conversion module according to claim 1, wherein the glass film has a difference of a thermal expansion coefficient of within ±15% from the thermal expansion coefficient of the semiconductor thermoelectric conversion member.

8. The thermoelectric conversion module according to claim 1, wherein the glass is a lead-free borosilicate zinc glass having a composition comprising 40 to 50% by weight of SiO2, 15 to 20% by weight of ZnO, 10 to 15% by weight of B2O3, 5 to 10% by weight of BaO, 15 to 20% by weight of K2O and 1 to 5% by weight of Al2O3.

9. The thermoelectric conversion module according to claim 1, wherein a part of the exposed surface of the semiconductor thermoelectric transducer coated with the glass film is 90% or less of the length of the columnar semiconductor thermoelectric transducers.

10. The thermoelectric conversion module according to claim 1, wherein a part of the exposed surface of the semiconductor thermoelectric transducer coated with the glass film is 80% or less of the length of the columnar semiconductor thermoelectric transducer.

11. The thermoelectric conversion module according to claim 1, wherein, when the exposed surface of the first electrode on the first insulated substrate is coated with the glass film, electric energy is generated by placing the first insulated substrate at a high temperature side.

12. A method of manufacturing a thermoelectric conversion module, comprising: preparing a frame containing a glass powder and an organic binder and having a plurality of through holes;preparing a first insulated substrate having a plurality of first electrodes arrayed and fixed on one surface thereof, and a second insulated substrate having a plurality of second electrodes arrayed and fixed on one surface thereof;alternately inserting a plurality of columnar p-type semiconductor thermoelectric transducers and a plurality of columnar n-type semiconductor thermoelectric transducers into the through holes of the frame to arrange the thermoelectric transducers;putting the plurality of first electrodes of the first insulated substrate on one end surfaces of the adjoining p-type and n-type semiconductor thermoelectric transducers, and putting the plurality of second electrodes of the second insulated substrate on the other end surface of the adjoining p-type and n-type semiconductor thermoelectric transducers such that the first and second electrodes electrically connect the p-type and n-type semiconductor thermoelectric transducers in series with one another via a solder material at which the plurality of p-type and n-type semiconductor thermoelectric transducers are inserted into the through holes of the frame, thereby forming an assembly; andheating the assembly to melt the solder material and the frame in the assembly, thereby applying molten frame to the exposed surfaces of the first electrodes at the first insulated substrate and to a part of the exposed surfaces of the p-type and n-type semiconductor thermoelectric transducers directed from the first electrode to the second electrode, and then solidifying molten frame and molten solder material, whereby solidifying solder material bonds the first and second electrodes to the respective end faces of the p-type and n-type semiconductor thermoelectric transducers.

13. The method according to claim 12, wherein the glass powder is a lead-free borosilicate zinc glass powder having a composition comprising 40 to 50% by weight of SiO2, 15 to 20% by weight of ZnO, 10 to 15% by weight of B2O3, 5 to 10% by weight of BaO, 15 to 20% by weight of K2O and 1 to 5% by weight of Al2O3.

14. The method according to claim 12, wherein the organic binder is polyvinyl alcohol or paraffin.

15. The method according to claim 13, wherein the assembly is heated at a temperature in the range from 500 to 800° C.

16. The method according to claim 12 wherein at least one of the p-type and n-type semiconductor thermoelectric transducers is made of a filled skutterudite base material.

17. The method according to claim 12 wherein at least one of the p-type and n-type semiconductor thermoelectric transducers is made of a half-Heusler base material.

18. The method according to claim 12 wherein at least one of the p-type and n-type semiconductor thermoelectric transducers is made of an iron-silicide base material.

19. The method according to claim 12 wherein the first and second insulated substrates are made of silicon nitride ceramics or aluminum nitride ceramics.