Any and all applications for which a foreign or domestic priority claim is identified in the Application Data Sheet as filed with the present application are incorporated by reference and made a part of this specification.
Field
This disclosure relates to the field of thermoelectric devices and, in particular, to improved thermoelectric device enclosures and assemblies.
Description of Related Art
Certain thermoelectric (TE) devices, sometimes called Seebeck-Peltier devices, Peltier devices, thermoelectric engines, thermoelectric heat exchangers or thermoelectric heat pumps, employ the Peltier effect to transfer heat against the temperature gradient when an electric voltage is applied across certain types of materials, sometimes called thermoelectric materials or compounds. Examples of TE materials include, for example, doped PbTe, Bi2Te3, and other materials with a relatively high Seebeck coefficient. The Seebeck coefficient is a value that relates a temperature difference across a region of material with a corresponding electric potential difference across the region of material.
The efficiency of at least some TE devices can be improved by removing thermal energy from areas of a device where thermal energy accumulates due to, for example, the Peltier effect. Removal of such thermal energy can be accomplished, for example, by moving a waste fluid flow, such as air, across high temperature portions of TE materials or heat transfer structures attached to said high temperature portions. Furthermore, TE devices sometimes move a main fluid flow across low temperature portions of TE materials or heat transfer structures attached to said low temperature portions to remove heat from the main fluid flow. The main fluid flow may be used, for example, to cool enclosed spaces, materials, or equipment.
TE devices are typically housed in an enclosure that routes the fluid flows across a heat exchanger operatively coupled to the TE materials. Existing TE device enclosures and assemblies suffer from various drawbacks.
Certain embodiments provide an assembly for a thermoelectric heat pump including: an enclosure with a plurality of substantially thermally isolated fluid channels formed therein; a first thermoelectric module operatively connected to the enclosure, the first thermoelectric module including a main junction and a waste junction; an elongate heat transfer member extending from at least one of the main junction and the waste junction of the first thermoelectric module into at least one of the plurality of fluid channels; at least one gap dividing the elongate heat transfer member into a plurality of heat transfer sections that are at least partially thermally isolated from adjacent heat transfer sections by the at least one gap, the at least one gap oriented such that fluid flows across the at least one gap as fluid flows through a fluid channel of the thermoelectric heat pump; and at least one bridge member extending across the at least one gap, the at least one bridge member connecting at least one of the plurality of heat transfer sections to a second heat transfer section.
The assembly can further include a second thermoelectric module operatively connected to the enclosure, the second thermoelectric module having a second main junction and a second waste junction. The first thermoelectric module and the second thermoelectric module can be arranged in substantially parallel planes, and the first and second thermoelectric modules can be oriented such that the waste junction of the first thermoelectric module and the second waste junction of the second thermoelectric module face towards one another. The elongate heat transfer member can extend from the waste junction of the first thermoelectric module to the second waste junction of the second thermoelectric module. Alternatively, the elongate heat transfer member can extend about half the distance from the waste junction of the first thermoelectric module to the second waste junction of the second thermoelectric module.
In some embodiments, the at least one bridge member is formed by removing portions of an elongate heat transfer member. The assembly can further include at least a second bridge member connecting the second heat transfer section to a third heat transfer section, wherein the at least one bridge member and the second bridge member are disposed at staggered positions along the at least one gap.
The assembly can have a heat transfer region including a plurality of rows, each of the plurality of rows including a plurality of thermoelectric modules. The plurality of fluid channels can include a waste fluid channel configured to be in substantial thermal communication with a high temperature portion of the heat transfer region and a main fluid channel configured to be in substantial thermal communication with a low temperature portion of the heat transfer region. A channel enclosure can provide a barrier between fluid in the waste fluid channel and fluid in the main fluid channel. The waste fluid channel and the main fluid channel can be positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the channel enclosure are substantially minimized at corresponding positions along the channels.
Some additional embodiments provide a method of manufacturing a thermoelectric heat pump. The method can include providing an enclosure with a plurality of substantially thermally isolated fluid channels formed therein; operatively connecting a first thermoelectric module to the enclosure, the first thermoelectric module including a main junction and a waste junction; disposing an elongate heat transfer member within the enclosure, the elongate heat transfer member extending from at least one of the main junction and the waste junction of the first thermoelectric module into at least one of the plurality of fluid channels; providing at least one gap in the elongate heat transfer member, the at least one gap dividing the elongate heat transfer member into a plurality of heat transfer sections that are at least partially thermally isolated from adjacent heat transfer sections by the at least one gap, the at least one gap oriented such that fluid flows across the at least one gap as fluid flows through a fluid channel of the thermoelectric heat pump; and disposing at least one bridge member across the at least one gap, the at least one bridge member connecting at least one of the plurality of heat transfer sections to a second heat transfer section.
The method can further include operatively connecting a second thermoelectric module operatively connected to the enclosure, the second thermoelectric module having a second main junction and a second waste junction. In certain embodiments, the method includes arranging the first thermoelectric module and the second thermoelectric module in substantially parallel planes and orienting the first and second thermoelectric modules such that the waste junction of the first thermoelectric module and the second waste junction of the second thermoelectric module face towards one another. The method can also include disposing the elongate heat transfer member between the waste junction of the first thermoelectric module and the second waste junction of the second thermoelectric module. In some embodiments, the elongate heat transfer member is disposed such that the elongate heat transfer member extends about half the distance from the waste junction of the first thermoelectric module to the second waste junction of the second thermoelectric module.
The method can include forming the at least one bridge member by removing portions of the elongate heat transfer member. The at least one bridge member can join a plurality of separate heat transfer sections to form an elongate heat transfer member.
In certain embodiments, the method includes disposing at least a second bridge member between the second heat transfer section and a third heat transfer section. The at least one bridge member and the second bridge member can be disposed at staggered positions along the at least one gap.
Certain further embodiments provide a method of operating a thermoelectric heat pump. The method can include directing a fluid stream into at least one of a plurality of substantially thermally isolated fluid channels formed in an enclosure; directing the fluid stream toward a first thermoelectric module operatively connected to the enclosure, the first thermoelectric module including a main junction and a waste junction; directing the fluid stream across an elongate heat transfer member extending from at least one of the main junction and the waste junction of the first thermoelectric module into the at least one of the plurality of fluid channels; and directing the fluid stream across at least one gap dividing the elongate heat transfer member into a plurality of heat transfer sections that are at least partially thermally isolated from adjacent heat transfer sections by the at least one gap. At least one bridge member can be disposed across the at least one gap, the at least one bridge member connecting at least one of the plurality of heat transfer sections to a second heat transfer section.
Some embodiments provide an assembly for a thermoelectric heat pump including a heat transfer region including a plurality of rows, each of the plurality of rows including a plurality of thermoelectric modules, each of the thermoelectric modules including a high temperature junction and a low temperature junction; a waste fluid channel configured to be in substantial thermal communication with a high temperature portion of the heat transfer region; a main fluid channel configured to be in substantial thermal communication with a low temperature portion of the heat transfer region; and a channel enclosure providing a barrier between fluid in the waste fluid channel and fluid in the main fluid channel.
The waste fluid channel and the main fluid channel can be positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the channel enclosure are substantially minimized at corresponding positions along the channels. The high temperature portion of the heat transfer region can include a first heat exchanger operatively connected to at least one high temperature junction of the plurality of thermoelectric modules. The first heat exchanger can include at least one gap dividing the heat exchanger into a plurality of heat transfer sections that are at least partially thermally isolated from adjacent heat transfer sections by the at least one gap, the at least one gap oriented such that fluid flows across the at least one gap as fluid flows through the waste fluid channel of the thermoelectric heat pump; and at least one bridge member extending across the at least one gap, the at least one bridge member connecting at least one of the plurality of heat transfer sections to a second heat transfer section.
The low temperature portion of the heat transfer region can include a second heat exchanger operatively connected to at least one low temperature junction of the plurality of thermoelectric modules. Thermal interface material can be disposed between the heat conducting fins and junctions of the plurality of thermoelectric modules. The first heat exchanger can include an arrangement of fins spaced at regular intervals. The arrangement of fins in the first heat exchanger can provide a different heat transfer capability than the second heat exchanger. The first heat exchanger can include at least one heat conducting fin that has a thickness greater than the thickness of heat conducting fins of the second heat exchanger.
The first heat exchanger can include at least one overhanging portion that protrudes past the at least one high temperature junction and the second heat exchanger includes at least one overhanging portion that protrudes past the at least one low temperature junction. The channel enclosure can include projections configured to nestle between the overhanging portions of the first heat exchanger and the overhanging portions of the second heat exchanger, the projections configured to contact the heat transfer region at boundaries between high temperature portions of the heat transfer region and low temperature portions of the heat transfer region such that leakage between the waste fluid channel and the main fluid channel at the junction between the channel enclosure and the heat transfer region is substantially minimized.
The channel enclosure can be constructed from a material system having at least a portion with a thermal conductivity not greater than approximately 0.1 W/(m×K). At least a portion of the material can include a foamed material, a composite structure, or a copolymer of polystyrene and polyphenylene oxide.
At least some portions of the channel enclosure adjacent to the heat transfer region can be bonded to the heat transfer region in substantially airtight engagement. A material selected from the group consisting of an adhesive, a sealant, a caulking agent, a gasket material, or a gel can be disposed between the channel enclosure and portions of the heat transfer region contacted by the channel enclosure. The material can include at least one of silicone or urethane.
The channel enclosure can include projections configured to contact the heat transfer region at boundaries between the high temperature portion of the heat transfer region and the low temperature portion of the heat transfer region such that leakage between the waste fluid channel and the main fluid channel at the junction between the channel enclosure and the heat transfer region is substantially minimized.
The assembly can include a first fan operatively connected to provide fluid flow in the waste fluid channel. A second fan can be operatively connected to provide fluid flow in the main fluid channel in a direction opposite the fluid flow in the waste channel.
A first row of thermoelectric modules can be electrically connected in parallel. A second row of thermoelectric modules can likewise be electrically connected in parallel. The first row and the second row can be electrically connected in series. One or more additional rows can have a plurality of thermoelectric modules electrically connected in parallel. The one or more additional rows can be electrically connected in series with one another, with the first row, and with the second row. The assembly can include a third row and a fourth row. Each row can include a plurality of thermoelectric modules electrically connected in parallel. In some embodiments, each of the plurality of rows includes four thermoelectric modules. The first row and the second row can be stacked close together.
The plurality of thermoelectric modules can be oriented such that a high temperature junction of a first thermoelectric module and a high temperature junction of a second thermoelectric module face towards one another. The first thermoelectric module and the second thermoelectric module can each contain an input terminal and an output terminal, the input terminal of the first thermoelectric module and the output terminal of the second thermoelectric module being disposed on a first side, and the output terminal of the first thermoelectric module and the input terminal of the second thermoelectric module being disposed on a second side.
In certain embodiments, the assembly is configured such that the thermoelectric heat pump continues to operate after one or more thermoelectric modules fails until each of the plurality of thermoelectric modules in a row fails.
The assembly can include at least one array connecting member configured to hold the plurality of rows together in a stack.
Each of the plurality of thermoelectric modules can include a first electric terminal and a second electric terminal. The assembly can include a conductor positioning apparatus having a first electrical conductor and a second electrical conductor disposed thereon. Positions of the first electrical conductor and the second electrical conductor can be fixed with respect to the conductor positioning apparatus. At least the first electrical conductor can be configured to electrically connect the first electric terminals of the thermoelectric modules in at least one of the plurality of rows to a first power supply terminal. At least the second electrical conductor can be configured to electrically connect the second electric terminals of the thermoelectric modules in at least one of the plurality of rows to at least one of a second power supply terminal or ground.
The conductor positioning apparatus can include an electrically insulating member. The first electrical conductor and the second electrical conductor can include electrically conductive traces deposited on the electrically insulating member.
The assembly can include a first clip positioned on a first end of the heat transfer region; a second clip positioned on a second end of the heat transfer region opposite the first end; and a bracket secured to the first clip and to the second clip, the bracket extending along a top side of the heat transfer region.
The first clip and the second clip have a shape configured to equalize forces applied across a length of the clip. In some embodiments, the first clip and the second clip are curved. The first clip and the second clip can include tabs configured to insert into slots formed in the bracket to provide secure engagement. The first clip and the second clip can include clip hooks, and the bracket can include bracket hooks. The clip hooks and bracket hooks can be configured to provide secure engagement when a rod is inserted between the clip hooks and the bracket hooks.
The heat transfer region can further include a plurality of elongate heat transfer members operatively connected to the plurality of thermoelectric modules. The bracket can include a spring element configured to allow a length of the bracket to stretch such that the bracket is configured to clamp the row of thermoelectric modules and the plurality of elongate heat transfer members in tight engagement. The spring element can include a depression formed at a position along the length of the bracket. In some embodiments, the spring element includes a shaped surface configured to flatten when tension is applied thereto.
The heat transfer region can further include a plurality of elongate heat transfer members operatively connected to the plurality of thermoelectric modules. The bracket can be configured to hold the row of thermoelectric modules and the plurality of elongate heat transfer members tightly together for at least ten years. The bracket can include a strip of fiberglass-reinforced tape. Thermal interface material can be disposed between the bracket and the thermoelectric modules.
In some embodiments, a plurality of ports for moving fluid into or out from the waste channel and the main channel are stacked in a first direction. In at least some of said embodiments, alternating high and low temperature portions of the heat transfer region are arranged in a second direction, where the second direction is substantially perpendicular to the first direction. In some embodiments, the high temperature portion of the heat transfer region includes a plurality of spatially separated high temperature regions. In some embodiments, the low temperature portion of the heat transfer region includes a plurality of spatially separated low temperature regions. In certain embodiments, thermoelectric modules are positioned and/or oriented to decrease or minimize the number of spatially separated high temperature regions and low temperature regions.
A TE heat pump includes one or more TE modules that transfer heat against the thermal gradient from one junction (e.g., a low-temperature junction or main junction) to another (e.g., a high-temperature junction or waste junction). One or more suitable TE materials can be used for this purpose. A first defined channel provides a passageway for waste fluid flow, where the fluid is placed in substantial thermal communication with the high-temperature junction. Fluid flowing in the first defined channel can remove heat from the high-temperature junction. In some embodiments, the waste channel is in communication with a fluid reservoir (e.g., a reservoir in the external environment, such as the atmosphere) or other heat sink. Using a fluid to assist in removal of thermal energy from the high-temperature junction can improve the efficiency of a TE heat pump. The waste channel can be enclosed by any suitable structure, such as, for example, a material that has a low coefficient of thermal conductivity, such as foam, or a structure that provides substantial thermal isolation between the passageway defined by the waste channel and portions of the TE heat pump other than the high-temperature junction(s). A suitable device, such as, for example, a mechanical fan, can be operatively connected to move fluid through the waste channel.
In some embodiments, a TE heat pump includes a second defined channel that provides a passageway for a main fluid flow, where the fluid is placed in substantial thermal communication with the low-temperature junction. The low-temperature junction can be configured to remove heat from fluid flowing in the main channel. In certain embodiments, the main channel is in thermal communication with an area, a physical component, or other matter to be cooled by the TE heat pump. Like the waste channel, the main channel can be configured to provide substantial thermal isolation between the passageway defined by the main channel and portions of the TE heat pump other than the low-temperature junction(s). A suitable device can be operatively connected to move fluid through the main channel. In some embodiments, the direction of fluid movement in the main channel is generally opposite the direction of fluid movement in the waste channel (for example, creating a fluid flow system through the heat pump enclosure including counter-flow of fluids through the main and waste channels). In alternative embodiments, the direction of fluid movement in the waste channel and main channel is substantially the same (for example, creating parallel flow through the heat pump enclosure).
In some heat pump configurations, the main channel can be substantially adjacent to or in close proximity with the waste channel. In certain embodiments, it is advantageous to decrease or minimize heat transfer between fluid in the waste channel and fluid in the main channel.
In the embodiment shown in
The channels 108, 110 formed by the guide 100 shown in
The heat pump 200 also includes a main channel 206 for a main fluid flow that passes through low-temperature regions 210 of the heat transfer region 202. The heat pump 200 removes thermal energy from the main fluid flow as it passes from the second end to the first end. One or more fans 214 can be used to move fluid from the second end, through the low-temperature heat transfer region 210, and to the first end, as indicated by the arrows shown adjacent to the main channel 206 in
The heat pump 200 can include an array of thermoelectric modules (TE modules) within the heat transfer region 202. For example, the device may contain between four and sixteen thermoelectric modules or another suitable number of modules, such as a number of modules appropriate for the application for which the heat pump 200 is intended. A door or panel (not shown) in the case of the heat pump can provide access to the internal components of the heat pump, including, for example, the air channels 204, 206, the fans 212, 214, and/or the TE modules.
One or more fans can be used to push or pull air through the device from a vent in an end of the device, for example. For example, the fans can pull or push air through the device from a first end and/or a second opposite end. As used in the context of fluid flow, the term “pull” broadly refers to the action of directing a fluid generally from outside the device to inside the device. The term “push” broadly refers to the action of directing a fluid generally from inside the device to outside the device. The fans can be positioned within a fan enclosure or another suitable housing. A channel enclosure or air guide 100 can be seated beneath the fan enclosure.
In some embodiments, the main side of the device 200 (for example, the side associated with the main fans 214) can be inserted into an enclosure, for example, in order to cool the interior of the enclosure. In some embodiments, the waste side of the device 200 (for example, the side associated with the waste fans 212) is exposed to the ambient air, a heat sink, a waste fluid reservoir, and/or a suitable region for expelling a waste fluid flow. In certain embodiments, waste fluid flow is prevented from entering the main channel. For example, the exhaust of the waste channel can be separated from the intake of the main channel by a wall, a barrier, or another suitable fluid separator.
In various embodiments described herein, fans can be configured to pull or push air through a TE device, and fans can be mounted in various positions in the TE device. The flow patterns inside the TE device can include substantially parallel flow, counter flow (e.g., flow in substantially opposite directions), cross flow (e.g., flow in substantially perpendicular directions), and/or other types of flow depending upon, for example, the fan direction and/or the position(s) in the TE device where the fans are mounted. In some embodiments, a TE device includes one or more waste fans for directing fluid flow through a waste channel and one or more main fans for directing fluid flow through a main channel. In certain embodiments, fans are positioned on the same end or on different ends of a device, where the end refers to a portion of the device on one side of a TE module. The following are example configurations and corresponding flow patterns:
In another embodiment shown in
As shown in
In some embodiments, fans 414 pull air in through the main side 422 of a heat pump 400 and direct the air into the main side channels, through main side heat exchanger fins (not shown), and the air exits at the opposite end through the port 416 of the main side 422. In some embodiments, fans 412 are mounted at the case surface of the waste side. The waste fans and/or the main fans can be mounted next to the housing wall. Fans can also be mounted adjacent to air holes or vents, such as, for example, port 416.
In some embodiments associated with the information shown in
Assemblies of TE modules can be stacked one on top of another to make a line of TE module assemblies when more than one TE module is used. Multiple TE modules may be used, for example, in order for a TE device to provide adequate cooling power for an enclosure, a piece of equipment, or some other space. In some embodiments, an array of TE module assemblies including multiple rows of TE module assemblies can be used to provide increased cooling power in a TE device. The channel enclosures disclosed herein can be used to route air or other fluids through the main side (for example, the side of the TE device that cools air) and the waste side (for example, the side that exhausts heated air). In some embodiments, a channel enclosure keeps the two air flows (for example, the main air flow and the waste air flow) from mixing.
In the embodiment shown in
In certain embodiments, the main fluid stream and the waste fluid stream are separated physically and thermally by the channel enclosure 702. The channel enclosure 702 can be made from a suitable thermal insulator, such as, for example, foam, a multi-layer insulator, aerogel, a material with low thermal conductivity (e.g., a material with thermal conductivity not greater than 0.1 W/(m×K)), another suitable material, or a combination of suitable materials. In some embodiments, the channel enclosure 702 includes projections 714 that separate the waste and main flows at junctions between the channel enclosure 702 and the TE module assemblies. In certain embodiments, one or more of the projections 714 has a feature 716 at its end that nestles between heat exchanger fins 706, 712 that overhang the TE modules 708. In some embodiments, the feature 716 includes a trapezoidal (or other suitably shaped) section of foam or another suitable material that is between about six and about eight millimeters in width. A sealant, such as, for example, caulking, gel, silicone, or urethane can be carefully applied to portions of the channel enclosure 702 that contact the TE modules 708.
In the embodiment shown in
In some embodiments, the heat transfer members 706, 712 are secured in place using a thermally conductive grease to achieve good thermal contact with the module 708 surface. In some embodiments (e.g., when the fins of heat transfer members 706, 712 are divided into multiple fin sections 802), certain steps may be taken to ensure that the fin sections 802 remain in fixed relative positions with respect to one another. For example, in certain embodiments, the fin sections 802 of each fin are made in one piece (as discussed in more detail below), and the fins can be clamped together and attached to the modules 708 using grease.
In certain embodiments, the efficiency of the TE device 700 is improved when thermal isolation in the direction of flow is increased. Using heat transfer members 706, 712 divided into multiple segments 802 can increase the thermal isolation within the heat transfer members 706. In some embodiments, using heat transfer members 706, 712 made of high thermal conductivity material (e.g., Al or Cu) without multiple segments 802 can cause the heat transfer member 706, 712 to have little thermal isolation in the direction of fluid flow.
In some embodiments, the positioning of the bridges 806 is designed to stiffen the structure of the fins 800. For example, in certain embodiments, the positions of the bridges 806 along the segments 802 are staggered at an interval 810 so that they do not line up with one another through the width of the fins 800. In some embodiments, the stagger interval 810a in the position of bridges 806 on a main fin 800a differs from the stagger interval 810b in the position of bridges 806 on a waste fin 800b.
The thermoelectric module assembly 950 shown in
In some embodiments, heat is pumped from one side to the other by the action of the TE module when electricity is applied to the module. The conductive materials within the module have a non-zero electrical resistivity, and the passage of electricity through them generates heat via Joule heating. In some embodiments, the main side is cooled by pumping heat from the main side to the waste side. Joule heating within the module generates heat that is passed to the main side and the waste side. For example, half of the Joule heating may go to the waste side and half to the main side. Consequentially, the heat being added to the waste heat exchange fluid can be greater than the heat being removed from the main side heat exchange fluid. In some embodiments, creating larger fluid flow on the waste side than on the main, for example, by providing waste side fins that are bigger and less dense than main side fins, can allow higher flow rate on the waste side without excessive restriction of waste fluid flow.
In the embodiment shown in
Returning to
In some embodiments, the rows 1002a-c of modules are configured to be stacked close together in a vertical direction. For example, the wires 1102a-b can be substantially thin or ribbon-like to facilitate close stacking of module rows. The rows 1002a-c shown in
In some embodiments, a method of assembling TE modules includes taping flat copper conducting strips across a row of TE modules held together by tape. Module wires can be attached to the copper strips by bending them over the strips, cutting the wires, stripping the wires, and soldering the wires to the flat copper strips. Additional rows of TE modules can be similarly assembled and stacked together. The array can be held together by taping the array around its periphery.
In some embodiments, when the rows 1002a-c are stacked on top of one another, the surfaces of the heat exchangers do not actually touch. Instead, they can be separated by the thickness of the wire insulation of the module wires 1104a-b that are bent over to be attached (for example, soldered) to the metal strips or contacts 1108. In some embodiments, these separations create leak paths by which fluid can pass through the array of modules without being heated or cooled. Furthermore, the air paths can also leak from one side of the heat pump to the other (for example, from one air channel to another). In some embodiments, the cracks are filled with a sealing agent such as, for example, silicone rubber sealant, caulk, resin, or another suitable material.
Some embodiments provide an assembly that substantially eliminates leak paths without the use of sealing agents. In addition, some embodiments provide a method of assembling two dimensional arrays of TE module assemblies with improved consistency and dimensional control. Some embodiments provide a TE device assembly with robust mechanical strength and integrity. Some embodiments reduce the likelihood of damage to heat exchange members within module assemblies and reduce the likelihood of wiring errors while manufacturing module assemblies.
In further embodiments, a method of assembling an array of TE modules includes providing one-piece segmented fins having narrow connecting tabs between adjacent fin sections. Thermal interface material can be applied between the fins and TE materials. The fins can be secured to the TE materials using clips, such as, for example, the clip 900 shown in
Array assemblies can include two kinds of TE modules, having different starting pellet polarity. The modules can include identifying marks for distinguishing between the different kinds. The identifying marks can include, such as, for example, different module wire colors or another distinguishing feature. A printed circuit board (PCB) can be positioned beside each row of modules and can provide electrical conductors for supplying power to the modules. Wires (such as, for example, substantially thin or flat wires) soldered to PCB pads can provide connections between rows of modules. Other wires can be soldered to PCB holes to connect a power supply to the array of modules. In some embodiments, the channel enclosure includes a recess, an aperture, or a cavity that provides a space for power supply lead wires to be connected to the array of modules.
In certain embodiments, at least some heat exchangers in a row of TE modules are approximately twice as wide as other heat exchangers. For example, some heat exchangers can extend from a surface of a first TE module to an opposite surface of a second adjacent TE module in the same row. Heat exchangers positioned at the ends of the row can be narrower. In other embodiments, all heat exchangers in a row of TE modules are substantially the same width. In further embodiments, waste heat exchangers and main heat exchangers have different widths.
Although the invention has been described in terms of particular embodiments, many variations will be apparent to those skilled in the art. All such variations are intended to be included within the scope of the disclosed invention and the appended claims.
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Number | Date | Country | |
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20140325997 A1 | Nov 2014 | US |
Number | Date | Country | |
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61087611 | Aug 2008 | US | |
61058482 | Jun 2008 | US |
Number | Date | Country | |
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Parent | 12477806 | Jun 2009 | US |
Child | 14220556 | US |