Claims
- 1. The process for preparing a thermoset polymer comprising reacting a compound containing a plurality of oxazoline groups with an alkenylphosphonic acid and a reactive compound which is a polyphenolic at a temperature in the range of from about room temperature to about 300.degree. C.
- 2. The process of claim 1 wherein the compound containing a plurality of oxazoline groups is one containing at least two 2-oxazole groups per molecule.
- 3. The process of claim 2 wherein the alkenyl phosphonic acid is one having the formula ##STR2## wherein R, R', and R" independently represent hydrogen, an alkyl group having from 1 to 10 carbon atoms, an aryl group having from 6 to 12 carbon atoms or an alkaryl group having from 7 to 15 carbon atoms.
- 4. The process of claim 3 wherein the amounts of compound containing a plurality of oxazoline groups to alkenyl phosphonic acid is in the range of from 99/1 to 50/50 by weight.
- 5. The process of claim 4 wherein the equivalent ratio of the compound containing a plurality of oxazoline groups to the reactive material is in the range of 1:1 to 10.1.
- 6. The process of claim 4 wherein the compound containing a plurality of oxazoline groups is isophthaloyl bis-oxazoline.
- 7. The process of claim 4 wherein the reactive compound is resorcinol.
- 8. The process of claim 4 wherein the reactive compound as a phenol-formaldehyde condensation novalak.
- 9. The thermoset polymer prepared by the process of claim 1.
Parent Case Info
This is a continuation of copending U.S. patent application Ser. No. 858,781, filed 05/02/86, now U.S. Pat. No. 4,675,371.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
4675371 |
Goel |
Jun 1987 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
858781 |
May 1986 |
|