This application relates to thermoelectric devices and modules used for thermal management of components and/or systems, including but not limited to batteries.
Power electronics and other electrical devices, such as batteries, can be sensitive to overheating, cold temperatures, extreme temperatures, and operating temperature limits. The performance of such devices may be diminished, sometimes severely, when the devices are operated outside of recommended temperature ranges. In semiconductor devices, integrated circuit dies can overheat and malfunction. In batteries, including, for example, batteries used for automotive applications in electrified or electrical vehicles, battery cells and their components can degrade when overheated or overcooled. Such degradation can manifest itself in reduced battery storage capacity and/or reduced ability for the battery to be recharged over multiple duty cycles. Furthermore, high performance batteries for use in large systems (including, for example, lithium based batteries used in electrical vehicles) have certain properties (e.g., charging characteristics) and/or safety-related events (e.g., potential fires due to over-temperature conditions) that make thermal management of the batteries and/or containment system desirable.
In certain embodiments, a thermoelectric module assembly for thermally conditioning a component is provided. The assembly comprises first and second heat spreaders spaced apart from one another. The assembly further comprises at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly comprises a printed circuit board comprising a plurality of electrical conduits. The at least one thermoelectric sub-assembly further comprises a plurality of thermoelectric devices. Each thermoelectric device of the plurality of thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.
In certain embodiments, a thermoelectric system is provided. The system comprises a printed circuit board comprising a plurality of electrically conductive first tabs at a surface of the printed circuit board. The system further comprises at least one thermoelectric device mechanically coupled to the printed circuit board. The at least one thermoelectric device comprises a thermally conductive first plate, a thermally conductive second plate, and a plurality of thermoelectric elements in thermal communication with and in a region between the first plate and the second plate. The second plate comprises a first portion extending beyond a perimeter of the first plate and over an edge of the printed circuit board and over two first tabs of the plurality of first tabs. The first portion comprises two electrically conductive second tabs, each of the two second tabs in mechanical and electrical communication with a corresponding first tab of the two first tabs.
In certain embodiments, a thermoelectric system is provided. The system comprises a plurality of thermoelectric devices and a printed circuit board. Each thermoelectric device of the plurality of thermoelectric devices comprises a thermally conductive first plate, a thermally conductive second plate, and a plurality of thermoelectric elements in thermal communication with and in a region between the first plate and the second plate. The printed circuit board comprises a plurality of first electrical conduits and a plurality of second electrical conduits. The first electrical conduits are in electrical communication with the thermoelectric elements of the plurality of thermoelectric devices, and the second electrical conduits are in electrical communication with at least one thermal sensor on at least one thermoelectric device of the plurality of thermoelectric devices and/or on the printed circuit board.
In certain embodiments, a method of fabricating at least one thermoelectric sub-assembly comprising a printed circuit board and a plurality of thermoelectric devices is provided. The method comprises providing the printed circuit board which comprises a plurality of electrical conduits and a plurality of electrically conductive first tabs in electrical communication with the plurality of electrical conduits. The method further comprises providing the plurality of thermoelectric devices, each thermoelectric device comprises a first end portion and a second end portion. The second end portion is opposite to the first end portion, and the first end portion comprises at least two electrically conductive second tabs. The method further comprises mechanically coupling the at least two second tabs of each thermoelectric device of the plurality of thermoelectric devices to corresponding first tabs of the printed circuit board such that the at least two second tabs are in electrical communication with the corresponding first tabs and the second end portion is spaced from the printed circuit board.
In certain embodiments, a method of fabricating a thermoelectric device comprising a first plate, a second plate, and a plurality of thermoelectric elements between and in electrical communication between the first plate and the second plate is provided. The method comprises providing the thermoelectric device. The second plate extends beyond a perimeter of the first plate along a portion of the thermoelectric device. The method further comprises applying a first sealant between the first plate and the second plate along the portion.
In certain embodiments, the PCB 200 comprises a planar laminate structure having one or more electrically conductive layers (e.g., copper; aluminum; metal; metal alloy or composite) and one or more electrically insulating layers (e.g., fiberglass; resin; polymer; fibrous material preimpregnated with a resin material such as epoxy; solder mask). The one or more electrically conductive layers can be configured to provide the plurality of electrical conduits 210 which are in electrical communication with the plurality of TEDs 300. For example, portions of an electrically conductive layer can be electrically insulated from one another (e.g., with solder mask, plastic coating, conformal coating), and each of these portions can be in electrical communication with a corresponding TED 300, as shown schematically in
In certain embodiments, at least some of the TEDs 300 are in series electrical communication with one another. For example,
In certain embodiments, each TED 300 of the plurality of TEDs 300 comprises a thermally conductive first plate 330, a thermally conductive second plate 340, and a plurality of thermoelectric (TE) elements 350 in thermal communication with the first plate 330 and the second plate 340 and in a region between the first plate 330 and the second plate 340. In certain embodiments, each of the first plate 330 and the second plate 340 comprises a planar laminate structure (e.g., a printed circuit board) having one or more electrically conductive layers (e.g., copper; aluminum; metal; metal alloy or composite) and one or more electrically insulating layers (e.g., fiberglass; resin; polymer; fibrous material preimpregnated with a resin material such as epoxy). The one or more electrically conductive layers can be configured to provide electrical connections to the plurality of TE elements 350. For example, an outer electrically conductive layer of the one or more electrically conductive layers can comprise electrically conductive pads configured to be coupled (e.g., soldered) to the TE elements 350, and the pads can be in electrical communication with other pads (e.g., by electrically conductive lines formed by selective chemical etching of the electrically conductive layers and by electrically conductive vias formed through the electrically insulating layers). In certain embodiments, at least one TED 300 of the plurality of TEDs 300 has one or more heat radiative elements (e.g., fins) on at least one side of the TED 300.
In certain embodiments, each of the first plate 330 and the second plate 340 has an elongate shape, for example, a planar parallelogram shape (e.g., rhombus shape; rectangular shape; square shape) with four edges (e.g., a rectangular shape with two shorter edges and two longer edges, as shown in
In certain embodiments, the plurality of TE elements 350 comprises p-type TE elements and n-type TE elements in electrical communication with one another through a plurality of shunts 352 (e.g., electrically conductive pads of the first plate 330 and the second plate 340). For example, the plurality of TE elements 350 can be arranged in a “stonehenge” configuration in which p-type and n-type TE elements 350 alternate with one another and are in series electrical communication with one another by shunts 352 which are alternately positioned on the first plate 330 and the second plate 340 such that electrical current can flow serially through the TE elements 350 and the shunts 352 in a serpentine fashion. In certain embodiments, the plurality of TE elements 350 are in thermal communication with the first plate 330 through the shunts 352 (e.g., electrically conductive pads) of the first plate 330 and in thermal communication with the second plate 340 through the shunts 352 (e.g., electrically conductive pads) of the second plate 340. In certain embodiments, some or all of a perimeter of the first plate 330 and the second plate 340 is sealed by at least one sealing material 360 (e.g., silicone; epoxy) which forms a seal (e.g., a water-tight seal; a hermetic seal) between a region containing the TE elements 350 between the first plate 330 and the second plate 340 and an environment surrounding the TED 300.
In certain embodiments, the PCB 200 is planar and each of the TEDs 300 of the thermoelectric sub-assembly 130 are planar. In certain such embodiments, the PCB 200 and the TEDs 300 are substantially planar with one another (e.g., as shown in
In certain embodiments, at least a first TED 300 extends from the PCB 200 in a first direction and at least a second TED 300 extends from the PCB 200 in a second direction parallel to the first direction. In certain such embodiments, all of the TEDs 300 extend from the PCB 200 in directions that are parallel to one another. For example, as schematically illustrated by
The portions of the example thermoelectric module assemblies 100 shown in
In certain embodiments, the first heat spreader 110a and the second heat spreader 110b are configured to transfer heat away from the component to be thermally conditioned. For example, the second heat spreader 110b can be configured to transfer heat to the TEDs 300 from the component to be thermally conditioned, and the first heat spreader 110a can be configured to transfer heat away from the TEDs 300. The second heat spreader 110b can comprise at least one first surface configured to be in thermal communication with the TEDs 300 and at least one second surface configured to be in thermal communication with the component to be thermally conditioned by the thermoelectric module assembly 100. The first heat spreader 110a can comprise at least one first surface configured to be in thermal communication with the TEDs 300. For example, at least one second surface of the first heat spreader 110a can comprise at least one heat dissipation structure (e.g., at least one fin) configured to transfer heat from the first heat spreader 110a to the ambient surroundings. For another example, the first heat spreader 110a can be configured to have a fluid coolant (e.g., liquid; air; refrigerant) flow therethrough. In certain embodiments, the second heat spreader 110b provides at least one cold side that receives heat from the component to be thermally conditioned and the first heat spreader 110a provides at least one hot side that serves as a heat sink which receives heat from the TEDs 300. In certain other embodiments, the first heat spreader 110a provides the at least one cold side and the second heat spreader 110b provides the at least one hot side.
In certain embodiments, the second heat spreader 110b (e.g., denoted by the dashed lines in
In certain embodiments, the PCB 200 extends from within the region to outside the region (e.g., as shown in
In certain embodiments, the assembly 100 further comprises an insulator plate (not shown) comprising a thermally insulating material (e.g., polymer, plastic, rubber, and/or fiberglass) configured to be at least partially compressed by the first heat spreader 110a and the second heat spreader 110b during fabrication and during operation of the thermoelectric module assembly 100 while keeping the first heat spreader 110a and the second heat spreader 110b from contacting one another. In certain embodiments, the insulator plate generally surrounds the TEDs 300 and the PCB 200, and comprises at least one hole (e.g., cut-out) configured to accommodate the TEDs 300 and the at least one PCB 200. For example, the at least one hole can be configured to hold the at least one thermoelectric sub-assembly 130 such that the TEDs 300 are in thermal communication with the first and second heat spreaders 110a,b while the at least one PCB 200 is thermally insulated from the first and second heat spreaders 110a,b. In certain embodiments, the insulator plate is configured to allow the PCB 200 to extend from the TEDs 300 within the region between the first and second heat spreaders 110a,b to outside this region, while in certain other embodiments, the insulator plate is configured to allow the wires 140 to extend from the PCB 200 within the region to outside the region (e.g., via a trench 160 as shown in
In certain embodiments, the assembly 100 further comprises a first thermally conductive material (e.g., copper layer, graphite foil, thermal grease, phase change material, gap filler) between and in thermal communication with the first heat spreader 110a and the first plates 330 of the TEDs 300 and/or a second thermally conductive material (e.g., copper layer, graphite foil, thermal grease, phase change material, gap filler; shown in
In certain embodiments, the first tabs 230 comprise portions of the electrically conductive conduits 210 of the PCB 200, and the second tabs 344 comprise portions of the electrically conductive layers of the planar laminate structure (e.g., printed circuit board) of the second plate 340 of the TED 300. In certain embodiments, the first tabs 230 and the second tabs 344 are configured to be soldered together. For example, the first tabs 230 and/or the second tabs 344 can comprise a solder material (e.g., solder with a hot air solder leveling (HASL) finish, solder preform, solder paste, solder flux, pre-flowed solder).
The top-right portion of
The compound 410 (e.g., sealing compound; epoxy) is configured to strengthen a mechanical coupling of the PCB 200 with the at least one TED 300 and to at least partially seal the two first tabs 230 and the two second tabs 344 that are in mechanical and electrical communication with the two first tabs 230. For example, the compound 410 can be inserted as a gel or liquid into the gap 400 after the TED 300 has been mounted to the PCB 200 (e.g., after the second tabs 344 of the TED 300 have been soldered to the corresponding first tabs 230 of the PCB 200), and the compound 410 can harden and affix to the first edge 370 of the TED 300 and to the edge 240 of the PCB 200 to form a rigid mechanical coupling between the TED 300 and the PCB 200. In certain embodiments (see, e.g.,
In certain embodiments, as schematically illustrated by
Alternatively or in addition to the trenches 420 of the first portion 342 of the second plate 340 of the TED 300, the PCB 200 can comprise trenches at least partially around the first tabs 230 and configured to facilitate capillary flow of the compound 410 through the trenches. As schematically illustrated by
In certain embodiments, upon hardening, the compound 410 within the trenches 420 provides further strengthening of the mechanical coupling of the PCB 200 with the TED 300 and provide further sealing of the first and second tabs 230, 344. The trenches 420 can have a depth in a range of less than 200 microns or less than 100 microns (e.g., about 70 microns), which can correspond to the thickness of the copper layer which has been etched away to form the trenches 420. In certain embodiments, the remaining portions 422 of the copper layer on either side of the second tab 344, which remain after the etching of the trenches 420, advantageously provide further rigidity to the first portion 342 of the second plate 340.
In certain embodiments, as schematically illustrated by
In the example system shown in
In the example system shown in
As schematically illustrated by
Discussion of the various embodiments herein has generally followed the embodiments schematically illustrated in the figures. However, it is contemplated that the particular features, structures, or characteristics of any embodiments discussed herein may be combined in any suitable manner in one or more separate embodiments not expressly illustrated or described. In many cases, structures that are described or illustrated as unitary or contiguous can be separated while still performing the function(s) of the unitary structure. In many instances, structures that are described or illustrated as separate can be joined or combined while still performing the function(s) of the separated structures. Various features and aspects of the disclosed embodiments can be combined with or substituted for one another. Any methods disclosed herein need not be performed in the order recited.
The ranges disclosed herein also encompass any and all overlap, sub-ranges, and combinations thereof. Language such as “up to,” “at least,” “greater than,” “less than,” “between,” and the like includes the number recited. With respect to the use of any plural and/or singular terms herein, those having skill in the art can translate from the plural to the singular and/or from the singular to the plural as is appropriate to the context and/or application. The various singular/plural permutations may be expressly set forth herein for sake of clarity. In general, terms used herein are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). If a specific number is intended, such an intent will be explicitly recited in the embodiment, and in the absence of such recitation, no such intent is present.
Various embodiments have been described above. Although the inventions have been described with reference to these specific embodiments, the descriptions are intended to be illustrative and are not intended to be limiting. Various modifications and applications may occur to those skilled in the art without departing from the spirit and scope of the inventions as defined in the appended claims.
This application claims the benefit of priority to U.S. Provisional Appl. No. 62/808,205 filed Feb. 20, 2019 and incorporated in its entirety by reference herein.
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20200266327 A1 | Aug 2020 | US |
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62808205 | Feb 2019 | US |