This application relates to thermoelectric devices and modules used for thermal management of components and/or systems, including but not limited to batteries.
Power electronics and other electrical devices, such as batteries, can be sensitive to overheating, cold temperatures, extreme temperatures, and operating temperature limits. The performance of such devices may be diminished, sometimes severely, when the devices are operated outside of recommended temperature ranges. In semiconductor devices, integrated circuit dies can overheat and malfunction. In batteries, including, for example, batteries used for automotive applications in electrified or electrical vehicles, battery cells and their components can degrade when overheated or overcooled. Such degradation can manifest itself in reduced battery storage capacity and/or reduced ability for the battery to be recharged over multiple duty cycles. Furthermore, high performance batteries for use in large systems (including, for example, lithium based batteries used in electrical vehicles) have certain properties (e.g., charging characteristics) and/or safety-related events (e.g., potential fires due to over-temperature conditions) that make thermal management of the batteries and/or containment system desirable.
In certain embodiments, a thermoelectric device is provided. The thermoelectric device comprises a thermally conductive first plate and a plurality of thermoelectric sub-assemblies. The first plate comprises a layer comprising a plurality of electrically conductive portions and a plurality of electrically insulating portions separating the electrically conductive portions from one another. Each thermoelectric sub-assembly of the plurality of thermoelectric sub-assemblies comprises a thermally conductive second plate and a plurality of thermoelectric elements in a region between the first plate and the second plate. The plurality of thermoelectric elements is in electrical communication with the electrically conductive portions of the first plate, in electrical communication with electrically conductive portions of the second plate, and in thermal communication with the first plate and the second plate. At least some of the electrically conductive portions of the first plate are positioned at least partially outside the region, in electrical communication with the plurality of thermoelectric sub-assemblies, and comprise a first electrically conductive portion and a second electrically conductive portion. The first electrically conductive portion is configured to be in electrical communication with an input electrical conduit and the second electrically conductive portion is configured to be in electrical communication with an output electrical conduit. The first electrically conductive portion and the second electrically conductive portion are positioned at a first edge of the first plate without a thermoelectric sub-assembly of the plurality of thermoelectric sub-assemblies between the first electrically conductive portion and the second electrically conductive portion.
In certain embodiments, a thermoelectric module for thermally conditioning a component is provided. The module comprises the thermoelectric device as described herein and first and second heat spreaders spaced apart from one another and configured to respectively provide cold and hot sides and to be mechanically coupled together by at least one fastener. The first and second heat spreaders are operatively engaged with the thermoelectric device. The module further comprises a material arranged between the first and second heat spreaders.
In certain embodiments, a method of fabricating a thermoelectric device is provided. The method comprises providing a first plate comprising an electrically conductive layer. The method further comprises removing portions of the electrically conductive layer to form a first electrically conductive portion, a second electrically conductive portion, and a plurality of third electrically conductive portions. The first electrically conductive portion is configured to be in electrical communication with an input electrical conduit and a series electrical circuit comprising a plurality of thermoelectric sub-assemblies. The second electrically conductive portion is configured to be in electrical communication with an output electrical conduit and the series electrical circuit. The plurality of third electrically conductive portions is configured to be in electrical communication and in thermal communication with a plurality of thermoelectric elements of the plurality of thermoelectric sub-assemblies. The first electrically conductive portion and the second electrically conductive portion are positioned at a first edge of the first plate without the plurality of electrically conductive portions between the first electrically conductive portion and the second electrically conductive portion.
Certain embodiments described herein advantageously provide a thermoelectric device having circuitry that facilitates manufacture of the thermoelectric device and/or of a thermoelectric module comprising the thermoelectric device. For example, by having the circuitry arranged such that the input electrical conduit and output electrical conduit are in close proximity (e.g., next) to one another, the electrical conduits of certain embodiments can be run parallel to one another through the other structures of the thermoelectric module, and the process of connecting the electrical conduits to the thermoelectric device can be easier than if the two electrical conduits were spaced further apart from one another.
The thermoelectric device 100 of
In certain embodiments, each of the first plate 110 and the second plate 120 comprises a planar laminate structure (e.g., a printed circuit board or PCB) having one or more electrically conductive layers (e.g., copper; aluminum; metal; metal alloy or composite) and one or more electrically insulating layers (e.g., fiberglass; resin; polymer; fibrous material preimpregnated with a resin material such as epoxy). The one or more electrically conductive layers can be configured to provide electrical connections to the plurality of TE elements 130. For example, the layer 116 can comprises an electrically conductive layer of the first plate 110 wherein at least some of the electrically conductive portions 118 comprise electrically conductive pads on a surface of the first plate 110 in the region 132. The pads can be configured to be coupled (e.g., soldered) to the TE elements 130, and the pads can be in electrical communication with other pads of the first plate 110 (e.g., by electrically conductive lines formed by selective chemical etching of the electrically conductive layers and by electrically conductive vias formed through the electrically insulating layers). Similarly, at least some portions 122 of an electrically conductive layer of the second plate 120 can comprise electrically conductive pads on a surface of the second plate 120 in the region 132 which are configured to be coupled (e.g., soldered) to the TE elements 130, and the pads can be in electrical communication with other pads of the second plate 120 (e.g., by electrically conductive lines formed by selective chemical etching of the electrically conductive layers and by electrically conductive vias formed through the electrically insulating layers).
In certain embodiments, the first plate 110 has a planar parallelogram shape (e.g., rhombus shape; rectangular shape; square shape) with four edges (e.g., a rectangular shape with two shorter edges and two longer edges). The first plate 110 can have other planar shapes (e.g., polygonal) with other numbers of edges in accordance with certain embodiments described herein (e.g., triangular shapes with three edges; trapezoidal shapes with four edges; pentagonal shapes with five edges; hexagonal shapes with six edges; etc.). In certain embodiments, the second plate 120 has a planar parallelogram shape (e.g., rhombus shape; rectangular shape; square shape) with four edges 126 (e.g., a rectangular shape with two shorter edges and two longer edges). The second plate 120 can have other planar shapes (e.g., polygonal) with other numbers of edges 126 in accordance with certain embodiments described herein (e.g., triangular shapes with three edges; trapezoidal shapes with four edges; pentagonal shapes with five edges; hexagonal shapes with six edges; etc.).
In certain embodiments, the plurality of TE elements 130 comprises p-type TE elements and n-type TE elements in electrical communication with one another through a plurality of shunts (e.g., electrically conductive pads of the first plate 110 and the second plate 120). For example, the plurality of TE elements 130 can be arranged in a “stonehenge” configuration in which p-type and n-type TE elements alternate with one another and are in series electrical communication with one another by shunts (e.g., electrically conductive portions 118 of the first plate 110 and electrically conductive portions 122 of the second plate 120) which are alternately positioned on the first plate 110 and the second plate 120 such that electrical current can flow serially through the TE elements 130 and the shunts in a serpentine fashion. In certain embodiments, the plurality of TE elements 130 are in thermal communication with the first plate 110 through the shunts (e.g., electrically conductive pads) on the surface of the first plate 110 and in thermal communication with the second plate 120 through the shunts (e.g., electrically conductive pads) on the surface of the second plate 120. In certain embodiments, the region 132 containing the plurality of TE elements 130 is bounded by and includes (e.g., between) the first plate 110 and the second plate 120 and has a perimeter defined by the second plate 120 (e.g., the perimeter is coincident with the plurality of edges 126 of the second plate 120).
In certain embodiments, a top surface of the first plate 110 (e.g., a surface of the first plate 110 closest to the second plate 120) has a first surface area and a top surface of the second plate 120 (e.g., a surface of the second plate 120 farthest from the first plate 110) has a second surface area less than the first surface area. For example, each thermoelectric sub-assembly 114 of the plurality of thermoelectric sub-assemblies 114 can comprise a corresponding second plate 120 and a corresponding plurality of TE elements 130 (e.g., the plurality of second plates 120 are mounted to a common first plate 110), and the first plate 110 can have a surface area larger than the sum of the surface areas of the second plates 120. In certain embodiments, the first plate 110 and the second plate 120 are spaced from one another by a gap having a gap height. For example, the gap between the top surface of the first plate 110 and a bottom surface of the second plate 120 (e.g., a surface of the second plate 120 closest to the first plate 110) is equal to the height of the TE elements 130 within the region 132, as schematically illustrated by
In certain embodiments, the plurality of electrically conductive portions 118 of the layer 116 comprises an electrically conductive material, examples of which include but are not limited to: copper; aluminum; metal; metal alloy or composite, and the plurality of electrically insulating portions 119 of the layer 116 does not contain an electrically conductive material. For example, the layer 116 can comprise a copper layer from which some of the copper has been removed (e.g., etched) such that the electrically conductive portions 118 comprise copper remaining after this removal (e.g., etching) from the layer 116, and the electrically insulating portions 119 comprise portions of the layer 116 from which the electrically conductive material (e.g., copper) has been removed (e.g., etched), so the portions 119 comprise etched portions of the layer 116.
In certain embodiments, at least some of the electrically conductive portions 118 of the first plate 110 are positioned at least partially outside the regions 132 and are in electrical communication with the plurality of thermoelectric sub-assemblies 114. For example, as schematically illustrated in
The electrically conductive portion 118c is in electrical communication with TE elements 130 of both thermoelectric sub-assemblies 114 of
In certain embodiments, one or more of the thermoelectric sub-assemblies 114 comprises at least one material (e.g., an electrically insulating material; epoxy; polymer) along at least a first portion of a perimeter of the region 132. The at least one material is in mechanical communication with the first plate 110 and the second plate 120, and the at least one material extends over at least some of the electrically conductive portions of the first plate 110 (e.g., over the electrically conductive portions 118a, 118b, 118c). The at least one material can also extend over the at least some of the electrically insulating portions 119 of the first plate 110.
The thermoelectric sub-assemblies 114 of
The thermoelectric device 100 comprises a thermally conductive first plate 110 in thermal communication with the first heat spreader 410 and a plurality of thermoelectric sub-assemblies 114. For example, the first plate 110 can comprise at least one hole 160 configured to have the at least one fastener extend therethrough and the plurality of thermoelectric sub-assemblies 114 can be arranged to have the at least one fastener between adjacent thermoelectric sub-assemblies 114 (see, e.g.,
In certain embodiments, the first heat spreader 410 and the second heat spreader 420 are configured to transfer heat away from the component to be thermally conditioned. For example, as schematically illustrated by
In certain embodiments, the material 430 comprises a compressible material (e.g., polymer; plastic; rubber; fiberglass) and is configured to be at least partially compressed by the first heat spreader 410 and the second heat spreader 420 during assembly of the thermoelectric module 400 while keeping the first heat spreader 410 and the second heat spreader 420 from contacting one another. In certain embodiments, the material 430 generally surrounds the thermoelectric device 100 (e.g., as shown in
In certain embodiments, the thermoelectric module 400 comprises at least one seal (e.g., hermetic seal) at least partially surrounding a volume containing the thermoelectric elements 130 of the thermoelectric device 100. For example, the at least one seal can comprise a material (e.g., an electrically insulating material; epoxy; polymer) along at least a portion of a perimeter of the region 132 containing the thermoelectric elements 130. For another example, the at least one seal can comprise a material (e.g., epoxy; acrylic; polymer; silicone) between the first heat spreader 410 and the second heat spreader 420 and at least partially surrounding a volume containing the thermoelectric device 100 (e.g., potting a portion of the volume between the at least one first surface 412 of the first heat spreader 410 and the at least one first surface 422 of the second heat spreader 420. The material can be sufficiently rigid to provide mechanical strength to the thermoelectric module 400. In certain embodiments, additional material (e.g., epoxy; acrylic; polymer; silicone) is located and forms at least one seal between at least one screw head of the at least one fastener (not shown) and the at least one second surface 424 of the second heat spreader 420.
In an operational block 610, the method 600 comprises providing a first plate 110 comprising an electrically conductive layer 116. In an operational block 620, the method further comprises removing portions of the electrically conductive layer 116 to form a first electrically conductive portion 118a, a second electrically conductive portion 118b, and a plurality of third electrically conductive portions 118c. The first electrically conductive portion 118a is configured to be in electrical communication with an input electrical conduit 162a and a series electrical circuit 164 comprising a plurality of thermoelectric sub-assemblies 114. The second electrically conductive portion 118b is configured to be in electrical communication with an output electrical conduit 162b and the series electrical circuit 164. The plurality of third electrically conductive portions 118c is configured to be in electrical communication and in thermal communication with a plurality of thermoelectric elements 130 of the plurality of thermoelectric sub-assemblies 114. The first electrically conductive portion 118a and the second electrically conductive portion 118b are positioned at a first edge 112 of the first plate 110 without the plurality of third electrically conductive portions 118c between the first electrically conductive portion 118a and the second electrically conductive portion 118b.
In certain embodiments, removing portions of the electrically conductive layer 116 comprises forming a plurality of electrically insulating portions 119 separating the first electrically conductive portion 118a, the second electrically conductive portion 118b, and the plurality of third electrically conductive portions 118c from one another. For example, removing portions of the electrically conductive layer 116 can comprise etching the electrically conductive layer 116 to form the plurality of electrically conductive portions 118 and the plurality of electrically insulating portions 119.
In certain embodiments, the method 600 further comprises forming the plurality of thermoelectric sub-assemblies 114 on the first plate 110. For example, forming the plurality of thermoelectric sub-assemblies can comprise connecting the plurality of TE elements 130 in electrical communication and in thermal communication with the plurality of electrically conductive portions 118 of the first plate 110, and connecting a plurality of second plates 120 to the plurality of TE elements 130. Each thermoelectric sub-assembly can comprise a corresponding portion of the plurality of thermoelectric elements 130 in a region 132 between the first plate 110 and the corresponding second plate 120. In certain embodiments, the method 600 further comprises providing the second plates 120. For example, providing the second plates 120 can comprise etching an electrically conductive layer of the second plates to form the plurality of electrically conductive portions of the second plates 120.
In certain embodiments, connecting the plurality of TE elements 130 to the plurality of electrically conductive portions 118 of the first plate 110 and to the plurality of electrically conductive portions of the second plate 120 comprises applying solder to the electrically conductive portions 118 of the first plate 110 and to the electrically conductive portions of the second plate 120 and heating the solder to above a temperature above a melting temperature of the solder while the TE elements 130 are in contact with the solder. In certain embodiments, the method 600 further comprises applying a solder mask layer 170 over the first plate 110 such that the solder mask layer 170 does not overlie solder pad regions 174 of the electrically conductive first portions 118, and the solder can be applied to the solder pad regions 174. In certain embodiments, the method 600 further comprises depositing at least one material along at least a first a portion of a perimeter of the region 132, the at least one material in mechanical communication with the first plate 110 and the second plate 120 (e.g., to hermetically seal the TE elements 130; to provide additional structural rigidity to the thermoelectric assembly 100).
Discussion of the various embodiments herein has generally followed the embodiments schematically illustrated in the figures. However, it is contemplated that the particular features, structures, or characteristics of any embodiments discussed herein may be combined in any suitable manner in one or more separate embodiments not expressly illustrated or described. In many cases, structures that are described or illustrated as unitary or contiguous can be separated while still performing the function(s) of the unitary structure. In many instances, structures that are described or illustrated as separate can be joined or combined while still performing the function(s) of the separated structures. Various features and aspects of the disclosed embodiments can be combined with or substituted for one another. Any methods disclosed herein need not be performed in the order recited.
The ranges disclosed herein also encompass any and all overlap, sub-ranges, and combinations thereof. Language such as “up to,” “at least,” “greater than,” “less than,” “between,” and the like includes the number recited. With respect to the use of any plural and/or singular terms herein, those having skill in the art can translate from the plural to the singular and/or from the singular to the plural as is appropriate to the context and/or application. The various singular/plural permutations may be expressly set forth herein for sake of clarity. In general, terms used herein are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). If a specific number is intended, such an intent will be explicitly recited in the embodiment, and in the absence of such recitation, no such intent is present.
Various embodiments have been described above. Although the inventions have been described with reference to these specific embodiments, the descriptions are intended to be illustrative and are not intended to be limiting. Various modifications and applications may occur to those skilled in the art without departing from the spirit and scope of the inventions as defined in the appended claims.
Any and all applications for which a foreign or domestic priority claim is identified in the Application Data Sheet as filed with the present application are incorporated by reference and made a part of this specification.
Number | Date | Country | |
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62712112 | Jul 2018 | US | |
62712131 | Jul 2018 | US | |
62715709 | Aug 2018 | US | |
62712143 | Jul 2018 | US |