Claims
- 1. A thermoplastic resin composition containing
- (I) 99 to 1 part by weight of a polyarylate resin and
- (II) 1 to 99 parts by weight of at least one resin selected from a polyamide resin and a polyarylene sulfide resin with
- (III) 0.1 to 100 parts by weight, based on 100 parts by weight of said resins (I)+(II), of a multi-phase structure thermoplastic resin which is a graft copolymer composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer composed of ethylene and glycidyl (meth)acrylate and 95 to 5% by weight of a vinyl polymer or copolymer obtained by polymerization of at least one kind of vinyl monomer selected from the group consisting of vinyl aromatic monomers, acrylonitrile and methacrylonitrile monomers, and vinyl ester monomers, at least one of said resin (III) components being in the state of a dispersion phase having a particle diameter of 0.001 to 10 .mu.m.
- 2. A thermoplastic resin composition according to claim 1 wherein said vinyl polymer or copolymer in said multi-phase structure thermoplastic resin has a number average polymerization degree of 5 to 10,000.
- 3. A thermoplastic resin composition according to claim 1 wherein said multi-phase structure thermoplastic resin is a grafted compound prepared by melting and mixing
- a graft polymerization precursor obtained by copolymerizing at least one vinyl monomer with at least one of radical polymerizable or copolymerizable organic peroxides represented by the following formulae (a) and (b) ##STR5## wherein R.sub.1 is a hydrogen atom or an alkyl group having 1 or 2 carbon atoms, each of R.sub.2 and R.sub.7 is a hydrogen atom or a methyl group, R.sub.6 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, each of R.sub.3, R.sub.4, R.sub.8 and R.sub.9 is an alkyl group having 1 to 4 carbon atoms, each of R.sub.5 and R.sub.10 is an alkyl group having 1 to 12 carbon atoms, a phenyl group, an alkyl-substituted phenyl group or a cycloalkyl group having 3 to 12 carbon atoms, m is 1 or 2, and n is 0, 1 or 2,
- in particles of an epoxy group-containing olefin copolymer.
- 4. A thermoplastic resin composition according to claim 1 wherein said vinyl monomer is vinyl acetate.
- 5. A thermoplastic resin composition according to claim 1 wherein said vinyl polymer or copolymer is obtained by polymerization of vinyl aromatic monomer or mixture of monomers in which the content of vinyl aromatic monomer is 50% by weight or more.
- 6. A thermoplastic resin composition according to claim 1 wherein said epoxy group-containing olefin copolymer is composed of 60 to 99.5% by weight of ethylene, 40 to 0.5% by weight of glycidyl acrylate or glycidyl methacrylate and 0 to 39.5% by weight of another unsaturated monomer.
- 7. A thermoplastic resin composition according to claim 1 wherein an inorganic filler (IV) is additionally blended in an amount of 1 to 150 parts by weight based on 100 parts by weight of said thermoplastic resin composition (I)+(II)+(III).
- 8. A thermoplastic resin composition according to claim 1 wherein said polyarylate resin is the reaction product of bisphenol A or bisphenol S, and a phthalic acid and has a molecular weight of 5,000 to 70,000.
- 9. A thermoplastic resin composition according to claim 8 wherein said polyamide resin is nylon 6 or nylon 6,6 and the polyarylene sulfide resin is the reaction product of paradichlorobenzene and sodium sulfide.
- 10. A thermoplastic resin composition according to claim 9 wherein said epoxy group-containing olefin copolymer is composed of 60 to 99.5% by weight of ethylene, 40 to 0.5% by weight of glycidyl (meth)acrylate and 0 to 39.5% by weight of another unsaturated monomer.
- 11. A thermoplastic resin composition according to claim 10 wherein said another unsaturated monomer is a different (meth) acrylate.
- 12. A thermoplastic resin composition according to claim 11 wherein said multi-structure thermoplastic resin contains 20 to 90% by weight of said epoxy group-containing olefin copolymer.
- 13. A thermoplastic resin composition according to claim 12 wherein the particle diameter is 0.01 to 5 microns.
Priority Claims (2)
Number |
Date |
Country |
Kind |
63-97649 |
Apr 1988 |
JPX |
|
63-99067 |
Apr 1988 |
JPX |
|
Parent Case Info
This is a continuation of application Ser. No. 07/340,048 filed on Apr. 18, 1989, abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4804707 |
Okamoto et al. |
Feb 1989 |
|
4861828 |
Waggoner |
Aug 1989 |
|
4942200 |
Flexman et al. |
Jul 1990 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
0304041 |
Feb 1989 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
340048 |
Apr 1989 |
|