This application is based on Japanese Patent Application No. 2005-109053 filed on Apr. 5, 2005, the contents of which are incorporated herein by reference in its entirety.
1. Field of the Invention
The present invention relates to a thermoelectric transducer that has a series circuit including N-type thermoelectric devices and P-type thermoelectric devices and absorbs or radiates heat when a DC current is passed through the series circuit. More particularly, present invention relates to the shape of heat exchanging members located at connection portions between adjacent thermoelectric devices.
2. Description of the Related Art
As one of conventional thermoelectric transducers, there is proposed a thermoelectric transducer that has N-type thermoelectric devices and P-type thermoelectric devices alternately arranged in the shape of a plane. In this thermoelectric transducer, the respective thermoelectric devices have one-side electrode members mounted on their one-side surfaces and have other-side electrode members mounted on their other-side surfaces, thereby all thermoelectric devices are connected to each other in series (refer to JP-A-2003-124531 corresponding to U.S. Pat. No. 6,815,814).
In the thermoelectric devices of this type, heat exchanging members for absorbing or radiating heat transmitted from the one-side electrode members and the other-side electrode members are integral with the one-side electrode members and the other-side electrode members. Furthermore, adjacent thermoelectric devices are arranged to be electrically insulated from each other. Accordingly, it is difficult to accurately arrange the thermoelectric devices each having a small size and the electrode members, thereby assembling steps for manufacturing the thermoelectric transducer are increased.
Furthermore, when the heat exchanging members are simply arranged at connection portions between adjacent thermoelectric devices in accordance with the arrangement of the thermoelectric devices, it is difficult to effectively improve thermoelectric converting efficiency in the thermoelectric transducer.
In view of the foregoing problems, it is an object of the present invention to provide a thermoelectric transducer, which can be easily manufactured while improving thermoelectric converting efficiency.
According to an aspect of the present invention, in a thermoelectric transducer, a thermoelectric device substrate includes a plurality of P-type thermoelectric devices, a plurality of N-type thermoelectric devices, and an insulating board for holding the plurality of P-type thermoelectric devices and N-type thermoelectric devices, and the plurality of P-type thermoelectric devices and N-type thermoelectric devices are alternately arranged on the insulating board. Each of a plurality of electrode members is connected to two end portions of adjacent N-type thermoelectric device and P-type thermoelectric device for electrically connecting the adjacent N-type thermoelectric device and P-type thermoelectric device. In addition, the thermoelectric transducer includes a plurality of heat exchanging members each of which includes an electrode portion connectable to the electrode member, and a heat exchanging portion for exchanging heat transmitted from the electrode portion. In the thermoelectric transducer, the plurality of heat exchanging members are located at two sides of the thermoelectric device substrate to form a heat absorbing part and a heat radiating part partitioned from each other by the thermoelectric device substrate. In addition, the electrode portions and the heat exchanging portions have, respectively, the same shapes, in all the heat exchanging members, and the electrode portions and the heat exchanging portions are arranged in the same direction in all the heat exchanging members of each of the heat absorbing part and the heat radiating part. Accordingly, it is possible to use one type of the heat exchanging members, thereby effectively reducing manufacturing cost of the heat exchanging members.
For example, the plurality of N-type thermoelectric devices and the plurality of P-type thermoelectric devices are arranged to form plural thermoelectric device groups arranged in plural lines in an arrangement direction, and each of the plural thermoelectric device groups is constructed with a pair of the N-type thermoelectric device and the P-type thermoelectric device electrically connected to each other by the electrode member. In this case, two heat exchanging members are arranged on one electrode member that connects the N-type thermoelectric device and the P-type thermoelectric device in a direction perpendicular to the arrangement direction at an outer end of the thermoelectric device groups, and the N-type thermoelectric device and the P-type thermoelectric device in each thermoelectric device group inside of the outer end are electrically connected by one electrode member extending in a direction parallel to the arrangement direction. Furthermore, the two heat exchanging members extend in the arrangement direction at the outer end of the thermoelectric device groups. Therefore, thermoelectric converting efficiency can be effectively improved.
Each of the heat exchanging members can be formed into approximately a U-shape having a bottom part used as the electrode portion and protruding portions used as the heat exchanging portion protruding from the bottom portion at two ends of the bottom portion, and each of the electrode members can be elongated in an extension direction to electrically connect the N-type thermoelectric device and the P-type thermoelectric device of each thermoelectric device group. In this case, a part of each electrode portion of the two heat exchanging members can be bonded to the electrode member at the outer end of the thermoelectric device groups. Furthermore, each of the electrode portions and each of the heat exchanging portions of the two heat exchanging members at the outer end of the thermoelectric device groups can extend in a direction approximately perpendicular to the extending direction of the electrode member at the outer end of the thermoelectric device groups. Here, a surface area of each electrode member can be set approximately equal to a surface area of the electrode portion of each heat exchanging member.
In addition, at least in the heat radiating part, the two heat exchanging members can be arranged on the one electrode member to extend in the arrangement direction at the outer end of the thermoelectric device groups.
Alternatively, two heat exchanging members can be arranged on one electrode member at an outer end of the thermoelectric device groups, and a surface area of the electrode member arranged at the outer end of the thermoelectric device groups can be set to connect the N-type thermoelectric device and the P-type thermoelectric device in a direction perpendicular to the arrangement direction and to connect the electrode portions of the two heat exchanging members with each other.
According to another aspect of the present invention, a thermoelectric transducer includes: a thermoelectric device substrate that has a plurality of P-type thermoelectric devices, a plurality of N-type thermoelectric devices, and an insulating board for holding the plurality of P-type thermoelectric devices and N-type thermoelectric devices alternately arranged on the insulating board; and a plurality of heat exchanging members each of which includes an electrode portion bonded to two end portions of adjacent N-type thermoelectric device and P-type thermoelectric device for electrically connecting the adjacent N-type thermoelectric device and P-type thermoelectric device, and a heat exchanging portion for exchanging heat transmitted from the electrode portion. In this thermoelectric transducer, the plurality of heat exchanging members are located at two sides of the thermoelectric device substrate to form a heat absorbing part and a heat radiating part partitioned from each other by the thermoelectric device substrate, the electrode portions and the heat exchanging portions have, respectively, the same shapes in all the heat exchanging members, and the electrode portions and the heat exchanging portions are arranged in the same direction in all the heat exchanging members in each of the heat absorbing part and the heat radiating part. Accordingly, all the heat exchanging member can be formed into one type, and the thermoelectric transducer can be easily formed.
Even in this case, two heat exchanging members can be arranged on one thermoelectric device group at an outer end of the thermoelectric device groups, such that the electrode portions of the two heat exchanging members are located, respectively, to the N-type thermoelectric device and the P-type thermoelectric device, and the N-type thermoelectric device and the P-type thermoelectric device of the one thermoelectric device group can be electrically connected to each other. Furthermore, a part of each electrode portion of the two heat exchanging members can be bonded to the electrode portion at the outer end of the thermoelectric device groups.
The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments made with reference to the accompanying drawings, in which:
A first embodiment of the present invention will be described with reference to
The thermoelectric device substrate 10, as shown in
The P-type thermoelectric device 12 is an extremely small component constructed of a P-type semiconductor made of a Bi—Te based compound, and the N-type thermoelectric device 13 is an extremely small component constructed of an N-type semiconductor made of the Bi—Te based compound. The thermoelectric device substrate 10 is integrally formed in such a way that the P-type thermoelectric devices 12 and the N-type thermoelectric devices 13 are arranged on the first insulating board 11 in a lattice pattern. At this time, the P-type thermoelectric devices 12 and the N-type thermoelectric devices 13 are formed in such a way as to protrude their top end surfaces and bottom surfaces from the first insulating board 11.
The electrode member 16 is an electrode that is formed of plate-shaped conductive metal such as copper and electrically directly connects the P-type thermoelectric device 12 with the N-type thermoelectric device 13, which are adjacent to each other, among the thermoelectric device groups 12, 13 arranged on the thermoelectric device substrate 10. All of the electrode members 16, as shown in
The electrode members 16 are arranged at specified positions corresponding to the state of arrangement of the thermoelectric devices 12, 13 arranged on the thermoelectric device substrate 10, and are bonded to the thermoelectric devices 12, 13. In other words, the electrode members 16 are arranged on both end surfaces of the adjacent thermoelectric devices 12, 13 so that adjacent thermoelectric devices 12, 13 are electrically connected in series by each electrode member 16.
The thermoelectric devices 12, 13 arranged on a left upper end and a right upper end in the drawing have terminals 24a and 24b, respectively. A positive terminal and a negative terminal of a DC power source (not shown) are connected to these terminals 24a and 24b, respectively.
As shown in
The electrode members 16 arranged on one surface side (refer to
As shown in
The heat absorbing/radiating substrate 20 of the heat exchanging member assembly, as shown in
Each of the heat exchanging members 25 is formed of a thin plate of conductive material such as copper, and is formed nearly in the shape of a letter U in cross section as shown in
In the embodiment, a plurality of heat exchanging members 25 are integrated with the second insulating board 21 such that the electrode portions 25a are arranged at predetermined positions corresponding to the arrangement of the electrode members 16. One end surface of each electrode portion 25a has a shape and a surface area approximately equal to the surface shape and the surface area of the electrode member 16 so as to be bonded to the electrode member 16.
Furthermore, the heat exchanging member 25 is formed integrally with the second insulating board 21 such that the one end surface of each electrode portion 25a slightly protrudes from one surface of the second insulating board 21 toward the thermoelectric device substrate 10. For example, insertion holes are provided in the second insulating board 21, so that the electrode portions 25a of the heat exchanging members 25 protrude slightly from the one surface of the second insulating board 21 through the insertion holes. Accordingly, when the one end surface of each electrode portion 25a is bonded to the electrode member 16 provided on the thermoelectric device substrate 10, the bonding can be easily performed because the electrode portions 25a slightly protrude toward the electrode member 16 from the one surface of the second insulating board 21.
The heat exchanging member 25 is arranged such that the electrode portion 25a and the heat exchanging portion 25b are extended along the flow direction of air as shown in
That is, in this embodiment, all the heat exchanging members 25 arranged in the four lines in the flow direction of air on the one surface side (refer to
Because two heat exchanging members 25 are arranged relative to the electrode member 16 which connects the adjacent thermoelectric devices 12, 13 positioned at the outer end (e.g., the first and fourth lines in
DC power inputted from the terminal 24a, as shown in
At this time, the upper electrode members 16 shown in
In this embodiment, the positive terminal of the DC power source is connected to the terminal 24a and the negative terminal of the DC power source is connected to the terminal 24b to apply the DC power to the terminal 24a. However, the positive terminal of the DC power source may be connected to the terminal 24b and the negative terminal of the DC power source may be connected to the terminal 24a to apply the DC power to the terminal 24b. However, at this time, the upper heat exchanging members 25 construct the heat absorbing portions and the lower heat exchanging members 25 constructs the heat radiating portions.
In this embodiment, the number of the heat exchanging members 25 arranged at the upper side is set larger than the number of the heat exchanging members 25 arranged at the lower side, as shown in
Next, a method for assembling a thermoelectric transducer will be described. First, a plurality of P-type thermoelectric devices 12 and a plurality of N-type thermoelectric devices 13 are formed and arranged alternately in a lattice pattern in holes formed in the first insulating board 11, to form the thermoelectric device substrate 10 having the thermoelectric devices 12, 13 integrally mounted on the first insulating board 11.
Then, a plurality of electrode members 16 each formed in the shape of a plate are located on the end surfaces of the thermoelectric devices 12, 13 adjacent to each other, as shown in
For example, the electrode members 16 arranged on the upper side of the first insulating board 11 in
On the other hand, the heat exchanging members 25 having the same shape are arranged in a lattice pattern and is integrated with the second insulating board 21 to form an integrate structure, as shown in
Because the heat exchanging members 25 with the same shape are used, the heat exchanging members 25 can be easily formed by using one kind molding die, thereby assembling operation for assembling the heat absorbing/radiating substrate 20 can be made easy.
Furthermore, because all the heat exchanging members 25 are arranged in the same direction, assembling performance of the thermoelectric transducer can be greatly improved, and heat transmitting area on the heat radiating side can be greatly improved.
Then, the electrode device substrate 10 is sandwiched between and combined with the heat absorbing/radiating substrate 20 on the heat radiating side and the heat absorbing/radiating substrate 20 on the heat absorbing side. The respective electrode devices 16 are made to abut against and soldered together to the respective electrode portions 25a of the heat exchanging member 25. Then, the case members 28 are combined with the heat absorbing/radiating substrates 20 to form air passages on the upper side and the lower side, thereby the heat radiating part and the heat absorbing part are formed on the upper side and the lower side of the thermoelectric device substrate 10. By flowing air through these heat radiating and absorbing parts, cold air and hot air can be obtained. The thermoelectric transducer like this can be applied to an apparatus for cooling a heat generating component such as semiconductor and electric component and for heating of a heating unit.
In this embodiment, the heat exchanging members 25 are arranged in the insertion holes provided in the second insulating substrate 21 so as to be integrated with the second insulating substrate 21. However, the heat exchanging members 25 can be integrated with the second insulating substrate 21 by using other method such as an insert-molding or a molding process.
In the thermoelectric transducer according to the first embodiment, the heat exchanging members 25, each of which is bonded to the electrode member 16 connecting the adjacent thermoelectric devices 12, 13, are formed by the same shape in the electrode portions 25a and the heat exchanging portions 25b. In addition, the electrode portions 25a and the heat exchanging portions 25b of the heat exchanging members 25 are arranged in the same direction in each heat exchanging member 25, as shown in
Furthermore, at the outer end of the thermoelectric device group, as shown in
In the above-described first embodiment, each electrode member 16 arranged on the adjacent thermoelectric devices 12, 13 at the outer end of the thermoelectric device groups is formed into the same shape as that of the electrode member 16 arranged on the adjacent thermoelectric devices 12, 13 positioned inside of the outer end of the thermoelectric device groups, as shown in
For example, as shown in
According to the second embodiment, because all the surface area of the electrode portions 25a of the two heat exchanging members 25 are bonded to each electrode member 16 at the outer end of the thermoelectric device groups, as shown in
In the above-described first and second embodiments, the heat exchanging member 25 is bonded to the adjacent thermoelectric devices 12, 13 through the electrode member 16, while all the heat exchanging members 25 are formed into the same shape. In contrast, in the third embodiment, the electrode portions 25a of the heat exchanger members 25 are directly bonded to the thermoelectric devices 12, 13, while all the heat exchanging members 25 are formed into the same shape.
For example, as shown in
For example, the two heat exchanging members 25 are arranged on the adjacent thermoelectric devices 12, 13 at an outer end of the thermoelectric device groups such that the electrode portions 25a of the two heat exchanging members 25 are located, respectively, to the N-type thermoelectric device 13 and the P-type thermoelectric device 12. Furthermore, the N-type thermoelectric device 13 and the P-type thermoelectric device 12 at the outer end are electrically connected to each other via the electrode portion 16a.
The electrode portion 25a of each heat exchanging member 25 can be directly bonded to adjacent thermoelectric devices 12, 13 to electrically connect the adjacent thermoelectric devices through the electrode portion 25a, at the inner side of the outer end of the thermoelectric device groups. Even in the third embodiment, it is possible to use the same-shaped heat exchanging members 25 and to arrange the heat exchanging members 25 in the same direction.
The electrode member 16a for electrically connecting the electrode portions 25a of the two heat exchanging members 25 can be formed separate from the first insulating board 11 and can be formed into the other shape, only when the adjacent thermoelectric devices 12, 13 at the outer end are electrically connected with each other through the electrode member 16a.
In this embodiment, when the thickness of the electrode portion 25a of the heat exchanging member 25 is madder thicker, the electrode portion 25a of the heat exchanging member 25 can be easily directly bonded to the adjacent thermoelectric devices 12, 13. In the third embodiment, the arrangement direction and the shape of the heat exchanging members 25, which are directly connected to the thermoelectric devices 12, 13, can be made similarly to the above-described first embodiment.
Although the present invention has been fully described in connection with the preferred embodiments thereof with reference to the accompanying drawings, it is to be noted that various changes and modifications will become apparent to those skilled in the art.
For example, in the above-described embodiment, the heat exchanging portion 25b of the heat exchanging member 25 can be formed into other shape such as an offset shape shown in
In the above-described embodiments, the heat exchanging members 25 can be arranged in lines other than three or four in the flow direction of air.
Such changes and modifications are to be understood as being within the scope of the present invention as defined by the appended claims.
Number | Date | Country | Kind |
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2005-109053 | Apr 2005 | JP | national |