Claims
- 1. A thermoplastic molding composition consisting of:
- A) 70 to 99.5% by weight of a thermoplastic aromatic polyether sulfone or mixture of polyether sulfones; and
- B) 30 to 0.5% by weight of a hydrogenated nitrile rubber, which hydrogenated nitrile rubber is the product of at least 80% hydrogenation of the carbon to carbon double bonds of a statistical butadiene/acrylonitrile copolymer and;
- C. optionally one or more additives selected from lubricants, mold release agents, nucleating agents, stabilizers, fillers, reinforcing agents, flameproofing agents, and dyes.
- 2. The thermoplastic molding composition of claim 1, comprising 75 to 97.5% by weight of A) and 25 to 2.5% by weight of B).
- 3. The thermoplastic molding composition of claim 2, comprising 90 to 97.5% by weight of A) and 2.5 to 10% by weight of B).
- 4. The thermoplastic molding composition of claim 1, wherein the statistical butadiene/acrylonitrile copolymer contains 90 to 45% by weight butadiene and 10 to 55% by weight of acrylonitrile.
- 5. The thermoplastic molding composition of claim 1, wherein the statistical butadiene/acrylonitrile copolymer contains 85 to 50% by weight butadiene and 15 to 50% by weight of acrylonitrile.
- 6. The thermoplastic molding composition of claim 1, wherein the statistical butadiene/acrylonitrile copolymer contains 82 to 52% by weight butadiene and 18 to 48% by weight of acrylonitrile.
- 7. The thermoplastic molding composition of claim 1, wherein the statistical butadiene/acrylonitrile copolymer contains about 34.9% by weight acrylonitrile and is hydrogenated to about 99.7%.
- 8. The thermoplastic molding composition of claim 1, wherein the nitrile rubber is at least 90% hydrogenated.
- 9. The thermoplastic molding composition of claim 1, wherein the nitrile rubber is at least 97% hydrogenated.
- 10. The thermoplastic molding composition of claim 1, wherein the polyether sulfone is the polycondensation product of bis-2,2-(hydroxyphenyl)-propane and bis-(4-chlorophenyl)-sulfone.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3831373 |
Sep 1988 |
DEX |
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Parent Case Info
This application is a continuation of application Ser. No. 07/673,253 filed on Mar. 20, 1991, now abandoned, which is a continuation of application Ser. No. 07/402,686, filed Sep. 5, 1989, now abandoned.
US Referenced Citations (6)
Non-Patent Literature Citations (1)
Entry |
Data Base WPIL, No. 87-233 039 Derwent Publicaitons Ltd., London, G.B. 1987. |
Continuations (2)
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Number |
Date |
Country |
Parent |
673253 |
Mar 1991 |
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Parent |
402686 |
Sep 1989 |
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