Claims
- 1. A method for the application of a coating or ink to glass, ceramic or other hard surface which comprises
- (1) heating a composition which comprises
- (a) a blend of epoxy resins selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, epoxy cresyl novolac resin and epoxy phenol novolac resin, the said epoxy resins having an epoxide equivalent weight of 150 to 2000 and the blend having a viscosity, determined by Brookfield HBT Viscometer at 200.degree. F. 5 RPM, in the range of 500 to 15,000 cps,
- (b) a dicyandiamide curing agent for said epoxy blend which provides a latency period of about 30 minutes at a screening temperature of about 120.degree.-270.degree. F.,
- (c) an adhesion promoter in an amount up to about 5% by weight of the composition,
- (d) a wetting agent in an amount up to about 5% by weight of the composition, and
- (e) a rheological modifier in an amount up to about 10% by weight of the composition, the melting or softening point of said composition being in the range of about 10.degree. C. to about 120.degree. C.
- to the melting or softening point of the composition,
- (2) applying said melted or softened composition through a heated metal screen to a glass, ceramic or other hard surface, removing said metal screen, and
- (3) heating the resultant coating on the said surface to the curing temperature of the composition and maintaining at said temperature until curing is complete.
- 2. A method according to claim 1, wherein the composition additionally contains at least one of the following components
- (1) a pigment which is stable at the curing temperature of the composition in an amount of up to 50% by weight of the composition,
- (2) a filler in an amount of up to 10% by weight of the composition,
- (3) a diluent in an amount of up to 15% by weight of the composition, and
- (4) a wax in an amount of up to 10% by weight of the composition.
Parent Case Info
This application is a division of application Ser. No. 07/998,628, filed Dec. 30, 1992, now U.S. Pat. No. 5,346,933.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5100934 |
Glesias |
Mar 1992 |
|
5346933 |
Krell et al. |
Sep 1994 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
0325146 |
Jul 1989 |
EPX |
1576330 |
Oct 1980 |
GBX |
Non-Patent Literature Citations (4)
Entry |
Lee & Neville, "Epoxy Resins", 1957, pp. 20 and 228. |
Nitto Denki Kogyo K. K., Patent Abstracts of Japan, vol. 8, No. 134 (C-230) (1571) 21 Jun. 1984 JP-A-59 045 367. |
Nitto Denki Kogyo K. K., Patent Abstracts of Japan, vol. 8, No. 222 (C-246) (1659) 9 Oct. 1984 JP-A-59 108 072. |
Lee et al., Epoxy Resins, McGraw-Hill Book Co., Inc., 1957, pp. 20 and 28. |
Divisions (1)
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Number |
Date |
Country |
Parent |
998628 |
Dec 1992 |
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