Claims
- 1. A thermosetting composition comprising (a) about 10 to about 60 percent by weight of a polymerizable ethylenically unsaturated monomer selected from vinyl substituted mononuclear aromatic hydrocarbons and halo and alkyl derivatives thereof, alkyl esters of alpha, beta-ethylenically unsaturated monocarboxylic acids and halo derivatives thereof, and allyl esters and ethers, (b) about 1 to about 40 percent by weight of ##STR3## where R.sup.1 and R.sup.2 are independently selected from hydrogen or C.sub.1-3 alkyl groups, and in which the phenyl group may be substituted with aliphatic, alicyclic, and aromatic groups and up to three halogen or hydroxyl groups, and (c) about 5% to about 89% by weight unsaturated polyester prepared by polycondensation of polycarboxylic acid derivatives, one of which must be an alpha, beta-ethylenically unsaturated polycarboxylic acid, and polyols.
- 2. A composition of claim 1 wherein the polymerizable olefinic monomer comprises vinyl toluene.
- 3. A composition of claim 1 wherein the polymerizable olefinic monomer comprises styrene.
- 4. A composition of claim 1 wherein (b) is N-phenylmaleimide.
- 5. A thermosetting composition comprising, by weight,
- (a) about 10% to about 40% vinyl toluene,
- (b) about 1% to about 20% N-phenyl-maleimide, and
- (c) about 40% to about 89% of an unsaturated polyester resin.
- 6. A cured composition of claim 5 having an improved heat distortion temperature under load as compared to a similar composition not containing N-phenylmaleimide.
- 7. A thermosetting composition comprising, by weight, (a) about 10% to about 40% styrene (b) about 1% to about 20% N-phenylmaleimide (c) about 40% to about 89% of an unsaturated polyester resin.
- 8. A cured composition of claim 7 having an improved heat distortion temperature under load compared to a similar composition without N-phenylmaleimide.
- 9. A cured composition of claim 7 having improved dielectric strength stability compared to a similar composition without N-phenylmaleimide.
Parent Case Info
This is a continuation-in-part of our co-pending application Ser. No. 167,674, filed Mar. 7, 1988 (now abandoned), also entitled "Thermosetting Composition From Maleimide, Olefinic Monomer and Unsaturated Polyester".
US Referenced Citations (33)
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
167674 |
Mar 1988 |
|