Claims
- 1. A non-paper, flexible, resilient, multilayer label adapted for application to a deformable thermoplastic package by in-mold labeling procedures, said label comprising:
- (a) An elastic, machineable, thermoplastic, stress-compensating stratum which comprises an unfoamed film having a Young's Modulus less than about 2800 Kg/cm.sup.2, said stress-compensating stratum having an upper and lower surface and a thickness in the range of from about 0.019 mm to about 0.076 mm;
- (b) a thermoplastic, low temperature heat-activated sealant layer generally coextensive with and laminated to the lower surface of said stress-compensating stratum; and
- (c) a thermoplastic label stratum which has a Young's Modulus greater than about 7030 Kg/cm.sup.2 and a smooth label surface, said label stratum being laminated to the upper surface of said stress-compensating stratum and having a thickness in the range of from about 0.0064 mm to about 0.025 mm.
- 2. The label of claim 1 wherein said stress-compensating stratum is a layer of ethylene-vinyl acetate copolymer comprising about 1% to about 12% by weight vinyl acetate.
- 3. The label of claim 1 wherein said layer comprises about 3% to about 6% by weight vinyl acetate.
- 4. The label of claim 3 wherein said stress-compensating stratum is less than about 0.04 mm in thickness.
- 5. The label of claims 1, 2, 3 or 4, wherein said label stratum includes a metalized surface for enhanced decorative appearance.
- 6. The label of claim 5 wherein said label stratum comprises polyethylene teraphthalate and the metalized surface is on the side opposite that laminated to said stress-compensating stratum.
- 7. The label of claim 5 wherein said low temperature sealant layer comprises an ethylene-vinyl acetate copolymer-wax composition.
- 8. The label of any of claims 1 3 and 5, wherein said low temperature sealant layer comprises an ethylene-vinyl acetate copolymer-wax composition.
- 9. The label of claim 8 wherein said composition comprises ethylenevinyl acetate copolymer, paraffin and microcrystalline wax wherein the copolymer comprises about 27% to about 30% by weight vinyl acetate and has a melt index of about 1.2, the paraffin has a melting point in the range of from about 66.degree. C. to about 68.degree. C., the microcrystalline wax has a melting point in the range of from about 68.degree. C. to about 71.degree. C. and the composition has an initial melting point in the range of from about 60.degree. C. to 63.degree. C.
- 10. The label of claim 8 wherein said composition comprises ethylene-vinyl acetate copolymer, paraffin and microcrystalline wax wherein the copolymer comprises about 27% to about 30% by weight vinyl acetate and has a melt index of about 1.2, the paraffin has a melting point in the range of from about 66.degree. C. to about 68.degree. C., the microcrystalline wax has a melting point in the range of from about 68.degree. C. to about 71.degree. C. and the composition has an initial melting point in the range of from about 60.degree. C. to 63.degree. C.
- 11. A package comprising a blow-molded, deformable thermoplastic bottle having a non-paper, flexible, resilient, multilayer label fastened thereto, said label having been applied by in-mold labeling procedures and comprising:
- (a) An elastic, machineable, thermoplastic, stress-compensating stratum which comprises an unfoamed film having a Young's Modulus less than about 2800 KG/cm.sup.2, said stress-compensating stratum having an upper and lower surface and a thickness in the range of from about 0.019 mm to about 0.076 mm;
- (b) a thermoplastic, low temperature heat-activated sealant layer generally coextensive with and laminated to the lower surface of said stress-compensating stratum; and
- (c) a thermoplastic label stratum which has a Young's Modulus greater than about 7030 Kg/cm.sup.2 and a smooth label surface, said label stratum being laminated to the upper surface of said stress-compensating stratum and having a thickness in the range of from about 0.0064 mm to about 0.025 mm.
Parent Case Info
This is a continuation-in-part of application Ser. No. 067,771, filed on July 8, 1987, now abandoned, which was a continuation-in-part of application Ser. No. 889,031, filed on July 23, 1986, now abandoned.
US Referenced Citations (14)
Foreign Referenced Citations (1)
Number |
Date |
Country |
747341 |
Nov 1966 |
CAX |
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
67771 |
Jul 1987 |
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Parent |
889031 |
Jul 1986 |
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