Claims
- 1. An aqueous thermosetting resin composition comprising an aqueous resin (W- 1) obtained by neutralizing with a basic compound part or all of the carboxyl groups of a vinyl polymer (A-2) having at least one 2-oxo-1,3-dioxolan-4-yl group and at least one carboxyl group together on the polymer, and then dispersing or dissolving the resulting neutralized polymer in water; and a ring opening curing catalyst (B).
- 2. The aqueous thermosetting resin composition of claim 1 further comprising an aqueous resin (W-2) which is obtained by neutralizing all or part of the carboxyl groups of a compound (c-2) having at least two carboxyl groups, with a basic compound, and dispersing or dissolving the resulting neutralized compound in water.
- 3. An aqueous thermosetting resin composition comprising (I) an aqueous resin (W-3) obtained by dispersing in water a vinyl polymer (A-1) having at least one 2-oxo-1,3-dioxolan-4-yl group on the polymer, or an aqueous solution or aqueous dispersion (W-4) of a compound (A-3) which is different from the above (A-1) and having at least two 2-oxo-1,3-dioxolan-4-yl groups or a combination of (W-3) and (W-4); (II) an aqueous resin (W-2) obtained by neutralizing with a basic compound part or all of the carboxyl groups of a compound (c-2) having at least two carboxyl groups and dispersing or dissolving the resulting neutralized compound in water; and (III) a ring opening curing catalyst (B).
- 4. The aqueous thermosetting resin composition of claim 1 further comprising (a) an aqueous resin (W-3), which is obtained by dispersing in water a vinyl polymer (A-1) having at least one 2-oxo-1,3-dioxolan-4-yl group on the polymer, or (b) an aqueous solution or aqueous dispersion (W-4) of a compound (A-3), which is different from (A-1), and has at least two 2-oxo-1,3-dioxolan-4-yl groups, or a combination of (a) and (b).
- 5. The aqueous thermosetting resin composition of claim 1 further comprising a curing agent (D), which is capable of reacting with a hydroxyl group.
- 6. The aqueous thermosetting resin composition of claim 2 further comprising a curing agent (D), which is capable of reacting with a hydroxyl group.
- 7. The aqueous thermosetting resin composition of claim 3 further comprising (IV) a curing agent (D), which is capable of reacting with a hydroxyl group.
- 8. The aqueous thermosetting resin composition of claim 1, further comprising (a) an aqueous resin (W-3), which is obtained by dispersing in water a vinyl polymer (A-1) having at least one 2-oxo-1,3-dioxolan-4-yl group on the polymer, or (b) an aqueous solution or aqueous dispersion (W-4) of a compound (A-3), which is different from (A-1) and has at least two 2-oxo-1,3-dioxolan-4-yl groups or a combination of (a) and (b); and a curing agent (D), which is capable of reacting with a hydroxyl group.
- 9. The aqueous thermosetting resin composition of claim 1 wherein the curing catalyst (B) is a cyclocarbonate group ring opening catalyst or an epoxy group ring opening catalyst.
- 10. The aqueous thermosetting resin composition of claim 1 wherein the curing catalyst (B) is an epoxy group ring opening catalyst present in an amount of up to about 5 parts by weight per 100 parts by solid weight of the vinyl polymer (A-2).
- 11. The aqueous thermosetting resin composition of claim 1 wherein the curing catalyst (B) is a cyclocarbonate group ring opening catalyst present in an amount of from about 0.01 to about 5 parts per weight per 100 parts by solid weight of the vinyl polymer (A-2).
- 12. The aqueous thermosetting resin composition of claim 5 wherein the curing agent (D) is present in an amount such that the ratio of (D): vinyl polymer (A-2) is 1 to 40 parts by weight curing agent (D) per 10 to 90 parts by weight vinyl polymer (A-2).
- 13. The aqueous thermosetting resin composition of claim 1 wherein at least 20% of the carboxyl groups on the vinyl polymer (A-2) are neutralized.
- 14. The aqueous thermosetting resin composition of claim 2 wherein the curing catalyst (B) is present in an amount of 0.2 to 60 mmol per 100 g of solid components of the composition and components (W-1) and (W-2) are present in a solid weight ratio of 95:5 to 5:95.
- 15. The aqueous thermosetting resin composition of claim 3 wherein the curing catalyst (B) is present in an amount of 0.2 to 60 mmol per 100 g of the solid components of the composition and components (W-3) and (W-4) or (W-2), or a combination of (W-4) and (W-2) are present in a solid component weight ratio of 97:3 to 3:97.
- 16. The aqueous thermosetting resin composition of claim 4 wherein the curing catalyst (B) is present in an amount of from 0.2 to 60 mmol per 100 g of the solid components of the composition and components (W-1) and (W-3) or (W-4), or a combination of (W-3) and (W-4) are present in a solid component weight ratio of 97:3 to 3:97.
Priority Claims (3)
Number |
Date |
Country |
Kind |
1-254803 |
Sep 1989 |
JPX |
|
4-180604 |
Jul 1990 |
JPX |
|
90310562 |
Sep 1990 |
EPX |
|
Parent Case Info
This application is a division of application Ser. No. 08/192,582, filed, Feb. 7, 1994, which is a continuation-in-part application of Ser. No. 07/885,544, filed on May 19, 1992, now abandoned, which is a continuation-in-part application of Ser. No. 07/798,989, filed on Dec. 2, 1991, now abandoned, which is continuation application of Ser. No. 07/589,211, filed on Sep. 28, 1990, now abandoned.
US Referenced Citations (9)
Foreign Referenced Citations (4)
Number |
Date |
Country |
1088 |
Mar 1979 |
EPX |
0272664 |
Jun 1988 |
EPX |
0358358 |
Mar 1990 |
EPX |
0394786 |
Oct 1990 |
EPX |
Non-Patent Literature Citations (2)
Entry |
Chemical Abstracts, vol. 112, No. 6, 5 Feb. 1990, Columbus, Ohio, US, Abstract #38280K, "Storage-stable low-temperature-curable coating composition" p. 138. |
Chemical Abstracts, vol. 112, No. 4, 22 Jan. 1990, Columbus, Ohio, US, Abstract #22453H, "Low-temperature-curable coating composition", p. 89. |
Divisions (1)
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Number |
Date |
Country |
Parent |
192582 |
Feb 1994 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
589211 |
Sep 1990 |
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Continuation in Parts (2)
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Number |
Date |
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Parent |
885544 |
May 1992 |
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Parent |
798989 |
Dec 1991 |
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