Claims
- 1. A thermoplastic resin composition comprising:
- (A) a dipersing phase of 1-65 percent by weight of polyphenylene ether having a reduced viscosity of 0.4-0.60 measured in chloroform solution at 25.degree. C. obtained by oxidation polymerization of at least one phenyl compound represented by the formula: ##STR7## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represent a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residues wherein at least one of R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 is a hydrogen atom,
- (B) a matrix phase of 35-98.9% by weight of polyamide resin, and
- (c) 0.1-50% by weight of a mutual compatibilizer compatible with (A) and (B),
- wherein the average particle size diameter in said dispersing phase (A) is 0.1-1.8 microns, and said mutual compatibilizer (C) is at least one member selected from the group consisting of (C)(1) compound containing, in the molecule, at least one carboxyl group, acid anhydride group, acid amide group, imide group, carboxylate group, amino group, isocyanate group, oxazoline ring-containing group and hydroxyl group, (C)(2) epoxy compound and (C)(3) modified rubber-like material, obtained by modifying a rubber-like material with at least one compound selected from (C)(1) and (C)(2), and
- wherein the thermoplastic composition is obtained by kneading firstly said dispersing phase (A) with said mutual compatibilizer (C) and then thereafter said matrix phase (B) therewith.
- 2. A resin composition according to claim 1 wherein said dispersing phase (A) said polyphenylene ether has a reduced viscosity of 0.45-0.55.
- 3. A resin composition according to claim 1 wherein the epoxy compound (C)(2) is an unsaturated epoxy compound.
- 4. A resin composition according to claim 1 wherein said compound (C)(1) is at least one member selected from the group consisting of acrylic acid, maleic acid, fumaric acid, maleic anhydride, maleic hydrazide and maleimide.
- 5. A resin composition according to claim 3 wherein said compound (C)(1) is at least one member of the group consisting of acrylic acid, maleic acid, fumaric acid, maleic anhydride, maleic hydrazide and maleimide.
- 6. A resin composition according to claim 1 wherein said epoxy compound (C)(2) is an epoxy resin.
- 7. A resin composition according to claim 1 wherein said epoxy compound (C)(2) is at least one member of the group consisting of (i) of copolymer comprising ethylene and an unsaturated epoxy compound and (ii) a copolymer comprising ethylene, an unsaturated epoxy compound and an ethylenically unsaturated compound having more than two carbon atoms.
- 8. A resin composition according to claim 1 wherein amount of said dispersing phase (A) is 1-65% by weight, that of said matrix phase (B) is 35-98.9% by weight and, that of said mutual compatibilizer (C) is 0.1-50% by weight.
Priority Claims (1)
Number |
Date |
Country |
Kind |
61-233721 |
Sep 1986 |
JPX |
|
RELATED APPLICATION
This is a continuation of U.S. application of U.S. Ser. No. 07/102,528 filed Sep. 29, 1987, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3306875 |
Hay |
Feb 1967 |
|
4315086 |
Ueno et al. |
Feb 1982 |
|
Foreign Referenced Citations (6)
Number |
Date |
Country |
0030417 |
Jun 1981 |
EPX |
231626 |
Aug 1987 |
EPX |
237187 |
Sep 1987 |
EPX |
244090 |
Nov 1987 |
EPX |
2354368 |
Jan 1978 |
FRX |
2372864 |
Jun 1978 |
FRX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
102528 |
Sep 1987 |
|