Patent Application
20230133698
A thermoplastic resin composition and a molded product manufactured therefrom are disclosed.
Styrene-based resins, represented by acrylonitrile-butadiene-styrene copolymer (ABS) resins, are widely used in various applications due to their excellent moldability, mechanical properties, appearance, secondary processability, and the like.
A molded product produced using a styrene-based resin may be widely applied to various products that require painting/non-painting, for example, may be applied to various interior/exterior materials of automobiles and/or electronic devices.
Herein, in order to impart an aesthetic effect to the various interior/exterior materials, the painting may sometimes be conducted for the molded product manufactured by using the styrene-based resin. The painting may be performed in a generally widely used electrostatic painting method without particular limitations. This electrostatic painting method may be a method of applying electrical conductivity to the surface of the molded product and then proceeding with the painting, wherein in order to conduct the painting, the surface of the molded product should be pre-treated with a conductive primer and the like.
Since this application of the conductive primer increases the number of processes and manufacturing time, a method of further including various conductive materials (e.g., carbon nanotubes, etc.) and/or conductivity expression additives in the styrene-based resin to secure the electrical conductivity of the molded product itself at a predetermined level or higher has recently been suggested.
However, when the conductive materials and/or the conductivity expression additives are added to the styrene-based resin, physical properties of the styrene-based resin may be damaged, thereby unexpectedly deteriorating various physical properties.
Accordingly, development of a thermoplastic resin composition maintaining excellent electrical conductivity and balance of physical properties is required.
A thermoplastic resin composition having excellent electrical conductivity and balance of physical properties, and a molded product prepared therefrom are provided.
According to one embodiment, a thermoplastic resin composition includes, based on 100 parts by weight of a base resin including (A1) 20 to 40 wt % of a butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer; (A2) 30 to 75 wt % of an aromatic vinyl-vinyl cyanide copolymer; and (B) 5 to 40 wt % of a polyamide resin, (C) 1 to 15 parts by weight of a polyether ester amide block copolymer; and (D) 0.5 to 10 parts by weight of a N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer.
The (A1) butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may have a core-shell structure including a core of a butadiene-based rubbery polymer, and a shell formed by graft polymerization of an aromatic vinyl compound and a vinyl cyanide compound.
In the (A1) butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer, an average particle diameter of the butadiene-based rubbery polymer may be 0.2 to 1.0 μm.
The (A1) butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may be an acrylonitrile-butadiene-styrene graft copolymer.
The (A2) aromatic vinyl-vinyl cyanide copolymer may include 55 to 70 wt % of a component derived from an aromatic vinyl compound and 30 to 45 wt % of a component derived from a vinyl cyanide compound, based on 100 wt %.
The (A2) aromatic vinyl-vinyl cyanide copolymer may have a weight average molecular weight of 80,000 to 300,000 g/mol.
The (A2) aromatic vinyl-vinyl cyanide copolymer may be a styrene-acrylonitrile copolymer.
The (B) polyamide resin may include polyamide 6, polyamide 66, polyamide 46, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 61, polyamide 6T, polyamide 4T, polyamide 410, polyamide 510, polyamide 1010, polyamide 1012, polyamide 10T, polyamide 1212, polyamide 12T, polyamide MXD6, or a combination thereof.
The (C) polyether ester amide block copolymer may be a reaction mixture of an aminocarboxylic acid, lactam, or a diamine-dicarboxylic acid salt having 6 or more carbon atoms; polyalkylene glycol; and a dicarboxylic acid having 4 to 20 carbon atoms.
In the (D) N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may include an N-phenyl maleimide-styrene-maleic anhydride copolymer.
The (D) N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may have a glass transition temperature (Tg) of 145 to 200° C.
The thermoplastic resin composition may further include at least one additive selected from a nucleating agent, a coupling agent, a filler, a plasticizer, a lubricant, a mold release agent, an antibacterial agent, a heat stabilizer, an antioxidant, an ultraviolet stabilizer, a flame retardant, a colorant, and an impact modifier.
Meanwhile, according to another embodiment, a molded product manufactured from the aforementioned thermoplastic resin composition is provided.
The molded product may have a notch Izod impact strength of a ¼″-thick specimen according to ASTM D256 ranging from 20 to 60 kgf·cm/cm.
The molded product may have surface resistance of less than or equal to 1012 Ω/sq measured for a 100 mm×100 mm×20 mm specimen using a surface resistance measuring device (manufacturer: SIMCO-ION, model name: Worksurface Tester ST-4).
The molded product may have a heat deflection temperature (HDT) of 80 to 100° C. according to ASTM D648.
The thermoplastic resin composition according to an embodiment and a molded product using the same exhibit excellent electrical conductivity and balance of physical properties, and thus may be widely applied to molding various products used for painting and non-painting, and in particular, may also be usefully applied to molded products for painting requiring electrostatic painting.
Hereinafter, embodiments of the present invention are described in detail. However, these embodiments are just examples, and the present disclosure is not limited thereto and the present disclosure is defined by the scope of claims.
In the present invention, unless otherwise specified, the average particle diameter is a volume average diameter, and means a Z-average particle diameter measured using a dynamic light scattering analyzer.
In the present invention, the weight average molecular weight is measured by dissolving a powder sample in tetrahydrofuran (THF), and then using Agilent Technologies 1200 series Gel Permeation Chromatography (GPC) (polystyrene is used as a standard sample).
According to an embodiment, a thermoplastic resin composition includes, based on 100 parts by weight of a base resin including (A1) 20 to 40 wt % of a butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer; (A2) 30 to 75 wt % of an aromatic vinyl-vinyl cyanide copolymer; and (B) 5 to 40 wt % of a polyamide resin, (C) 1 to 15 parts by weight of a polyether ester amide block copolymer; and (D) 0.5 to 10 parts by weight of a N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer.
Hereinafter, each component of the thermoplastic resin composition is described in detail.
In an embodiment, the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer imparts excellent impact resistance to the thermoplastic resin composition. In an embodiment, the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may have a core-shell structure including a core of a butadiene-based rubbery polymer component and a shell formed on the core by a graft polymerization reaction of an aromatic vinyl compound and a vinyl cyanide compound.
The butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer according to an embodiment may be obtained by adding an aromatic vinyl compound and a vinyl cyanide compound to a butadiene-based rubbery polymer, and performing graft polymerization through conventional polymerization methods such as emulsion polymerization and bulk polymerization.
The butadiene-based rubbery polymer may be selected from a butadiene rubbery polymer, a butadiene-styrene rubbery polymer, a butadiene-acrylonitrile rubbery polymer, a butadiene-acrylate rubbery polymer, and a mixture thereof.
The aromatic vinyl compound may be selected from styrene, α-methylstyrene, p-methylstyrene, p-t-butylstyrene, 2,4-dimethylstyrene, chlorostyrene, vinyltoluene, vinylnaphthalene, and a mixture thereof.
The vinyl cyanide compound may be selected from acrylonitrile, methacrylonitrile, fumaronitrile, and a mixture thereof.
In the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer, an average particle diameter of the butadiene-based rubbery polymer may be, for example 0.2 to 1.0 μm, for example 0.2 to 0.8 μm, or for example 0.25 to 0.40 μm. When the above range is satisfied, the thermoplastic resin composition may exhibit excellent impact resistance and appearance characteristics.
Based on 100 wt % of the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer, the butadiene-based rubbery polymer may be included in an amount of 40 to 70 wt %. On the other hand, a weight ratio of the aromatic vinyl compound and the vinyl cyanide compound which are graft-polymerized on the core of the butadiene-based rubbery polymer component may be 6:4 to 8:2.
In an embodiment, the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may be an acrylonitrile-butadiene-styrene graft copolymer.
The butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer may be included in an amount of 20 to 40 wt %, for example 25 to 40 wt %, or for example 25 to 35 wt %, based on 100 wt % of the base resin.
When an amount of the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer in the base resin is less than 20 wt %, it is difficult to achieve excellent impact resistance, and when it exceeds 40 wt %, heat resistance and fluidity may decrease.
In an embodiment, the aromatic vinyl-vinyl cyanide copolymer may improve fluidity of the thermoplastic resin composition and maintain compatibility between components at a certain level.
In an embodiment, the aromatic vinyl-vinyl cyanide copolymer may have a weight average molecular weight (Mw) of greater than or equal to 80,000 g/mol, for example greater than or equal to 85,000 g/mol, or for example greater than or equal to 90,000 g/mol, and for example less than or equal to 300,000 g/mol, or for example less than or equal to 200,000 g/mol, for example 80,000 to 300,000 g/mol, or for example 80,000 to 200,000 g/mol.
In the present invention, the weight average molecular weight is measured by dissolving a powder sample in tetrahydrofuran (THF), and then using Agilent Technologies 1200 series Gel Permeation Chromatography (GPC) (polystyrene is used as a standard sample).
In an embodiment, the aromatic vinyl-vinyl cyanide copolymer may be prepared through conventional polymerization methods such as emulsion polymerization, suspension polymerization, solution polymerization, and bulk polymerization of an aromatic vinyl compound and a vinyl cyanide compound.
The aromatic vinyl compound may be selected from styrene, α-methylstyrene, p-methylstyrene, p-t-butylstyrene, 2,4-dimethylstyrene, chlorostyrene, vinyltoluene, vinylnaphthalene, and a mixture thereof.
The vinyl cyanide compound may be selected from acrylonitrile, methacrylonitrile, fumaronitrile, and a mixture thereof.
The aromatic vinyl-vinyl cyanide copolymer may include a component derived from the aromatic vinyl compound in an amount of, for example greater than or equal to 55 wt %, or for example greater than or equal to 60 wt % and for example less than or equal to 70 wt %, for example less than or equal to 67 wt %, for example 55 to 70 wt %, or for example 60 to 67 wt %, based on 100 wt %.
In addition, a component derived from the vinyl cyanide compound may be included in an amount of, for example, greater than or equal to 30 wt %, for example greater than or equal to 33 wt %, and for example less than or equal to 45 wt %, or for example less than or equal to 40 wt %, for example 30 to 45 wt %, or for example 33 to 40 wt % based on 100 wt % of the aromatic vinyl-vinyl cyanide copolymer.
In an embodiment, the aromatic vinyl-vinyl cyanide copolymer may be a styrene-acrylonitrile (SAN) copolymer.
In an embodiment, the aromatic vinyl-vinyl cyanide copolymer may be included in an amount of 30 to 75 wt %, for example 40 to 75 wt %, for example 45 to 75 wt %, for example 45 to 70 wt %, or for example 45 to 65 wt % based on 100 wt % of the base resin.
When the amount of the aromatic vinyl-vinyl cyanide copolymer is less than 30 wt %, moldability of the thermoplastic resin composition may be reduced, and when it exceeds 75 wt %, mechanical properties of the molded product using the thermoplastic resin composition may be reduced.
In an embodiment, the polyamide resin enables the thermoplastic resin composition to implement excellent electrical conductivity without adding an excessive amount of the polyether ester amide block copolymer.
In an embodiment, the polyamide resin may be various polyamide resins known in the art, and for example, an aromatic polyamide resin, an aliphatic polyamide resin, or a mixture thereof, but the present invention is not particularly limited thereto.
The aromatic polyamide resin is a polyamide including an aromatic group in a main chain, and may be a wholly aromatic polyamide, a semi-aromatic polyamide, or a mixture thereof.
The wholly aromatic polyamide refers to a polymer of an aromatic diamine and an aromatic dicarboxylic acid, and the semi-aromatic polyamide refers to inclusion of at least one aromatic unit and a non-aromatic unit between amide bonds. For example, the semi-aromatic polyamide may be a polymer of an aromatic diamine and an aliphatic dicarboxylic acid, or a polymer of an aliphatic diamine and an aromatic dicarboxylic acid.
Meanwhile, the aliphatic polyamide refers to a polymer of an aliphatic diamine and an aliphatic dicarboxylic acid.
Examples of the aromatic diamine may include, but are not limited to, p-xylenediamine and m-xylenediamine. In addition, these may be used alone or in combination of two or more.
Examples of the aromatic dicarboxylic acid may include phthalic acid, isophthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, (1,3-phenylenedioxy)diacetic acid, and the like, but are not limited thereto. In addition, these may be used alone or in combination of two or more.
Examples of the aliphatic diamine may include ethylenediamine, trimethylenediam ine, hexamethylenediam ine, dodecamethylenediam ine, piperazine, and the like, but are not limited thereto. In addition, these may be used alone or in combination of two or more.
Examples of the aliphatic dicarboxylic acid may include adipic acid, sebacic acid, succinic acid, glutaric acid, azelaic acid, dodecanedioic acid, dimer acid, cyclohexanedicarboxylic acid, and the like, but are not limited thereto. In addition, these may be used alone or in combination of two or more.
In an embodiment, the polyamide resin may include polyamide 6, polyamide 66, polyamide 46, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 61, polyamide 6T, polyamide 4T, polyamide 410, polyamide 510, polyamide 1010, polyamide 1012, polyamide 10T, polyamide 1212, polyamide 12T, polyamide MXD6, or a combination thereof.
In an embodiment, the polyamide resin may include at least polyamide 6.
In an embodiment, the polyamide resin may be included in an amount of 5 to 40 wt %, for example 5 to 35 wt %, for example 5 to 30 wt %, for example 5 to 25 wt %, or for example 5 to 20 wt % based on 100 wt % of the base resin.
When the amount of the polyamide resin satisfies the above range, the thermoplastic resin composition and molded product produced therefrom may exhibit improved rigidity, toughness, abrasion resistance, chemical resistance, and oil resistance due to the polyamide resin.
On the other hand, when the amount of the polyamide resin is less than 5 wt %, improved physical properties due to the polyamide resin may be difficult to obtain, when it exceeds 40 wt %, mechanical strength and/or heat resistance of the thermoplastic resin composition and a molded product using the same may decrease.
In an embodiment, the polyether ester amide block copolymer may exhibit predetermined electrical conductivity in the thermoplastic resin composition and the molded product produced therefrom.
In addition, the polyether ester amide block copolymer may allow the thermoplastic resin composition and the molded product produced therefrom to exhibit the aforementioned electrical conductivity as well as maintain excellent balance of physical properties.
In an embodiment, the polyether ester amide block copolymer may be, for example, a reaction mixture of an aminocarboxylic acid, lactam, or a diamine-dicarboxylic acid salt having 6 or more carbon atoms; polyalkylene glycol; and a dicarboxylic acid having 4 to 20 carbon atoms.
In an embodiment, the aminocarboxylic acid, lactam, or diamine-dicarboxylic acid salt having 6 or more carbon atoms may be aminocarboxylic acids such as ω-aminocaproic acid, ω-aminoenanthic acid, ω-aminocaprylic acid, ω-aminopel argonic acid, ω-aminocapric acid, 11-aminoundecanoic acid, and 12-aminododecanoic acid; lactams such as ε-caprolactam, enanthlactam, caprylactam, laurolactam and the like; and diamine-dicarboxylic acid salts such as a salt of hexamethylene diamine-adipic acid, a salt of hexamethylene diamine-isophthalic acid, and the like. For example, salts of 12-aminododecanoic acid, ε-caprolactam, hexamethylenediamine-adipic acid, and the like may be used.
In an embodiment, the polyalkylene glycol may be polyethylene glycol, polypropylene glycol, polytetramethylene glycol, polyhexamethylene glycol, a block or random copolymer of ethylene glycol and propylene glycol, a copolymer of ethylene glycol and tetrahydrofuran, and the like. For example, polyethylene glycol, a copolymer of ethylene glycol and propylene glycol, etc. may be used.
In an embodiment, examples of the dicarboxylic acid having 4 to 20 carbon atoms may include terephthalic acid, 1,4-cyclohexanedicarboxylic acid, sebacic acid, adipic acid, dodecanedioic acid, and the like.
In an embodiment, a bond between the aminocarboxylic acid, lactam, or diamine-dicarboxylic acid salt having 6 or more carbon atoms and the polyalkylene glycol may be an ester bond, a bond between the the aminocarboxylic acid, lactam, or diamine-dicarboxylic acid salt having 6 or more carbon atoms and the dicarboxylic acid having 4 to 20 carbon atoms may be an amide bond, and a bond between the polyalkylene glycol and the dicarboxylic acid having 4 to 20 carbon atoms may be an ester bond.
In an embodiment, the polyether ester amide block copolymer may be prepared by a known synthesis method, for example, a synthesis method disclosed in Japanese Patent Publication Sho 56-045419 and Japanese Patent Laid-Open Publication No. Sho 55-133424.
In an embodiment, the polyether ester amide block copolymer may include 10 to 95 wt % of the polyether ester block. Within the range, the thermoplastic resin composition may exhibit excellent electrical conductivity, heat resistance, and the like.
In an embodiment, the polyether ester amide block copolymer may be included in an amount of 1 to 15 parts by weight, for example 2 to 10 parts by weight, based on 100 parts by weight of the base resin. When the polyether ester amide block copolymer satisfies the aforementioned ranges, the thermoplastic resin composition and the molded product produced therefrom may maintain an excellent balance of physical properties and may simultaneously exhibit excellent electrical conductivity.
In an embodiment, the N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may maintain the balance of physical properties of the thermoplastic resin composition and the molded product manufactured therefrom at an appropriate level. Specifically, the N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may excellently maintain various physical properties (e.g., impact resistance, heat resistance, etc.), which may be deteriorated according to the addition of the polyether ester amide block copolymer.
In an embodiment, the N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may be prepared by a polymerization reaction of a mixture of an N-substituted maleimide, an aromatic vinyl compound, and a maleic anhydride or an imidization reaction of an aromatic vinyl compound and a maleic anhydride copolymer.
Examples of the N-substituted maleimide may include N-methyl maleimide, N-ethyl maleimide, N-butyl maleimide, N-phenyl maleimide, N-cyclohexyl maleimide, or a combination thereof.
The aromatic vinyl compound may be selected from styrene, α-methylstyrene, p-methylstyrene, p-t-butylstyrene, 2,4-dimethylstyrene, chlorostyrene, vinyltoluene, vinylnaphthalene, and a mixture thereof, and preferably, styrene.
In an embodiment, the N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may include 10 to 55 wt %, for example 15 to 55 wt %, or for example 15 to 50 wt % of a component derived from the N-substituted maleimide, based on 100 wt %.
Meanwhile, in an embodiment, the N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may include 40 to 80 wt % of a component derived from the aromatic vinyl compound and 1 to 10 wt % of a component derived from the maleic anhydride based on 100 wt %.
In an embodiment, when the component derived from N-substituted maleimide in the N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer is less than 10% by weight, an effect of maintaining a balance of physical properties by the N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer is difficult to be exhibited, and when it exceeds 55 wt %, appearance characteristics of the thermoplastic resin composition and the molded product manufactured therefrom may be greatly deteriorated.
The N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may have a glass transition temperature (Tg) of, for example, 145 to 200° C., for example, 155 to 200° C., or for example, 165 to 200° C.
The N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may have a weight average molecular weight (Mw) measured by GPC of 10,000 to 300,000 g/mol, or for example, 15,000 to 150,000 g/mol. Within the above range, a balance of all physical properties of the thermoplastic resin composition and a molded product manufactured therefrom may be excellently maintained.
The N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer may be included in an amount of 0.5 to 10 parts by weight, for example 0.5 to 9 parts by weight, for example 0.5 to 8 parts by weight, for example, 1 to 8 parts by weight, for example 1 to 7 parts by weight, for example, 1 to 6 parts by weight, for example, or 1 to 5 parts by weight based on 100 parts by weight of the base resin.
When the amount of the N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer satisfies the aforementioned range, the thermoplastic resin composition and a molded product manufactured therefrom may exhibit excellent electrical conductivity while maintaining an excellent balance of physical properties.
In addition to the components (A) to (D), the thermoplastic resin composition according to an embodiment may further include one or more additives in order to balance each property under the condition that both excellent electrical conductivity and a balance of physical properties are maintained, or depending on the end use of the thermoplastic resin composition.
Specifically, the additive may be a nucleating agent, a coupling agent, a filler, a plasticizer, a lubricant, a mold release agent, an antibacterial agent, a heat stabilizer, an antioxidant, a UV stabilizer, a flame retardant, a colorant, an impact modifier, etc., and these may be used alone or in combination of two or more.
The additive may be appropriately included within a range that does not impair the physical properties of the thermoplastic resin composition, and specifically, may be included in an amount of less than or equal to 20 parts by weight based on 100 parts by weight of a base resin, but is not limited thereto.
The thermoplastic resin composition according to the present invention may be prepared by a known method for preparing a thermoplastic resin composition.
For example, the thermoplastic resin composition according to the present invention may be prepared in the form of pellets by simultaneously mixing the constituents of the present invention and other additives and then melt-kneading the mixture in an extruder.
A molded product according to an embodiment of the present invention may be manufactured from the aforementioned thermoplastic resin composition.
In an embodiment, the molded product may have a notched Izod impact strength of a ¼″-thick specimen according to ASTM D256 ranging from 13 to 60 kgf·cm/cm, for example 13 to 50 kgf·cm/cm, for example 13 to 40 kgf·cm/cm, for example 13 to 35 kgf·cm/cm, for example 14 to 30 kgf·cm/cm, or for example 15 to 25 kgf·cm/cm.
In an embodiment, the molded product has surface resistance measured on a 100 mm×100 mm×20 mm specimen using a surface resistance measuring device (manufacturer: SIMCO-ION, model name: Worksurface Tester ST-4) of less than or equal to 1012 Ω/sq, for example less than or equal to 1011.5 Ω/sq, for example less than or equal to 1011 Ω/sq, for example less than or equal to 1010.5 Ω/sq, or for example less than or equal to 1010 Ω/sq.
In an embodiment, the molded product may have a heat deflection temperature (HDT) according to ASTM D648 of 80 to 100° C., for example 80 to 95° C., or for example 80 to 90° C.
As such, since the thermoplastic resin composition has excellent impact resistance, electrical conductivity, and heat resistance, it may be widely applied to various products used for painting and non-painting, and in particular, may also be usefully applied to molded products for painting requiring electrostatic painting.
Hereinafter, the present invention is illustrated in more detail with reference to examples and comparative examples. However, the following examples and comparative examples are provided for the purpose of descriptions and the present invention is not limited thereto.
The thermoplastic resin compositions according to Examples 1 and 2 and Comparative Examples 1 to 3 were prepared according to each component content ratio shown in Table 1.
In Table 1, (A1), (A2), and (B) included in a base resin are expressed by wt % based on the total weight of the base resin, and (C) and (D) also included in the base resin are expressed by parts by weight based on 100 parts by weight of the base resin.
The components shown in Table 1 were dry-mixed, and then quantitatively and continuously fed into a hopper of a twin-screw extruder (L/D=44, Φ=45 mm) and melted/kneaded. Then, the thermoplastic resin compositions pelletized through a twin-screw extruder were dried at about 80° C. for about 4 hours, and then specimens for physical property evaluation were prepared using a 120-ton injection molding machine with a cylinder temperature of about 240° C. and a mold temperature of about 60° C.
Each component provided in Table 1 is illustrated as follows.
Acrylonitrile-butadiene-styrene graft copolymer (Lotte Chemical Corp.) including about 58 wt % of a core (average particle diameter: about 0.25 μm) made of a butadiene rubbery polymer and a shell formed by graft-polymerization of acrylonitrile and styrene (in a weight ratio of acrylonitrile: styrene=about 2.5:about 7.5) on the core
Styrene-acrylonitrile copolymer (Lotte Chemical Corp.) copolymerized from a monomer mixture of about 34 wt % of acrylonitrile and about 66 wt % of styrene and having a weight average molecular weight of about 85,000 g/mol
Polyamide 6 resin (EN-300, KP Chemtech) having a melting point of about 223° C. and relative viscosity of about 2.3
Polyamide 6-polyethylene oxide block copolymer (PA6-b-PEO) (PELECTRON AS, Sanyo Chemical, Ltd.)
N-phenyl maleimide-styrene-maleic anhydride copolymer having a glass transition temperature (Tg) of about 185° C. (MS-NJ, Denka)
Experiment results are provided in Table 2.
(1) Surface resistance (unit: Ω/sq): A specimen with a size of 100 mm×100 mm×20 mm was measured with respect to surface resistance by using a surface resistance measuring device (model name: Worksurface Tester ST-4, manufacturer: SIMCO-ION).
(2) Heat resistance (unit: ° C.): A heat deflection temperature (HDT) was measured according to ASTM D648.
(3) Impact resistance Type-I (unit: kgf·cm/cm): A specimen with a thickness of ¼″ was measured with respect to notched Izod impact strength according to ASTM D256.
(4) Impact resistance Type-II (unit: N): A specimen having a boss shape (protruding portion external diameter: 6 mm, protruding portion internal diameter: 3.5 mm, protruding portion height: 20 mm) was measured with respect to boss Impact strength according to the following experiment method.
Specifically, an impact hammer of about 420 g was used to apply an impact to a side of the specimen, which had a boss shape, wherein the impact was set at energy of 1.8 J.
Referring to Tables 1 and 2, Examples 1 to 4 used the butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer, the aromatic vinyl-vinyl cyanide copolymer, the polyamide resin, the polyether ester amide block copolymer, and the N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer in optimal amounts, providing a thermoplastic resin composition and a molded product using the same showing excellent electrical conductivity, impact resistance, and heat resistance, compared with the comparative examples.
While this invention has been described in connection with what is presently considered to be practical example embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2020-0039187 | Mar 2020 | KR | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/KR2021/003764 | 3/26/2021 | WO |
