Claims
- 1. A thermoplastic resin polymer having improved moldability and heat resistance, comprising a polyphenylene ether and a low molecular weight styrene polymer bonded to said polyphenylene ether, said low molecular weight styrene polymer having a number average polymerization degree of from 5.5 to 8.0 and being present in an amount of from 0.5 to 3.0% by weight, based on the weight of said polyphenylene ether.
- 2. The thermoplastic resin polymer according to claim 1, wherein the polyphenylene ether has an intrinsic viscosity of from 0.30 to 0.75 dl/g as measured at 30.degree. C. in chloroform.
- 3. The thermoplastic resin polymer according to claim 1, wherein the low molecular weight styrene polymer is a low molecular weight styrene homopolymer.
- 4. The thermoplastic resin polymer according to claim 1, wherein the polyphenylene ether is poly(2,6-dimethyl-1,4-phenylene)ether.
Priority Claims (2)
Number |
Date |
Country |
Kind |
62-303365 |
Dec 1987 |
JPX |
|
62-329440 |
Dec 1987 |
JPX |
|
Parent Case Info
This is a continuation of application Ser. No. 205,984, filed Jun. 13, 1989, now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (5)
Number |
Date |
Country |
4540551 |
Oct 1967 |
JPX |
4632427 |
Apr 1968 |
JPX |
54-111177 |
Aug 1979 |
JPX |
637204 |
Apr 1981 |
JPX |
63-101451 |
Oct 1987 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Chemical Abstracts, vol. 83, 1975, p. 36, abstract No. 11363k. |
Continuations (1)
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Number |
Date |
Country |
Parent |
205984 |
Jun 1988 |
|