Claims
- 1. A thermosetting resin composition suitable for integral bonding by molding to a part of a cured silicone rubber without intervention of an adhesive layer at the interface, which comprises, as a uniform blend:
- (a) 100 parts by weight of an unsaturated polyester resin;
- (b) from 20 to 50 parts by weight of an ethylenically unsaturated polymerizable compound;
- (c) from 5 to 30 parts by weight of an epoxy resin;
- (d) from 2 to 20 parts by weight of a melamine resin;
- (e) from 0.1 to 2 parts by weight of a radical-reactive curing agent; and
- (f) from 0.1 to 2 parts by weight of an acidic catalyst.
- 2. The thermosetting resin composition as claimed in claim 1 in which the ethylenically unsaturated polymerizable compound as the component (b) is selected from the group consisting of styrene, vinyl toluene, diallyl phthalate and triallyl cyanurate.
- 3. The thermosetting resin composition as claimed in claim 1 in which the radical-reactive curing agent as the component (e) is an organic peroxide selected from the group consisting of ketone peroxides, peroxy ketals, hydroperoxides, dialkyl peroxides, diacyl peroxides and peroxy esters.
Parent Case Info
This is a divisional application of Ser. No. 08/758,398, filed Nov. 29, 1996, now U.S. Pat. No. 5,705,275.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
3508951 |
Shimp |
Apr 1970 |
|
Foreign Referenced Citations (4)
Number |
Date |
Country |
0 031 434 |
Jul 1981 |
EPX |
0 168 955 |
Jan 1986 |
EPX |
2254343 |
Nov 1972 |
DEX |
2014159 |
Aug 1979 |
GBX |
Non-Patent Literature Citations (3)
Entry |
Database WPI, Week 9418, AN 94-146884 (abstract of JP 06-060767) (Mar. 1994). |
Database WPI, Week 8222, AN 82-44511E (abstract of JP 57-066376) (Apr. 1982). |
Database WPI, Week 8929, AN 89-211545 (abstract of JP 01-149862) (Jun. 1989). |
Divisions (1)
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Number |
Date |
Country |
Parent |
758398 |
Nov 1996 |
|