1. Field of the Invention
The invention relates to methods for thermoforming Frequency Selective Surfaces (FSS) for antennas, radomes and the like.
2. Description of the Related Art
Frequency selective surfaces (FSS) are useful in many radio-frequency and optical applications. Such applications include antennas, radomes, canopies, and other aircraft structures and the receiving surfaces of satellite dishes. A surface may be made frequency selective by forming a pattern on the surface, for example, by applying a patterned metal layer to the surface. The accuracy of the frequency selectivity of the surface depends on the precision of the pattern formed on the surface. Curvature in the surface complicates the pattern and makes fabrication difficult. Currently, there is no known method for patterning curved surfaces to achieve precise frequency selectivity in a cost effective manner.
These and other problems are solved by using a three-dimensional FSS fabrication system. In the three-dimensional fabrication system, the element geometry and/or FSS grid geometry can be pre-mapped (or pre-distorted) in two-dimensional form prior to further shaping into a three-dimensional surface. In one embodiment, the FSS elements are pre-positioned to produce a desired element placement in the final shape. In one embodiment, mapping of the FSS from the two-dimensional geometry into the three-dimensional geometry is facilitated by using an elastic substrate, such as, for example, a thermoplastic substrate. Constructing the FSS elements on a relatively flat substrate and then forming the FSS and substrate into a desired three-dimensional shape is less expensive and more accurate than prior-art methods of constructing three-dimensional curved FSS structures.
In one embodiment, a substantially flat 2-D FSS structure is designed and constructed, and then the flat FSS structure is formed into a 3-D FSS structure. In one embodiment, the 2-D flat surface of the designed FSS is mapped into a desired three-dimensional curvature. The mapping can be done analytically (e.g., by mathematical analysis, numerical analysis, etc.). In one embodiment, the mapping from 2-D to 3-D is analytically performed using the elastic properties of a desired substrate material and the physics of the forming technique employed. (The term substrate is used herein to refer to a carrier material provided to the FSS. The term substrate is used for purposes of explanation, and is not intended to be limiting. Thus, the substrate can be a substrate, a superstrate, and/or combinations of substrates and superstrates.) The mapping can also be done by conducting distortion testing based on physical measurements. Thus, for example, in one embodiment, physical testing is provided by defining locations (for instance, in the form of a grid of points) on a flat test sheet of material and then forming the flat sheet into the desired 3-D shape. In one embodiment, one or more FSS layers are provided to the flat test sheet before the test sheet is formed into the desired 3-D shape.
Once the mapping from 2-D to 3-D is determined (e.g., by calculation and/or testing) then the desired element locations on the 3-D FSS are then inversely mapped from the 3-D space back to the flat 2-D space. Thus, the 3-D to 2-D mapping is used to change the specification of the element locations, shapes and orientations on the flat FSS panel such that when the 2-D FSS panel is formed into the desired 3-D shape, the FSS elements on the 3-D shape will move to their desired positions. In one embodiment, the coordinate mappings between 2-D and 3-D are used to determine the position of one or more FSS elements on the flat 2-D FSS layer. In one embodiment, the coordinate mappings between 2-D and 3-D are used to determine the rotational orientation of one or more FSS elements on the flat FSS layer. In one embodiment, the coordinate mappings between 2-D and 3-D are used to determine the position and rotational orientation of one or more FSS elements on the flat FSS layer. The pre-thermoforming FSS geometry can also be determined experimentally by placing a uniform grid of points on a 2-D surface, then performing the thermoforming operation to determine the distortions caused by the thermoforming technique. The distortion of the uniform grid can then be used to develop the coordinate mappings between 2-D and 3-D. Instead of using a uniform grid, the actual FSS can be thermoformed to pre-determine the distortions. Another method uses projections that change with surface inflection, as concave areas will cause the elements to be drawn into a stretched condition. In such a case, the elements will be scaled down prior to forming. Conversely, areas of convex curvature may have elements scaled up so that upon forming they compress into a predetermined scale.
A flat FSS panel is constructed using the element positions determined from the mathematical mapping between 2-D and 3-D. In one embodiment, one or more flat FSS panels are constructed on a formable or thermo-formable substrate. In one embodiment, the substrate includes a thermoplastic. In one embodiment, the substrate includes a thermoplastic material with fiber reinforcement (e.g., fiberglass fibers, Kevlar fibers, etc.). In one embodiment, the FSS elements are created by printing. In one embodiment, the FSS elements are created by deposition. In one embodiment, the FSS elements are created by plating/depositing metal, then photo-etching. In one embodiment, the FSS elements include resonant elements. In one embodiment, the FSS elements include extended elements (e.g., long wires, long slots, meanderlines, etc.). In one embodiment, FSS elements are provided to one side of the substrate material. In one embodiment, FSS elements are provided to both sides of the substrate material. In one embodiment, multiple substrate and FSS layers are produced and bonded or otherwise combined to form a flat multi-layer FSS structure.
In one embodiment, one or more flat FSS layers are formed into a desired shape. In one embodiment, the flat FSS layers are thermoformed over a tool having the desired shape. In one embodiment, the FSS layers are formed to the shape of the tool by using vacuum techniques. In one embodiment, the FSS layers are formed to the shape of the tool by supporting the FSS layer between male and female tools. In one embodiment, the FSS layer is heated and thermoformed such that when removed from the tool, the FSS layer substantially retains the shape of the tool (or tools). In one embodiment, the FSS layer is chemically treated while pressed against the tool such that when removed from the tool, the FSS layer substantially retains the shape of the tool (or tools).
In one embodiment, a plurality of tools are used to produce curved FSS panels that can be assembled into a structure.
Curving a relatively thin FSS layer in a single dimension does not appreciably change the spacing between elements in the FSS layer because a relatively thin flat sheet can be curved in one dimension without stretching. However, a flat sheet cannot be curved in two dimensions without stretching or compressing. If the FSS layers are to be fully three-dimensional (i.e., curved in two dimensions), then the stretching or compression that occurs in forming a flat FSS layer into a two-dimensional curved surface will change the element spacing. Thus, in a process block 102, the 2-D flat surface of the designed FSS is mapped (mathematically and/or by physical testing) into a desired three-dimensional shape. The mapping from 2-D to 3-D is performed using the elastic properties of a desired substrate material and the physics involved with the preferred thermoforming technique (or through testing/experimentation on a uniform grid or the actual FSS). Once the mapping from 2-D to 3-D is determined, the desired element locations, orientations, and shapes on the 3-D FSS are inversely mapped from the 3-D space back to the flat 2-D space. The 3-D to 2-D mapping is used to re-map the element locations on the flat FSS panel such that when a 2-D panel is made using the element positions determined in the process block 102 and then elastically formed into the desired 3-D shape, the FSS elements on the 3-D shape will move to their proper positions during the forming process. In addition, the stretching and/or compression caused by warping the substrate from 2-D to 3-D may cause some elements to rotate as well as translate. Thus, in one embodiment, the coordinate mapping used in the process block 102 is used to determine the position and rotational orientation of one or more FSS elements on the flat FSS layer.
In one embodiment, the mapping between the 2-D flat FSS and the 3-D curved FSS is used to predict performance of the 3-D FSS and to allow an assessment of the performance of the 3-D panel. Thus, in one embodiment, an FSS is designed as a flat 2-D panel. Then the mapping between the 2-D panel and the 3-D panel is determined. The FSS is then re-analyzed using the resulting element orientation, shape, and/or spacing in the 3-D FSS to verify that the mapping from 2-D to 3-D does not adversely affect the desired performance. If the performance is adversely affected, then the mapping between the 3-D surface and the 2-D surface can be computed to re-map the position and/or orientation of the elements to be manufactured on the 2-D surface such that when the 2-D surface is formed into the desired 3-D shape, the 3-D FSS will have the element position and orientation (and element shape) to produce the desired electromagnetic performance.
In areas where the 3-D radius of curvature is relatively large, the mapping from 2-D to 3-D will produce a relatively smaller change in the element spacing. If the FSS design requires relatively tight control on element spacing (or orientation) such relatively smaller change may require re-mapping of the element spacing on the 2-D FSS. By contrast, if the particular FSS design does not require relatively tight control over element spacing (or orientation), then such relatively smaller change may not require re-mapping of the element spacing (or orientation) on the 2-D FSS panel. One of ordinary skill in the art will recognize that in mapping from the 2-D panel to a 3-D surface, different portions of the FSS can undergo different amounts of stretching and/or compression depending on the curvature in various regions of the 3-D surface. In areas where the 3-D radius of curvature is relatively smaller, the change in element spacing and/or orientation will be relatively larger, thus, increasing the likelihood that the location and/or orientation of the FSS elements on the 2-D panel will need to be re-mapped in order to produce a desired electromagnetic performance in the 3-D FSS. Thus, for some FSS designs, in order to achieve a desired electromagnetic performance in the 3-D panel, it is desirable to re-map the element spacing and/or orientation on some portions of the 2-D panel, while other portions of the 2-D panel can remain unchanged.
In addition to the 3D surfaces having continuous curvature implied above, this technique can also be applied to radomes having the shape commonly referred to as “chined.” (for example, the F-22). In this case, the FSS would be formed in two parts, and bonded at the “chine line”.
Design and construction of the FSS tends to be simpler and cheaper when working in the 2-D space. The mapping from two to three dimensions simplifies the process of designing and subsequent manufacture. For example, when using photo-etching processes to produce the FSS elements, the photo artwork can be developed in flat form and the elements can be photo-etched on flat panels of thermoplastic sheet stock (such as, for example, polyetherimide) using conventional etching equipment. In one embodiment, a conductive material (such as, for example, copper) is provided to the substrate by conductive bonding, electro-less plating, etc. In this manner, a desired 3-D part, with complex curvatures, can be designed and manufactured using 2-D techniques and yet when formed into a 3-D structure, the FSS elements will be properly positioned and oriented to provide the desired electromagnetic performance.
In a process block 103, a flat FSS panel is constructed using the element positions determined in the process block 102. In one embodiment, the flat FSS panels is constructed on a formable or thermo-formable substrate material such as, for example, plastic, thermoplastic, etc. The FSS elements can be created by printing, etching, deposition, etc. The FSS elements can be any type of FSS elements including, but not limited to, wire-type elements, slot-type elements, patch-type elements, etc. The FSS elements can be discrete resonant elements and/or extended elements (e.g., long wires, long slots, meanderlines, etc.). In one embodiment, FSS elements are provided to one side of a substrate material. In one embodiment, FSS elements are provided to both sides of a substrate material. In one embodiment, multiple substrate and FSS layers are produced and bonded or otherwise combined to form a flat multi-layer FSS structure.
The flat FSS layer (or structure) formed in the process block 103 is then formed into a desired shape in a process block 104. In one embodiment, the flat FSS layer or structure is thermoformed over a tool having the desired shape.
In an optional process block 105, two or more 3-D curved FSS layers produced according to the process of process blocks 101-104 are combined, along with other dielectric layers as desired, to form a radome or other desired structure, as shown in
The forming of FSS panels, as described herein, allows the element pattern as seams, such as, for example, the seam 410 shown in
Although described in terms of specific embodiments, other embodiments will be readily apparent to one of ordinary skill in the art from the above disclosure. For example, although the term substrate is used herein, one of ordinary skill in the art will recognize that the FSS (or FSS layers) can be provided to a substrate, a superstrate, or combinations of substrates and superstrates, etc. Thus, the invention herein is not limited to the disclosed embodiments, but rather by the claims that follow.
Number | Name | Date | Kind |
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5861860 | Stanek et al. | Jan 1999 | A |
6285332 | Chandler | Sep 2001 | B1 |
20050237267 | Brown et al. | Oct 2005 | A1 |
Number | Date | Country | |
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20070200787 A1 | Aug 2007 | US |