Claims
- 1. Thermoplastic moulding compounds comprising
- A) 5 to 95% by weight of a thermoplastic polyamide,
- B) 95 to 5% by weight of a thermoplastic resin ester copolymer prepared from monomers consisting of
- B1) at least on monomer selected from styrenes, .alpha.-methyl styrenes, acrylonitrile, or methacrylonitrile, and
- B2) tert.butyl (meth)acrylate in quantities from 1 up to 20% by weight in the resin copolymer B) and
- c) up to 35% by weight of a rubber polymer for increasing the impact strength of the moulding compound.
- 2. The thermoplastic moulding compound as claimed in claim 1, wherein component B is present in an amount from 80 to 15% by weight.
- 3. The thermoplastic moulding compound as claimed in claim 1, wherein the compounds consists essentially of components A), B) and C).
- 4. Moulding compounds according to claim 1, characterised in that the resin polymers B) are copolymerised mixtures of two monomers B1) selected from styrene, .alpha.-methyl styrene and acrylonitrile and from 1 to 20%, by weight of tert.-butyl (meth)acrylate as monomer B2).
- 5. Moulding compounds according to claim 1, characterised in that component C) consists of homo-, co- or graft polymers based on diene monomer rubbers, olefine rubbers or acrylate rubbers.
- 6. Moulding compounds according to claim 1, wherein the thermoplastic polyamide (A) is either polyamide-6 or polyamide-6,6.
- 7. Moulding compounds as claimed in claim 1, wherein the polyamide (A) is from 5 to 45% by weight.
- 8. Moulding compounds as claimed in claim 1, wherein the polyamide (A) is from 10 to 40% by weight.
- 9. Moulding compounds as claimed in claim 1, wherein the polyamide (A) is from 15 to 40% by weight.
- 10. Thermoplastic moulding compound as claimed in claim 1, wherein there is 30 to 75 % by weight of styrene or .alpha.-methylstyrene or a mixture thereof; 20 to 40% by weight of acrylonitrile and 1.5 to 8% by weight of tert-butyl(meth)acrylate wherein the percentage by weight is based on the total amount of (B).
- 11. Moulding compounds as claimed in claim 1, wherein the particle size of component (C) is from 0.15 to 0.5 .mu.m.
- 12. Moulding compounds as claimed in claim 1, wherein the copolymer (B) is from 15 to 45% by weight.
- 13. Moulding compounds as claimed in claim 1, wherein the resin polymers (B) contain from 1 to 10% by weight of chemically incorporated monomers (B2).
- 14. Moulding compounds as claimed in claim 1, wherein the resin polymers (B) contain from 1.5 to 8% by weight of chemically incorporated monomers (B2).
- 15. Thermoplastic moulding compounds comprising:
- A) 10 to 95% by weight of a thermoplastic polyamide,
- B) 95 to 10% by weight of a thermoplastic resin ester copolymer prepared from monomers consisting of
- B1) at least on monomer selected from styrenes, .alpha.-methyl styrenes, acrylonitrile, or methacrylonitrile and
- B2) tert.butyl(meth)acrylate in quantities from 1 up to 20% by weight in the resin copolymer B) and
- c) up to 35% by weight of a rubber polymer for increasing the impact strength of the moulding compound.
- 16. Thermoplastic moulding compounds consisting of
- A) 5 to 95% by weight of a thermoplastic polyamide,
- B) 95 to 5% by weight of a thermoplastic resin ester copolymer prepared from monomers consisting of
- B1) at least on monomer selected from styrenes, .alpha.-methyl styrenes, acrylonitrile, methacrylonitrile, vinyl C.sub.1 to C.sub.4 carboxylic acid esters and acrylic or methacrylic acid esters of primary or secondary C.sub.1 to C.sub.10 alcohols and
- B2) at least one acrylic or methacrylic acid ester of tertiary C.sub.4 to C.sub.10 alcohols in quantities from 1 up to 20% by weight in the resin copolymer B) and
- c) up to 35% by weight of a rubber polymer for increasing the impact strength of the moulding compound.
- 17. Moulding compounds as claimed in claim 16, wherein the copolymer (B) is from 5 to 45% by weight.
- 18. Moulding compounds as claimed in claim 16, wherein the copolymer (B) is from 10 to 40% by weight.
- 19. The thermoplastic moulding compound as claimed in claim 16, wherein component B is present in an amount from 80 to 15% by weight.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3709599 |
Mar 1987 |
DEX |
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Parent Case Info
This is a continuation of Ser. No. 07/792,428, filed Nov. 15, 1991 now abandoned, which is a continuation of copending application Ser. No. 167,553, filed Mar. 14, 1988, abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2582659 |
Dec 1986 |
FRX |
Continuations (2)
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Number |
Date |
Country |
Parent |
792428 |
Nov 1991 |
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Parent |
167553 |
Mar 1988 |
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