This application is based on Japanese Patent Application No. 2005-106853 filed on Apr. 1, 2005, the contents of which are incorporated herein by reference in its entirety.
1. Field of the Invention
The present invention relates to a thermoelectric transducer that has a series circuit including N-type thermoelectric devices and P-type thermoelectric devices and absorbs or radiates heat when a DC current is passed through the series circuit. The present invention further relates to a method for manufacturing a thermoelectric transducer
2. Description of the Related Art
As one of conventional thermoelectric transducers, there is proposed a thermoelectric transducer that has N-type thermoelectric devices and P-type thermoelectric devices alternately arranged in the shape of a plane. In this thermoelectric transducer, the respective thermoelectric devices have one-side electrode members mounted on their one-side surfaces and have other-side electrode members mounted on their other-side surfaces, thereby all thermoelectric devices are connected to each other in series (refer to JP-A-2003-124531 corresponding to U.S. Pat. No. 6,815,814).
In the thermoelectric devices of this type, heat exchanging members for absorbing or radiating heat transmitted from the one-side electrode members and the other-side electrode members are integral with the one-side electrode members and the other-side electrode members. Furthermore, adjacent thermoelectric devices are arranged to be electrically insulated from each other. Accordingly, it is difficult to accurately arrange the thermoelectric devices each having a small size, and the electrode members, thereby assembling steps for manufacturing the thermoelectric transducer are increased.
In view of the foregoing problems, it is an object of the present invention to provide a thermoelectric transducer in which a plurality of heat exchanging members can be easily accurately arranged at predetermined positions corresponding to arrangement of a plurality of electrode members of a thermoelectric device assembly.
It is another object of the present invention to provide a method for manufacturing a thermoelectric transducer.
According to an aspect of the present invention, a thermoelectric transducer includes a thermoelectric device assembly and a pair of heat exchanging member assembly arranged at two sides of the thermoelectric device assembly. The thermoelectric device assembly includes a plurality of P-type thermoelectric devices, a plurality of N-type thermoelectric devices, a first holding plate for holding the plurality of P-type thermoelectric devices and N-type thermoelectric devices, and a plurality of electrode members for electrically connecting the plurality of P-type thermoelectric devices and N-type thermoelectric devices in series. Here, the plurality of electrode members are arranged in a predetermined arrangement corresponding to an arrangement of the plurality of P-type thermoelectric devices and N-type thermoelectric devices. In addition, each of the heat exchanging member assemblies includes a plurality of heat exchanging members provided in correspondence with the plurality of electrode members, and a second holding plate for holding the plurality of heat exchanging members. The plurality of heat exchanging members are held in an arrangement corresponding to the predetermined arrangement of the electrode members.
In the thermoelectric transducer, each of the plurality of electrode members has an outer periphery that contacts one surface of the second holding plate in a state where the electrode member is connected to the heat exchanging member. Therefore, the heat exchanging members and the electrode members can be accurately bonded with each other without a position shift of the electrode members that are arranged to correspond to the arrangement of the thermoelectric devices.
Generally, the heat exchanging members have electrode portions connectable respectively to the electrode members of the thermoelectric device assembly to transmit heat, and heat exchanging portions for exchanging heat transmitted from the electrode portions. In this case, the second holding plate has a plurality of insertion holes into which the electrode portions of the heat exchanging members are inserted, respectively. Therefore, the heat exchanging members can be easily temporarily fixed using the second holding plate.
For example, each of the insertion holes of the second holding plate has an open area that is smaller than a surface area of each electrode member connected to the electrode portion of each heat exchanging member. Furthermore, the electrode portion of each heat exchanging member can be press-inserted into the insertion hole of the second holding plate or can be fitted with the insertion hole of the second holding plate. Accordingly, the electrode members of the thermoelectric device assembly can be connected to the electrode portions of the heat exchanging members in a state where the outer periphery of each electrode member contacts the one surface of the second holding plate at a peripheral portion of the insertion hole.
Furthermore, the second holding plate can be located adjacent to connection positions where the electrode members are connected to the thermoelectric devices, and the second holding plate can be separate from the first holding plate by a space.
According to another aspect of the present invention, a method of manufacturing a thermoelectric transducer includes: a step of forming a plurality of P-type thermoelectric devices and a plurality of N-type thermoelectric devices; a step of arranging the plurality of P-type thermoelectric devices and the plurality of N-type thermoelectric devices in a predetermined arrangement to be held by a first holding plate; a step of electrically connecting the plurality of P-type thermoelectric devices and plurality of N-type thermoelectric devices in series by using a plurality of electrode members so as to form a thermoelectric device assembly; a step of forming a plurality of heat exchanging members; a step of holding the plurality of heat exchanging members by using a second holding plate in an arrangement corresponding to a predetermined arrangement of the electrode members so as to form a heat exchanging member assembly; a step of temporarily fixing the thermoelectric device assembly between a pair of heat exchanging member assemblies such that an outer periphery of each electrode member contacts one surface of the second holding plate; and a step of bonding together the electrode members to the respective heat exchanging members in a contact state where the outer periphery of each electrode member contacts the one surface of the second holding plate. Accordingly, the electrode members of the thermoelectric device assembly are not shifted before the heat exchanging members are bonded to the electrode members of the thermoelectric device assembly.
In the step of forming the plurality of heat exchanging members, each of the heat exchanging members can be formed to have an electrode portion connectable to the electrode member and a heat exchanging portion for exchanging heat transmitted from the electrode portion. Further, a plurality of insertion holes can be formed in the second holding plate at positions corresponding to the arrangement of the electrode members such that each of the insertion holes has an open area that is smaller than a surface area of each electrode members. Therefore, the electrode portions of the heat exchanging members can be inserted into the insertion holes of the second holding plate to be temporarily fixed while the electrode members are made contact the one surface of the second holding plate.
The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments made with reference to the accompanying drawings, in which:
An embodiment of the present invention will be described with reference to
The thermoelectric device substrate 10, as shown in
The P-type thermoelectric device 12 is an extremely small component constructed of a P-type semiconductor made of a Bi—Te based compound, and the N-type thermoelectric device 13 is an extremely small component constructed of an N-type semiconductor made of the Bi—Te based compound. The thermoelectric device substrate 10 is integrally formed in such a way that the P-type thermoelectric devices 12 and the N-type thermoelectric devices 13 are arranged on the first holding plate 11 in a lattice pattern. At this time, the P-type thermoelectric devices 12 and the N-type thermoelectric devices 13 are formed in such a way as to protrude their top end surfaces and bottom surfaces from the first holding plate 11.
The thermoelectric devices 12, 13 arranged on a left upper end and a right upper end in the drawing have terminals 24a and 24b, respectively. A positive terminal and a negative terminal of a DC power source (not shown) are connected to these terminals 24a and 24b, respectively.
The electrode member 16 is an electrode that is formed of plate-shaped conductive metal such as copper and electrically directly connects the P-type thermoelectric device 12 with the N-type thermoelectric device 13, which are adjacent to each other, among the group of thermoelectric devices 12, 13 arranged on the thermoelectric device substrate 10. All of the electrode members 16, as shown in
The electrode members 16 are arranged at specified positions corresponding to the state of arrangement of the thermoelectric devices 12, 13 arranged on the thermoelectric device substrate 10, and are bonded to the thermoelectric devices 12, 13. In other words, a plurality of electrode members 16 are arranged on both end surfaces of the adjacent thermoelectric devices 12, 13.
More specifically, the adjacent thermoelectric devices 12, 13 are connected to each other in such a way as to form an electrical PN junction (which will be described later) on one surface side (refer to
The electrode members 16 arranged on one surface side (refer to
As shown in
The heat absorbing/radiating substrate 20 of the heat exchanging member assembly, as shown in
Each of the heat exchanging members 25 is formed of a thin plate of conductive material such as copper, and is formed nearly in the shape of a letter U in cross section as shown in
In this embodiment, a plurality of heat exchanging members 25 are integrated with the second holding plate 21 such that the electrode portions 25a are arranged at predetermined positions corresponding to the arrangement of the electrode members 16 that are arranged in the thermoelectric device assembly 15. Furthermore, insertion holes 21a are provided in the second holding plate 21 so that the electrode portions 25a of the heat exchanging members 25 are inserted into the insertion holes 21a, respectively. In this embodiment, each of the insertion holes 21a is set to have an open area slightly smaller than a surface area of each electrode member 16, as an example, as shown in
When one end surface of each electrode portion 25a is bonded to one surface of each electrode member 16, an outer periphery of the insertion hole 21a of the second holding plate 21 contacts an outer periphery of the electrode member 16. Accordingly, when the electrode portion 25a is connected with the electrode member 16, the electrode member 16 is pressed by the second holding plate 21. Therefore, it can prevent the electrode member 16 from being shifted before the electrode portion 25a of the heat exchanging member 25 and the electrode member 16 are bonded to each other. The electrode portion 25a of the heat exchanging member 25 is formed to be fitted with the insertion hole 21a of the second holding plate 21.
For example, the electrode portion 25a is fitted with the insertion hole 21a such that one end surface of the electrode portion 25a slightly protrudes from one surface of the second holding plate 21. Furthermore, the heat exchanging member 25 is arranged such that the electrode portion 25a and the fin 25b are extended along the flow of air as shown in
In this embodiment, the heat exchanging members 25 arranged on the one surface side (refer to
DC power inputted from the terminal 24a, as shown in
At this time, the upper electrode members 16 shown in
That is, as shown in
In this embodiment, the positive terminal of the DC power source is connected to the terminal 24a and the negative terminal of the DC power source is connected to the terminal 24b to apply the DC power to the terminal 24a. However, the positive terminal of the DC power source may be connected to the terminal 24b and the negative terminal of the DC power source may be connected to the terminal 24a to apply the DC power to the terminal 24b. However, at this time, the upper heat exchanging members 25 construct the heat absorbing portions and the lower heat exchanging members 25 constructs the heat radiating portions.
Further, the second holding plate 21 is positioned adjacent to bonding portions between the electrode members 16 and the thermoelectric devices 12, 13, as shown in
Because a thermal insulation space is provided between the one surface of the second holding plate 21 and the first holding plate 11, it can effectively restrict heat generated from the thermoelectric devices 12, 13 from bypassing the heat exchanging member 25.
In this embodiment, each of the insertion holes 21a formed in the second holding plate 21 has the open area slightly smaller than the surface area of the electrode member 16 connectable to the electrode portion 25a. That is, each insertion hole 21a having the rectangular shape is made slightly shorter in both the major side and the minor side of the rectangular shape, as compared with the electrode member 16. However, any one of the major side and the minor side of the rectangular shaped insertion hole 12 can be made slightly smaller than the flat surface area of the electrode member 16.
Next, a method for assembling a thermoelectric transducer will be described. First, a plurality of P-type thermoelectric devices 12 and a plurality of N-type thermoelectric devices 13 are formed and arranged alternately in a lattice pattern in holes formed in the first holding plate 11, to form the thermoelectric device substrate 10 having the thermoelectric devices 12, 13 integrally mounted on the first holding plate 11.
Then, a plurality of electrode members 16 each formed in the shape of a plane are located on the end surfaces of the thermoelectric devices 12, 13 arranged adjacently to the thermoelectric device substrate 10, as shown in
For example, the electrode members 16 arranged on the upper side of the first holding plate 11 in
The electrode portions 25a of the heat exchanging members 25 are fitted with the insertion holes 21a of the second holding plates 21 to form a temporarily fixing state of the heat absorbing/radiating substrate 20. In this embodiment, the heat exchanging members 25 are arranged on the one side and the other side of the thermoelectric device substrate 10 to have different shapes in accordance with the arrangements of the plurality group of the thermoelectric devices 12, 13 shown in
Accordingly, it can prevent a shift of the electrode members 16 which are connected to the thermoelectric devices 12, 13 in a predetermined arrangement corresponding to the arrangement of the thermoelectric devices 12, 13. Furthermore, because the plural heat exchanging members 25 are temporarily fixed before the bonding, the plural heat exchanging members 25 can be set at predetermined positions without a position shift.
Then, the case members 28 are combined with the second holding plate 21 to form air passages on the upper side and the lower side, thereby the heat radiating part and the heat absorbing part are formed on the upper side and the lower side of the thermoelectric device substrate 10. By flowing air through these heat radiating and absorbing parts, cold air and hot air can be obtained. The thermoelectric transducer like this can be applied to an apparatus for cooling a heat generating component such as semiconductor and electric component and for heating of a heating unit.
In the thermoelectric transducer according to the above-described embodiment, in the arrangement state where the thermoelectric device assembly 15 is inserted between the heat absorbing/radiating substrates 20, the outer peripheries of the electrode members 16 are set to contact the one surface of the second holding plate 21. That is, when the heat exchanging members 25 are bonded to the electrode members 16, the outer peripheries of the electrode members 16 contact the outer peripheries of the insertion holes 21a of the second holding plate 21. Therefore, the electrode members 16, which are arranged to correspond to the arrangements of the thermoelectric devices 12, 13, can be accurately connected with the heat exchanging members 25, without a position shift. Accordingly, the plural heat exchanging members 25 can be accurately assembled at predetermined positions corresponding to the arrangement state of the plural electrode members 16.
Furthermore, because the second holding plate 21 is located at a position adjacent to the bonding portion where the electrode members 16 are bonded to the thermoelectric devices 12, 13, an exposed surface area of the electrode members 16 exposed to an outside relative to the thermoelectric devices 12, 13 can be reduced. Therefore, a heat leakage amount from the thermoelectric devices 12, 13 due to convection can be reduced, thereby increasing a heat transmission amount from the thermoelectric devices 12, 13 to the heat exchanging member 25 through the electrode members 16. As a result, the converting efficiency of the thermoelectric transducer can be effectively improved.
Because the heat insulation space is formed between the second holding plate 21 and the first holding plate 11, it can restrict heat generated from the thermoelectric devices 12, 13 from being leaked to the heat exchanging areas of the heat exchanging members 25 without passing through the electrode members 16.
In the pair of the heat absorbing/radiating substrates 20 located at both sides of the thermoelectric device assembly 15, after the electrode portions 25a of the heat exchanging members 25 are temporarily fixed to the peripheries of the insertion holes 21a of the second holding plates 21, all the electrode portions 25a are bonded to the electrode members 16 together. Therefore, the heat exchanging members 25 can be bonded with the electrode members 16 at predetermined positions without a position shift before the bonding. Because the bonding of the electrode portions 25 and the electrode members 16 is performed together, manufacturing steps for forming the thermoelectric transducer can be reduced.
Furthermore, each of the insertion holes 21 is opened in the second holding plate 21 with the open area that is slightly smaller than the surface area of the electrode member 16. Therefore, the outer periphery of the insertion hole 21a of the second holding plate 21 can be made to contact the outer periphery of the electrode member 16. Accordingly, a position shift of the electrode members 16, arranged in a predetermined arrangement corresponding to the arrangement state of the thermoelectric devices 12, 13, can be prevented.
In this embodiment, after the electrode portions 25a of the heat exchanging members 25 are temporarily fixed to the second holding plate 21 via the insertion holes 21a in each heat absorbing/radiating substrate 20, the electrode portions 25a of a pair of the heat absorbing/radiating substrates 20 are bonded with the electrode members 16 of the thermoelectric device assembly 15. Furthermore, in the state where the thermoelectric device assembly 15 is located between the heat absorbing/radiating substrates 20, the outer peripheries of the electrode members 16 contact the one surface of the second holding plate 21, and the heat exchanging members 25 and the electrode members 16 are bonded integrally by soldering.
Because the outer peripheries of the electrode members 16 are made to contact the one surface of the second holding plate 21, it can effectively prevent a position shift of the electrode members 16 before the bonding.
Although the present invention has been fully described in connection with the preferred embodiments thereof with reference to the accompanying drawings, it is to be noted that various changes and modifications will become apparent to those skilled in the art.
For example, in the above-described embodiment, the electrode portions 25a of the heat exchanging members 25 are fitted with the insertion holes 21a of the second holding plate 21 so as to be temporarily fixed to the second holding plate 21. However, the electrode portions 25a of the heat exchanging members 25 can be press-inserted into the insertion holes 21a of the second holding plate 21 so as to be temporarily fixed to the second holding plate 21.
Furthermore, as shown in
In the above-described embodiment, the fin 25b of the heat exchanging member 25 is formed into a louver shape, however, can be formed into other shape such as an offset shape.
In the above-described embodiment, each of the insertion hole 21a is formed substantially into a rectangular shape. However, the open shape of the insertion hole 21a can be suitably changed in accordance with the shape of the electrode portion 25a of the heat exchanging member 25 or/and the shape of the electrode member 16. Furthermore, the surface shape of the electrode device 16 connected with the electrode portion 25a of the heat exchanging member 25 can be suitably changed in accordance with the shape of the heat exchanging member 25.
Such changes and modifications are to be understood as being within the scope of the present invention as defined by the appended claims.
Number | Date | Country | Kind |
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2005-106853 | Apr 2005 | JP | national |